Slurry flow rate monitoring in chemical-mechanical polisher using pressure transducer
    3.
    发明授权
    Slurry flow rate monitoring in chemical-mechanical polisher using pressure transducer 失效
    使用压力传感器的化学机械抛光机中的泥浆流量监测

    公开(公告)号:US06855031B2

    公开(公告)日:2005-02-15

    申请号:US10360558

    申请日:2003-02-07

    摘要: In a first aspect of the invention, a polishing device is provided. The polishing device includes a platen adapted to support a polishing pad and also includes a source of polishing slurry. Also included in the polishing device is a slurry supply line adapted to supply the polishing slurry from the source of polishing slurry to the polishing pad. The polishing device includes a pressure transducer installed along the slurry supply line and adapted to detect a pressure inside the slurry supply line. Numerous other aspects are provided.

    摘要翻译: 在本发明的第一方面中,提供了一种抛光装置。 抛光装置包括适于支撑抛光垫的压板,并且还包括抛光浆料源。 还包括在抛光装置中的是用于将抛光浆料从抛光浆料源提供给抛光垫的浆料供应管线。 抛光装置包括沿着浆料供应管线安装并适于检测浆料供应管线内的压力的压力传感器。 提供了许多其他方面。