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公开(公告)号：US08008783B2
公开(公告)日：2011-08-30
申请号：US12946185
申请日：2010-11-15
IPC分类号： H01L23/48
CPC分类号： H01L24/29 , C09J5/00 , C09J7/20 , C09J2203/326 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2463/00 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/01074 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10329 , H01L2924/14 , H01L2924/19043 , Y10S438/928 , Y10T156/10 , Y10T428/1452 , Y10T428/1486 , Y10T428/28 , Y10T428/287 , Y10T428/2891 , H01L2924/00
摘要： Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.
摘要翻译： 提供了一种胶带，装置和方法，其通常涉及用作切割胶带的单层粘合剂，以及用于在半导体器件制造中切割薄化晶片和芯片附着操作的芯片附着粘合剂。 胶带，装置和方法包括具有包括图案的表面改性的背衬。
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公开(公告)号：US20110064948A1
公开(公告)日：2011-03-17
申请号：US12946185
申请日：2010-11-15
IPC分类号： B32B7/12
CPC分类号： H01L24/29 , C09J5/00 , C09J7/20 , C09J2203/326 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2463/00 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/01074 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10329 , H01L2924/14 , H01L2924/19043 , Y10S438/928 , Y10T156/10 , Y10T428/1452 , Y10T428/1486 , Y10T428/28 , Y10T428/287 , Y10T428/2891 , H01L2924/00
摘要： Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.
摘要翻译： 提供了一种胶带，装置和方法，其通常涉及用作切割胶带的单层粘合剂，以及用于在半导体器件制造中切割薄化晶片和芯片附着操作的芯片附着粘合剂。 胶带，装置和方法包括具有包括图案的表面改性的背衬。
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公开(公告)号：US20090227089A1
公开(公告)日：2009-09-10
申请号：US12399054
申请日：2009-03-06
IPC分类号： H01L21/302 , B32B33/00 , C09J133/08
CPC分类号： H01L24/29 , C09J5/00 , C09J7/20 , C09J2203/326 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2463/00 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/01074 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10329 , H01L2924/14 , H01L2924/19043 , Y10S438/928 , Y10T156/10 , Y10T428/1452 , Y10T428/1486 , Y10T428/28 , Y10T428/287 , Y10T428/2891 , H01L2924/00
摘要： Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.
摘要翻译： 提供了一种胶带，装置和方法，其通常涉及用作切割胶带的单层粘合剂，以及用于在半导体器件制造中切割薄化晶片和芯片附着操作的芯片附着粘合剂。 胶带，装置和方法包括具有包括图案的表面改性的背衬。
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公开(公告)号：US07858499B2
公开(公告)日：2010-12-28
申请号：US12399054
申请日：2009-03-06
IPC分类号： H01L21/00
CPC分类号： H01L24/29 , C09J5/00 , C09J7/20 , C09J2203/326 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2463/00 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/01074 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10329 , H01L2924/14 , H01L2924/19043 , Y10S438/928 , Y10T156/10 , Y10T428/1452 , Y10T428/1486 , Y10T428/28 , Y10T428/287 , Y10T428/2891 , H01L2924/00
摘要： Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.
摘要翻译： 提供了一种胶带，装置和方法，其通常涉及用作切割胶带的单层粘合剂，以及用于在半导体器件制造中切割薄化晶片和芯片附着操作的芯片附着粘合剂。 胶带，装置和方法包括具有包括图案的表面改性的背衬。
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公开(公告)号：US07160095B2
公开(公告)日：2007-01-09
申请号：US10679633
申请日：2003-10-06
IPC分类号： B26F1/26
CPC分类号： B29C59/08 , B29C2793/0045 , Y10S425/037
摘要： The present invention provides an apparatus and methods for flame-perforating polymeric films with an oxygen-enriched flame. One embodiment of the apparatus includes a frame, a support surface attached to the frame, where the support surface includes a plurality of lowered portions, an oxygen-enrichment system for increasing the amount of oxygen in the combustible mixture, a burner attached to the frame opposite the support surface, where the burner supports a stable flame, and a film contacting the support surface, where the flame of the burner is directed towards the film to cause the film to be perforated. One embodiment of the method of flame perforating a polymeric film includes igniting an oxygen-enriched combustible mixture to form a stable flame, wherein the flame generated by the oxygen-enriched combustible mixture provides more uniform perforations.
