WAVEGUIDE PATH COUPLING-TYPE PHOTODIODE
    1.
    发明申请
    WAVEGUIDE PATH COUPLING-TYPE PHOTODIODE 有权
    波导路耦合型光电转换器

    公开(公告)号:US20100119192A1

    公开(公告)日:2010-05-13

    申请号:US12598162

    申请日:2008-04-30

    IPC分类号: G02B6/12 H01L31/0232

    摘要: In a waveguide path coupling-type photodiode, a semiconductor light absorbing layer and an optical waveguide path core are adjacently arranged. An electrode formed of at least one layer is installed in a boundary part of the semiconductor light absorbing layer and the optical waveguide path core. The electrodes are arranged at an interval of (1/100)λ to λ [λ: wavelength of light transmitted through optical waveguide path core]. At least a part of the electrodes is embedded in the semiconductor light absorbing layer. Embedding depth from a surface of the semiconductor light absorbing layer is a value not more than λ/(2ns) [ns: refractive index of semiconductor light absorbing layer]. At least one layer of the electrode is constituted of a material which can surface plasmon-induced.

    摘要翻译: 在波导路耦合型光电二极管中,相邻地配置有半导体光吸收层和光波导路径芯。 由至少一层形成的电极安装在半导体光吸收层和光波导路径芯的边界部分。 电极以(1/100)λ至λ[λ:通过光波导路径芯透射的光的波长]的间隔布置。 至少一部分电极嵌入在半导体光吸收层中。 从半导体光吸收层的表面嵌入深度是不大于λ/(2ns)[ns:半导体光吸收层的折射率]的值。 至少一层电极由可以表面等离子体激发的材料构成。

    Waveguide path coupling-type photodiode
    2.
    发明授权
    Waveguide path coupling-type photodiode 有权
    波导路耦合型光电二极管

    公开(公告)号:US08467637B2

    公开(公告)日:2013-06-18

    申请号:US12598162

    申请日:2008-04-30

    IPC分类号: G02B6/12 G02B6/26 H01L29/47

    摘要: In a waveguide path coupling-type photodiode, a semiconductor light absorbing layer and an optical waveguide path core are adjacently arranged. An electrode formed of at least one layer is installed in a boundary part of the semiconductor light absorbing layer and the optical waveguide path core. The electrodes are arranged at an interval of (1/100)λ to λ [λ: wavelength of light transmitted through optical waveguide path core]. At least a part of the electrodes is embedded in the semiconductor light absorbing layer. Embedding depth from a surface of the semiconductor light absorbing layer is a value not more than λ/(2 ns) [ns: refractive index of semiconductor light absorbing layer]. At least one layer of the electrode is constituted of a material which can surface plasmon-induced.

    摘要翻译: 在波导路耦合型光电二极管中,相邻地配置有半导体光吸收层和光波导路径芯。 由至少一层形成的电极安装在半导体光吸收层和光波导路径芯的边界部分。 电极以(1/100)λ到λλ通过光波导路径芯透射的光的波长的间隔排列。 至少一部分电极嵌入在半导体光吸收层中。 从半导体光吸收层的表面嵌入深度是不大于λ/(2ns)[ns:半导体光吸收层的折射率]的值。 至少一层电极由可以表面等离子体激发的材料构成。

    PHOTODIODE
    4.
    发明申请
    PHOTODIODE 有权
    光电

    公开(公告)号:US20100013040A1

    公开(公告)日:2010-01-21

    申请号:US12518729

    申请日:2007-12-13

    IPC分类号: H01L31/0232

    摘要: A photodiode includes: an upper spacer layer including a semiconductor transparent to incident light; a metal periodic structure provided on the upper spacer layer and arranged to induce surface plasmon, the metal periodic structure including first and second electrodes including portions arranged alternately on the upper spacer layer; a light absorption layer formed under the upper spacer layer and including a semiconductor having a refractive index higher than that of the upper spacer layer; and a lower spacer layer formed under the light absorption layer and having a refractive index smaller than that of the light absorption layer. Each of the first and second electrodes forms a Schottky barrier junction with the upper spacer layer.

    摘要翻译: 光电二极管包括:包括对入射光透明的半导体的上间隔层; 金属周期结构,设置在上间隔层上并且布置成诱导表面等离子体激元,金属周期结构包括第一和第二电极,包括交替设置在上间隔层上的部分; 形成在所述上间隔层下方并且具有折射率高于所述上间隔层的折射率的半导体的光吸收层; 以及形成在光吸收层下面并且具有比光吸收层的折射率小的折射率的下间隔层。 第一和第二电极中的每一个与上间隔层形成肖特基势垒结。

    Photodiode
    5.
    发明授权
    Photodiode 有权
    光电二极管

    公开(公告)号:US08183656B2

    公开(公告)日:2012-05-22

    申请号:US12518729

    申请日:2007-12-13

    IPC分类号: H01L31/322

    摘要: A photodiode includes: an upper spacer layer including a semiconductor transparent to incident light; a metal periodic structure provided on the upper spacer layer and arranged to induce surface plasmon, the metal periodic structure including first and second electrodes including portions arranged alternately on the upper spacer layer; a light absorption layer formed under the upper spacer layer and including a semiconductor having a refractive index higher than that of the upper spacer layer; and a lower spacer layer formed under the light absorption layer and having a refractive index smaller than that of the light absorption layer. Each of the first and second electrodes forms a Schottky barrier junction with the upper spacer layer.

