摘要:
Methods and devices are provided for forming multi-nary semiconductor. In one embodiment, a method is provided comprising of depositing a precursor material onto a substrate, wherein the precursor material may include or may be used with an additive to minimize concentration of group IIIA material such as Ga in the back portion of the final semiconductor layer. The additive may be a non-copper Group IB additive in elemental or alloy form. Some embodiments may use both selenium and sulfur, forming a senary or higher semiconductor alloy.
摘要:
Methods and devices are provided for forming multi-nary semiconductor. In one embodiment, a method is provided comprising of depositing a precursor material onto a substrate, wherein the precursor material may include or may be used with an additive to minimize concentration of group IIIA material such as Ga in the back portion of the final semiconductor layer. The additive may be a non-copper Group IB additive in elemental or alloy form. Some embodiments may use both selenium and sulfur, forming a senary or higher semiconductor alloy. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要:
Methods and devices are provided for forming multi-nary semiconductor. In one embodiment, a method is provided comprising of depositing a precursor material onto a substrate, wherein the precursor material may include or may be used with an additive to minimize concentration of group IIIA material such as Ga in the back portion of the final semiconductor layer. The additive may be a non-copper Group IB additive in elemental or alloy form. Some embodiments may use both selenium and sulfur, forming a senary or higher semiconductor alloy.
摘要:
Methods and devices are provided for forming multi-nary semiconductor. In one embodiment, a method is provided comprising of depositing a precursor material onto a substrate, wherein the precursor material may include or may be used with an additive to minimize concentration of group IIIA material such as Ga in the back portion of the final semiconductor layer. The additive may be a non-copper Group IB additive in elemental or alloy form. Some embodiments may use both selenium and sulfur, forming a senary or higher semiconductor alloy. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要:
Methods and devices are provided for forming an absorber layer. In one embodiment, a method is provided comprising of depositing a precursor material onto a substrate, wherein the precursor material may include or may be used with an additive to minimize concentration of group IIIA material such as Ga in the back portion of the final semiconductor layer. The additive may be a non-copper Group IB additive in elemental or alloy form. Some embodiments may use both selenium and sulfur
摘要:
A thin film photovoltaic cell includes a light absorption layer of Group I-III-VI2 semiconductor materials and a high surface energy thin film layer that improves adhesion between the light absorption layer and an underlying electrode layer. The high surface energy thin film either replaces or is deposited on top of the back electrode to decrease the formation of voids at the back interface during absorber growth/deposition and thereby enabling a wider process window and improved cell efficiencies. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要:
A method includes collecting route parameters from a first intermediate node and a second intermediate node that can be configured to communicatively couple a source node to the destination node, determining at least a first route through the first intermediate node and a second route through the second intermediate node, and determining which route among the first route and the second route is optimal according to one or more criteria.
摘要:
A unique and versatile seating system for automobiles is provided. The seating system includes aspects to improve the functionality of the seating arrangement while maintaining the safety and comfort of the automotive seats. In certain embodiments, the seating system includes a reversible automotive seat that includes a seat cushion and a backrest. The backrest is movable between a forward seating position and a rearward seating position and includes an integrated restraint system which is operable to secure an occupant seated when the backrest is in either the forward or rearward seating positions.
摘要:
A method for improving semiconductor yield by in-line repair of defects during manufacturing comprises inspecting dies on a wafer after a selected layer is formed on the dies, identifying defects in each of the dies, classifying the identified defects as killer or non-critical, for each killer defect determining an action to correct the defect, repairing the defect and returning the wafer to a next process step. Also disclosed is a method for determining an efficient repair process by dividing the die into a grid and using analysis of the grid to find a least invasive repair.
摘要:
A system (100, 600, 700) for fastening objects to a wall or ceiling (120) comprises a rear, wall-anchor section (105, 607, 705) with a bore, and a front, pivotable section (110, 602, 604, 720), rigidly abutted together with no gap, aligned by a projection (135), and connected by a “living” hinge, strap, flap, lanyard or other type of connector (115). The pivotable section has a sharpened tip (112, 630, 635, 725) for penetrating the wall while the fastener is forced into the wall by a hammer or other driving tool or device, or manually by hand. The two sections of the fastener have a tapered, elliptical cross-section (111) which both prevents rotation of the fastener and locally reduces load-responsive pressure in the wallboard. To install, the axes of the wall-anchor and pivotable sections of the fastener are first aligned. The fastener is forced into the wall one of the above means. Then a pin (140) is manually inserted into the bore of the wall-anchor section. When the pin meets the projection the pivotable section is forced to rotate about the hinge. A locking tooth (139) secures the pin by interfering with either threads or notches in the pin. Alternatively, the pin forces past the projection and wedges between the projection and the bore of the wall-anchor section.