摘要翻译： 本发明提供了一种用富氧火焰对聚合物膜进行火焰穿孔的装置和方法。 该装置的一个实施例包括框架，附接到框架的支撑表面，其中支撑表面包括多个下降部分，用于增加可燃混合物中的氧气量的富氧系统，附接到框架的燃烧器 与燃烧器支撑稳定火焰的支撑表面相对，以及接触支撑表面的膜，其中燃烧器的火焰指向膜以使膜被穿孔。 火焰穿孔聚合物膜的方法的一个实施方案包括点燃富氧可燃混合物以形成稳定的火焰，其中由富氧可燃混合物产生的火焰提供更均匀的穿孔。
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公开(公告)号：US07980849B2
公开(公告)日：2011-07-19
申请号：US12702907
申请日：2010-02-09
IPC分类号： B29D7/01
CPC分类号： B26F1/26 , Y10S425/037 , Y10T428/24273
摘要： An apparatus and methods for flame-perforating films. A preferred embodiment of the apparatus includes a frame, support surface attached to the frame, where the support surface includes a plurality of lowered portions, a burner attached to the frame opposite the support surface, where the burner supports a flame, and where the flame includes a flame tip opposite the burner and a film contacting the support surface, where the flame of the burner is in contact with the film, where the burner is positioned such that the distance between an unimpinged flame tip of the flame and the burner is at least one-third greater than the distance between the film and the burner.
摘要翻译： 一种用于火焰穿孔膜的设备和方法。 该装置的优选实施例包括框架，附接到框架的支撑表面，其中支撑表面包括多个下降部分，附接到框架与支撑表面相对的燃烧器，其中燃烧器支撑火焰，并且其中火焰 包括与燃烧器相对的火焰末端和接触支撑表面的膜，其中燃烧器的火焰与膜接触，其中燃烧器被定位成使得火焰未燃烧的火焰尖端和燃烧器之间的距离在 比胶片和燃烧器之间的距离大至少三分之一。
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公开(公告)号：US07348066B2
公开(公告)日：2008-03-25
申请号：US11250933
申请日：2005-10-14
申请人： Bert T. Chien , Joan M. Strobel , Mark A. Strobel , Clinton L. Jones , Joel A. Getschel , Ellen R. Bosl
发明人： Bert T. Chien , Joan M. Strobel , Mark A. Strobel , Clinton L. Jones , Joel A. Getschel , Ellen R. Bosl
IPC分类号： B32B27/08
CPC分类号： C08J7/04 , B32B3/30 , B32B27/08 , B32B27/16 , B32B27/18 , B32B27/30 , B32B27/32 , B32B27/325 , B32B2250/24 , B32B2255/10 , B32B2255/28 , B32B2307/40 , B32B2307/408 , B32B2457/202 , C08J2365/00 , Y10T428/31917 , Y10T428/31924 , Y10T428/31928 , Y10T428/31931 , Y10T428/31935 , Y10T428/31938
摘要： A norbornene-based cyclic olefin layer with a curable layer disposed thereon is described. The curable layer may additionally be imparted with a texture. The norbornene-based cyclic olefin films with curable layers can be incorporated into optical bodies which include an optical film, such as an oriented multilayer optical film. In addition, the invention includes a method of coating a curable layer onto a norbornene-based polymer layer or film without requiring a primer layer. Methods of making the norbornene-based cyclic olefin layer containing films are also disclosed.
