Multi-nary group IB and VIA based semiconductor
    2.
    发明授权
    Multi-nary group IB and VIA based semiconductor 有权
    多元组IB和基于VIA的半导体

    公开(公告)号:US08889469B2

    公开(公告)日:2014-11-18

    申请号:US13533761

    申请日:2012-06-26

    摘要: Methods and devices are provided for forming multi-nary semiconductor. In one embodiment, a method is provided comprising of depositing a precursor material onto a substrate, wherein the precursor material may include or may be used with an additive to minimize concentration of group IIIA material such as Ga in the back portion of the final semiconductor layer. The additive may be a non-copper Group IB additive in elemental or alloy form. Some embodiments may use both selenium and sulfur, forming a senary or higher semiconductor alloy. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

    摘要翻译: 提供用于形成多元半导体的方法和装置。 在一个实施例中,提供了一种方法,其包括将前体材料沉积到基底上,其中前体材料可以包含或可以与添加剂一起使用,以使最终半导体层的后部中的IIIA族材料(例如Ga)的浓度最小化 。 添加剂可以是元素或合金形式的非铜IB族添加剂。 一些实施方案可以同时使用硒和硫,形成一个或多个半导体合金。 要强调的是,该摘要被提供以符合要求抽象的规则,允许搜索者或其他读者快速确定技术公开内容的主题。 提交它的理解是,它不会用于解释或限制权利要求的范围或含义。

    MULTI-NARY GROUP IB AND VIA BASED SEMICONDUCTOR
    4.
    发明申请
    MULTI-NARY GROUP IB AND VIA BASED SEMICONDUCTOR 有权
    第IBI组和第二代半导体

    公开(公告)号:US20120313200A1

    公开(公告)日:2012-12-13

    申请号:US13533761

    申请日:2012-06-26

    IPC分类号: H01L31/032 H01L31/18

    摘要: Methods and devices are provided for forming multi-nary semiconductor. In one embodiment, a method is provided comprising of depositing a precursor material onto a substrate, wherein the precursor material may include or may be used with an additive to minimize concentration of group IIIA material such as Ga in the back portion of the final semiconductor layer. The additive may be a non-copper Group IB additive in elemental or alloy form. Some embodiments may use both selenium and sulfur, forming a senary or higher semiconductor alloy. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

    摘要翻译: 提供用于形成多元半导体的方法和装置。 在一个实施例中,提供了一种方法,其包括将前体材料沉积到基底上,其中前体材料可以包含或可以与添加剂一起使用,以使最终半导体层的后部中的IIIA族材料(例如Ga)的浓度最小化 。 添加剂可以是元素或合金形式的非铜IB族添加剂。 一些实施方案可以同时使用硒和硫,形成一个或多个半导体合金。 要强调的是,该摘要被提供以符合要求抽象的规则,允许搜索者或其他读者快速确定技术公开内容的主题。 提交它的理解是,它不会用于解释或限制权利要求的范围或含义。

    DEPOSITION OF A HIGH SURFACE ENERGY THIN FILM LAYER FOR IMPROVED ADHESION OF GROUP I-III-VI2 SOLAR CELLS
    6.
    发明申请
    DEPOSITION OF A HIGH SURFACE ENERGY THIN FILM LAYER FOR IMPROVED ADHESION OF GROUP I-III-VI2 SOLAR CELLS 审中-公开
    用于改善组I-III-VI2太阳能电池的粘附的高表面能量薄膜层的沉积

    公开(公告)号:US20140224312A1

    公开(公告)日:2014-08-14

    申请号:US13766712

    申请日:2013-02-13

    IPC分类号: H01L31/0216

    摘要: A thin film photovoltaic cell includes a light absorption layer of Group I-III-VI2 semiconductor materials and a high surface energy thin film layer that improves adhesion between the light absorption layer and an underlying electrode layer. The high surface energy thin film either replaces or is deposited on top of the back electrode to decrease the formation of voids at the back interface during absorber growth/deposition and thereby enabling a wider process window and improved cell efficiencies. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

    摘要翻译: 薄膜光伏电池包括I-III-VI2族半导体材料的光吸收层和改善光吸收层和下层电极层之间的粘附性的高表面能薄膜层。 高表面能薄膜取代或沉积在背电极的顶部,以减少在吸收体生长/沉积期间在后界面处的空隙的形成,从而实现更宽的工艺窗口和改进的电池效率。 要强调的是,该摘要被提供以符合要求抽象的规则,允许搜索者或其他读者快速确定技术公开的主题。 提交它的理解是,它不会用于解释或限制权利要求的范围或含义。

    System and Method for Auditing Route Parameters in a Network
    7.
    发明申请
    System and Method for Auditing Route Parameters in a Network 有权
    网络中路由参数审计的系统和方法

    公开(公告)号:US20120224675A1

    公开(公告)日:2012-09-06

    申请号:US13342181

    申请日:2012-01-02

    IPC分类号: H04M3/22

    摘要: A method includes collecting route parameters from a first intermediate node and a second intermediate node that can be configured to communicatively couple a source node to the destination node, determining at least a first route through the first intermediate node and a second route through the second intermediate node, and determining which route among the first route and the second route is optimal according to one or more criteria.

