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公开(公告)号：US08853560B2
公开(公告)日：2014-10-07
申请号：US13411005
申请日：2012-03-02
申请人： Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
发明人： Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
CPC分类号： H05K1/0236 , H05K1/0219 , H05K1/0222 , H05K1/115 , H05K2201/09309 , H05K2201/09536 , H05K2201/09618 , H05K2201/09718 , H05K2201/09781 , Y10T29/4913 , Y10T29/49165 , Y10T428/12465
摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.
摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。
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公开(公告)号：US20120162934A1
公开(公告)日：2012-06-28
申请号：US13411005
申请日：2012-03-02
申请人： Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
发明人： Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
IPC分类号： H05K7/00
CPC分类号： H05K1/0236 , H05K1/0219 , H05K1/0222 , H05K1/115 , H05K2201/09309 , H05K2201/09536 , H05K2201/09618 , H05K2201/09718 , H05K2201/09781 , Y10T29/4913 , Y10T29/49165 , Y10T428/12465
摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.
摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。
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公开(公告)号：US20080264685A1
公开(公告)日：2008-10-30
申请号：US12010437
申请日：2008-01-24
申请人： Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
发明人： Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
CPC分类号： H05K1/0236 , H05K1/0219 , H05K1/0222 , H05K1/115 , H05K2201/09309 , H05K2201/09536 , H05K2201/09618 , H05K2201/09718 , H05K2201/09781 , Y10T29/4913 , Y10T29/49165 , Y10T428/12465
摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.
摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。
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公开(公告)号：US08153907B2
公开(公告)日：2012-04-10
申请号：US12010437
申请日：2008-01-24
申请人： Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
发明人： Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
IPC分类号： H05K1/11
CPC分类号： H05K1/0236 , H05K1/0219 , H05K1/0222 , H05K1/115 , H05K2201/09309 , H05K2201/09536 , H05K2201/09618 , H05K2201/09718 , H05K2201/09781 , Y10T29/4913 , Y10T29/49165 , Y10T428/12465
摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.
摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。
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公开(公告)号：US08077000B2
公开(公告)日：2011-12-13
申请号：US12232463
申请日：2008-09-17
IPC分类号： H01P1/201
CPC分类号： H01P3/088 , H01L2224/16225 , H01P1/2005 , H05K1/0236 , H05K1/0237 , H05K3/429 , H05K2201/09309 , H05K2201/09663 , H05K2201/09681
摘要： Disclosed are an electromagnetic bandgap structure and a printed circuit board. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer; a plurality of conductive plates; a stitching via, configured to pass through the dielectric layer and have a part electrically connecting the conductive plates to each other by connecting through a planar surface that is different from a planar surface of the conductive plates, and a through via. Here, the dielectric layer, the conductive plates and the stitching via can be placed between any two conductive layers, and the through via can be configured to pass through a clearance hole formed in the conductive layer and electrically connect the two conductive layers to each other.
摘要翻译： 公开了电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括电介质层; 多个导电板; 缝合通孔，其构造成穿过介电层并且具有通过连接通过不同于导电板的平坦表面的平坦表面和通孔而将导电板彼此电连接的部分。 这里，电介质层，导电板和缝合通孔可以放置在任何两个导电层之间，并且通孔可以被配置为穿过形成在导电层中的间隙孔并将两个导电层彼此电连接 。
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公开(公告)号：US20090184782A1
公开(公告)日：2009-07-23
申请号：US12232463
申请日：2008-09-17
IPC分类号： H01P1/203
CPC分类号： H01P3/088 , H01L2224/16225 , H01P1/2005 , H05K1/0236 , H05K1/0237 , H05K3/429 , H05K2201/09309 , H05K2201/09663 , H05K2201/09681
摘要： Disclosed are an electromagnetic bandgap structure and a printed circuit board. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer; a plurality of conductive plates; a stitching via, configured to pass through the dielectric layer and have a part electrically connecting the conductive plates to each other by connecting through a planar surface that is different from a planar surface of the conductive plates, and a through via. Here, the dielectric layer, the conductive plates and the stitching via can be placed between any two conductive layers, and the through via can be configured to pass through a clearance hole formed in the conductive layer and electrically connect the two conductive layers to each other.
摘要翻译： 公开了电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括电介质层; 多个导电板; 缝合通孔，其构造成穿过介电层并且具有通过连接通过不同于导电板的平坦表面的平坦表面和通孔而将导电板彼此电连接的部分。 这里，电介质层，导电板和缝合通孔可以放置在任何两个导电层之间，并且通孔可以被配置为穿过形成在导电层中的间隙孔并将两个导电层彼此电连接 。
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公开(公告)号：US08102219B2
公开(公告)日：2012-01-24
申请号：US12478965
申请日：2009-06-05
IPC分类号： H04B3/32
CPC分类号： H05K1/0236 , H05K2201/09309 , H05K2201/09627 , H05K2201/09681
摘要： An electromagnetic bandgap structure is disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer, a plurality of conductive plates, placed on a planar surface which is different from that of the dielectric layer, vias, of which each is connected to each of the conductive plates, respectively, and penetrates through the dielectric layer from one end part that is connected to the conductive plates, and a conductive trace, which connects the other end parts of the vias with each other such that all of the conductive plates are electrically connected.