    摘要翻译: 光电二极管包括:包括对入射光透明的半导体的上间隔层; 金属周期结构,设置在上间隔层上并且布置成诱导表面等离子体激元,金属周期结构包括第一和第二电极,包括交替设置在上间隔层上的部分; 形成在所述上间隔层下方并且具有折射率高于所述上间隔层的折射率的半导体的光吸收层; 以及形成在光吸收层下面并且具有比光吸收层的折射率小的折射率的下间隔层。 第一和第二电极中的每一个与上间隔层形成肖特基势垒结。

    Semiconductor light receiving element and optical communication device
    6.
    发明授权
    Semiconductor light receiving element and optical communication device 有权
    半导体光接收元件和光通信装置

    公开(公告)号:US08637951B2

    公开(公告)日:2014-01-28

    申请号:US12811863

    申请日:2009-01-09

    摘要: A semiconductor light receiving element comprises: a substrate, a semiconductor layer of a first conductivity type formed on the substrate, a non-doped semiconductor light absorbing layer formed on the semiconductor layer of the first conductivity type, a semiconductor layer of a second conductivity type formed on the non-doped semiconductor light absorbing layer, and an electro-conductive layer formed on the semiconductor layer of the second conductivity type. A plurality of openings, periodically arrayed, are formed in a laminated body composed of the electro-conductive layer, the semiconductor layer of the second conductivity type, and the non-doped semiconductor light absorbing layer. The widths of the openings are less than or equal to the wavelength of incident light, and the openings pass through the electro-conductive layer and the semiconductor layer of the second conductivity type to reach the non-doped semiconductor light absorbing layer.

    摘要翻译: 半导体光接收元件包括:基板,形成在基板上的第一导电类型的半导体层,形成在第一导电类型的半导体层上的非掺杂半导体光吸收层,第二导电类型的半导体层 形成在非掺杂半导体光吸收层上的导电层和形成在第二导电类型的半导体层上的导电层。 周期排列的多个开口形成在由导电层,第二导电类型的半导体层和非掺杂半导体光吸收层组成的层叠体中。 开口的宽度小于或等于入射光的波长,并且开口穿过导电层和第二导电类型的半导体层以到达非掺杂半导体光吸收层。

    SiGe photodiode
    8.
    发明授权
    SiGe photodiode 有权
    SiGe光电二极管

    公开(公告)号:US08269303B2

    公开(公告)日:2012-09-18

    申请号:US12919638

    申请日:2009-03-09

    IPC分类号: H01L31/105

    摘要: The lattice mismatching between a Ge layer and a Si layer is as large as about 4%. Thus, when the Ge layer is grown on the Si layer, penetration dislocation is introduced to cause leakage current at the p-i-n junction. Thereby, the photo-detection sensitivity is reduced, and the reliability of the element is also lowered. Further, in the connection with a Si waveguide, there are also problems of the reflection loss due to the difference in refractive index between Si and Ge, and of the absorption loss caused by a metal electrode. In order to solve said problems, according to the present invention, there is provided a vertical type pin-SiGe photodiode having a structure which is embedded in a groove formed in a part of a Si layer, in which a p-type or n-type doped layer is formed in a lower section of the groove, and in which a i-SiGe layer having a rectangular shape or a reverse tapered shape is formed on a layered structure formed by laminating a i-Si layer and a SiGe buffer layer on the lower section and the side wall of the groove. Further, in an optical connection section with a Si waveguide, impedance matching is effected by the layered structure composed of the i-Si layer and the SiGe buffer layer, and an upper metal layer is separated therefrom so that a poly-Si bridge structure is employed to electrically connect the upper metal layer therewith.

    摘要翻译: Ge层与Si层之间的晶格失配大至4%左右。 因此,当Ge层在Si层上生长时,引入穿透位错以在p-i-n结处引起漏电流。 因此,光检测灵敏度降低,并且元件的可靠性也降低。 此外,在与Si波导的连接中,还存在由于Si和Ge之间的折射率的差异以及由金属电极引起的吸收损耗的反射损耗的问题。 为了解决所述问题,根据本发明,提供了一种垂直型pin-SiGe光电二极管,其具有嵌入到形成在Si层的一部分中的凹槽中的结构,其中p型或n- 在沟槽的下部形成有型掺杂层,其中在通过层叠i-Si层和SiGe缓冲层而形成的层叠结构上形成具有矩形或倒锥形的i-SiGe层 凹槽的下部和侧壁。 此外,在具有Si波导的光学连接部中,通过由i-Si层和SiGe缓冲层构成的层叠结构实现阻抗匹配,并且将上部金属层与其分离,使得多Si桥结构 用于将上部金属层电连接到其上。