    摘要翻译: 一种方法包括从第一中间节点和第二中间节点收集路由参数,第一中间节点和第二中间节点可被配置为将源节点通信地耦合到目的地节点,至少确定通过第一中间节点的第一路由和通过第二中间节点的第二路由 并且根据一个或多个标准确定所述第一路由和所述第二路由中的哪个路由是最优的。

    SEAT CONFIGURATION SYSTEM FOR AN AUTOMOTIVE INTERIOR
    8.
    发明申请
    SEAT CONFIGURATION SYSTEM FOR AN AUTOMOTIVE INTERIOR 有权
    汽车内饰的座椅配置系统

    公开(公告)号:US20080018151A1

    公开(公告)日:2008-01-24

    申请号:US11865182

    申请日:2007-10-01

    IPC分类号: A47C15/00

    摘要: A unique and versatile seating system for automobiles is provided. The seating system includes aspects to improve the functionality of the seating arrangement while maintaining the safety and comfort of the automotive seats. In certain embodiments, the seating system includes a reversible automotive seat that includes a seat cushion and a backrest. The backrest is movable between a forward seating position and a rearward seating position and includes an integrated restraint system which is operable to secure an occupant seated when the backrest is in either the forward or rearward seating positions.

    摘要翻译: 提供独特和多功能的汽车座椅系统。 座椅系统包括改善座椅装置的功能的方面,同时保持汽车座椅的安全性和舒适性。 在某些实施例中,座椅系统包括可逆的汽车座椅,其包括座垫和靠背。 靠背可在前座位和后座位之间移动,并且包括一体的约束系统,该系统可操作以固定当靠背处于前座椅或后座时的就座者。

    Defect identification system and method for repairing killer defects in semiconductor devices
    9.
    发明申请
    Defect identification system and method for repairing killer defects in semiconductor devices 失效
    缺陷识别系统和修复半导体器件杀伤性缺陷的方法

    公开(公告)号:US20070010032A1

    公开(公告)日:2007-01-11

    申请号:US11519614

    申请日:2006-09-12

    IPC分类号: H01L21/00

    摘要: A method for improving semiconductor yield by in-line repair of defects during manufacturing comprises inspecting dies on a wafer after a selected layer is formed on the dies, identifying defects in each of the dies, classifying the identified defects as killer or non-critical, for each killer defect determining an action to correct the defect, repairing the defect and returning the wafer to a next process step. Also disclosed is a method for determining an efficient repair process by dividing the die into a grid and using analysis of the grid to find a least invasive repair.

    摘要翻译: 通过在制造过程中对缺陷的在线修复来提高半导体产量的方法包括:在模具上形成所选择的层之后检查晶片上的管芯,识别每个管芯中的缺陷,将所识别的缺陷分类为杀伤或非关键的, 对于每个杀手缺陷,确定纠正缺陷的动作,修复缺陷并将晶片返回到下一个处理步骤。 还公开了一种通过将模具分成网格并利用网格分析来找到最小侵入性修复来确定有效修复过程的方法。

    System and methods for wall and ceiling fastening
    10.
    发明申请
    System and methods for wall and ceiling fastening 有权
    墙壁和天花板紧固的系统和方法

    公开(公告)号:US20060222474A1

    公开(公告)日:2006-10-05

    申请号:US11171088

    申请日:2005-06-29

    IPC分类号: F16B21/00

    摘要: A system (100, 600, 700) for fastening objects to a wall or ceiling (120) comprises a rear, wall-anchor section (105, 607, 705) with a bore, and a front, pivotable section (110, 602, 604, 720), rigidly abutted together with no gap, aligned by a projection (135), and connected by a “living” hinge, strap, flap, lanyard or other type of connector (115). The pivotable section has a sharpened tip (112, 630, 635, 725) for penetrating the wall while the fastener is forced into the wall by a hammer or other driving tool or device, or manually by hand. The two sections of the fastener have a tapered, elliptical cross-section (111) which both prevents rotation of the fastener and locally reduces load-responsive pressure in the wallboard. To install, the axes of the wall-anchor and pivotable sections of the fastener are first aligned. The fastener is forced into the wall one of the above means. Then a pin (140) is manually inserted into the bore of the wall-anchor section. When the pin meets the projection the pivotable section is forced to rotate about the hinge. A locking tooth (139) secures the pin by interfering with either threads or notches in the pin. Alternatively, the pin forces past the projection and wedges between the projection and the bore of the wall-anchor section.

    摘要翻译: 用于将物体紧固到墙壁或天花板(120)的系统(100,600,700)包括具有孔的后部壁锚固部分(105,607,705),以及前部可枢转部分(110,602,710) 604,720),以无间隙的方式刚性地邻接在一起,由突起(135)对齐,并通过“活的”铰链,带子,翼片,挂绳或其他类型的连接器(115)连接。 可枢转部分具有用于穿透壁的尖锐尖端(112,630,635,725),同时通过锤子或其他驱动工具或装置或手动地将紧固件压入壁中。 紧固件的两个部分具有锥形的椭圆形横截面(111),其都防止紧固件的旋转并且局部地减小墙板中的负载响应压力。 要安装,首先对准紧固件的墙壁锚固件和可枢转部分的轴线。 紧固件被迫进入墙壁中的上述装置之一。 然后,一个销(140)被手动地插入壁 - 锚固部分的孔中。 当销接触突起时,可枢转部分被迫围绕铰链旋转。 锁定齿(139)通过与销中的任一螺纹或凹口的干涉来固定销。 或者,销通过突起和楔形件在突出部和壁 - 锚定部分的孔之间力。