摘要翻译： 公开了电磁带隙结构。 根据本发明的实施例，电磁带隙结构可以包括介电层，多个导电板，放置在与电介质层不同的平面表面上，每个导电板各自与每个导电板连接 的导电板，并且从连接到导电板的一个端部穿过电介质层，以及导电迹线，其将通孔的另一个端部彼此连接，使得所有的导电板是 电连接。
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8.发明申请Method of manufacturing printed circuit board and electromagnetic bandgap structure 审中-公开制造印刷电路板和电磁带隙结构的方法公开(公告)号：US20090071603A1
公开(公告)日：2009-03-19
申请号：US12007474
申请日：2008-01-10
IPC分类号： B32B38/14
CPC分类号： B32B37/02 , B32B38/14 , B32B2038/0092 , B32B2038/047 , B32B2305/022 , B32B2309/105 , B32B2311/12 , B32B2457/08 , H05K1/0236 , H05K1/162 , H05K3/007 , H05K3/429 , H05K3/4611 , H05K2201/09309 , H05K2201/09663 , H05K2201/09672 , H05K2203/0156
摘要： A method of manufacturing a 4-layered printed circuit board by one-time stacking process is disclosed. In particular, the printed circuit board manufacturing method includes adhering copper clad laminates (CCL) to both surfaces of a foam tape; forming an inner layer circuit pattern on one of both copper thin layers of the CCL, the one copper thin layer being not adhered to the foam tape; separating the CCL from the foam tape; arranging the copper thin layer in which the inner layer circuit pattern is formed to face a prepreg; compressing the CCL into the prepreg; and forming an outer layer circuit pattern on one of both copper thin layers of the CCL, the one copper thin layer being in no contact with the prepreg.
摘要翻译： 公开了通过一次堆叠处理制造4层印刷电路板的方法。 特别地，印刷电路板的制造方法包括将覆铜层压板（CCL）粘附到泡沫胶带的两个表面上; 在CCL的两个铜薄层之一上形成内层电路图案，一个铜薄层不粘附到泡沫胶带上; 将CCL与泡沫胶带分离; 将其中形成内层电路图案的铜薄层布置成面对预浸料; 将CCL压缩成预浸料; 并且在CCL的两个铜薄层之一上形成外层电路图案，一个铜薄层不与预浸料坯接触。
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公开(公告)号：US20100134200A1
公开(公告)日：2010-06-03
申请号：US12478965
申请日：2009-06-05
CPC分类号： H05K1/0236 , H05K2201/09309 , H05K2201/09627 , H05K2201/09681
摘要： An electromagnetic bandgap structure is disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer, a plurality of conductive plates, placed on a planar surface which is different from that of the dielectric layer, vias, of which each is connected to each of the conductive plates, respectively, and penetrates through the dielectric layer from one end part that is connected to the conductive plates, and a conductive trace, which connects the other end parts of the vias with each other such that all of the conductive plates are electrically connected.
摘要翻译： 公开了电磁带隙结构。 根据本发明的实施例，电磁带隙结构可以包括介电层，多个导电板，放置在与电介质层不同的平面表面上，每个导电板各自与每个导电板连接 的导电板，并且从连接到导电板的一个端部穿过电介质层，以及导电迹线，其将通孔的另一个端部彼此连接，使得所有的导电板是 电连接。
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公开(公告)号：US08289099B2
公开(公告)日：2012-10-16
申请号：US12568362
申请日：2009-09-28
申请人： Han Kim , Ja-Bu Koo , Dae-Hyun Park
发明人： Han Kim , Ja-Bu Koo , Dae-Hyun Park
IPC分类号： H03H7/00
CPC分类号： H01P1/2005 , H01P1/203 , H05K1/0236 , H05K2201/09309 , H05K2201/09627 , H05K2201/09681
摘要： An electromagnetic bandgap structure includes: first conductive plates, placed on a first planar surface, in which the first conductive plates are lined up in a first direction; second conductive plates, placed on a second planar surface and arranged at an area corresponding to an area in which the first conductive plates are disposed, in which the second conductive plates are lined up in the first direction; a first stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the first planar surface; and a second stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the second planar surface.
摘要翻译： 电磁带隙结构包括：第一导电板，放置在第一平面上，第一导电板沿第一方向排列; 第二导电板，放置在第二平坦表面上并且布置在与设置有第一导电板的区域相对应的区域中，其中第二导电板沿第一方向排列; 第一缝合通孔，将任何两个相邻的导电部分彼此电连接，并且其中两个相邻的导电部分沿与第一平坦表面上的第一方向不同的方向排列; 以及第二缝合通孔，将任何两个相邻的导电部彼此电连接，并且其中两个相邻的导电部分在与第二平面上的第一方向不同的方向上排列。
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