摘要翻译： 描述了具有设置在其上的可固化层的降冰片烯系环状烯烃层。 可固化层可另外赋予织构。 具有可固化层的降冰片烯系环状烯烃膜可以结合到包括光学膜的光学体系中，例如定向多层光学膜。 此外，本发明包括在不需要底漆层的情况下将可固化层涂布在降冰片烯系聚合物层或膜上的方法。 还公开了制备含降冰片烯基环状烯烃层的膜的方法。
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公开(公告)号：US07329465B2
公开(公告)日：2008-02-12
申请号：US10976675
申请日：2004-10-29
申请人： Bert T. Chien , Joan M. Strobel , Mark A. Strobel , Clinton L. Jones , Joel A. Getschel , Ellen R. Bosl
发明人： Bert T. Chien , Joan M. Strobel , Mark A. Strobel , Clinton L. Jones , Joel A. Getschel , Ellen R. Bosl
IPC分类号： B32B27/08
CPC分类号： C08J7/04 , B32B3/30 , B32B27/08 , B32B27/16 , B32B27/18 , B32B27/30 , B32B27/32 , B32B27/325 , B32B2250/24 , B32B2255/10 , B32B2255/28 , B32B2307/40 , B32B2307/408 , B32B2457/202 , C08J2365/00 , Y10T428/31917 , Y10T428/31924 , Y10T428/31928 , Y10T428/31931 , Y10T428/31935 , Y10T428/31938
摘要： A norbomene-based cyclic olefin layer with a curable layer disposed thereon is described. The curable layer may additionally be imparted with a texture. The norbomene-based cyclic olefin films with curable layers can be incorporated into optical bodies which include an optical film, such as an oriented multilayer optical film. In addition, the invention includes a method of coating a curable layer onto a norbomene-based polymer layer or film without requiring a primer layer. Methods of making the norbomene-based cyclic olefin layer containing films are also disclosed.
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公开(公告)号：US09723940B2
公开(公告)日：2017-08-08
申请号：US11576961
申请日：2005-10-12
申请人： Adriana Paiva , Jeffrey T. Anderson , Roy Wong , Susan K. Yarmey , Mark A. Strobel , Joel A. Getschel , Albert I. Everaerts , Gregory F. King , John T. Brady , Duane D. Fansler , Kanta Kumar , Jeffrey D. Malmer , Mario A. Perez , Deborah A. Strobel , Wendy L. Thompson , Michael C. Palazzotto , Stefan H. Gryska , Sharon Wang , Mikhail L. Pekurovsky , Mark F. Ellis , Edward G. Stewart , Robert M. Jennings , Gerald R. A. Hofmann , Kelly J. Gibbens , Gezahegn D. Damte , Jie Yang
发明人： Adriana Paiva , Jeffrey T. Anderson , Roy Wong , Susan K. Yarmey , Mark A. Strobel , Joel A. Getschel , Albert I. Everaerts , Gregory F. King , John T. Brady , Duane D. Fansler , Kanta Kumar , Jeffrey D. Malmer , Mario A. Perez , Deborah A. Strobel , Wendy L. Thompson , Michael C. Palazzotto , Stefan H. Gryska , Sharon Wang , Mikhail L. Pekurovsky , Mark F. Ellis , Edward G. Stewart , Robert M. Jennings , Gerald R. A. Hofmann , Kelly J. Gibbens , Gezahegn D. Damte , Jie Yang
CPC分类号： A47G27/0206 , C08J7/047 , C08J2323/08 , C08J2367/02 , C08J2475/00 , C09J7/29 , C09J2201/162 , E04F15/02 , Y10T428/1452 , Y10T428/31797
摘要： A protective film includes a base layer and a wear layer, the wear layer comprising a UV cured hardcoat resin, and the UV cured hardcoat resin comprising surface modified silica nanoparticles. The protective film may comprise a pressure sensitive adhesive for adhesion to a floor. The protective film may be used, for example, as a protective floor finish.
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10.发明授权公开(公告)号：US07442442B2
公开(公告)日：2008-10-28
申请号：US10883263
申请日：2004-07-01
IPC分类号： B05D3/00
CPC分类号： C08J7/123 , B29C59/12 , Y10T428/31656 , Y10T428/31938
摘要： Methods and systems utilize an atmospheric-pressure nitrogen dielectric-barrier discharge to treat the surface of polymer substances. The atmospheric-pressure nitrogen dielectric-discharge may be maintained with a level of H2O below a pre-defined amount, such as by measuring and controlling the H2O within a treater, to produce a surface treatment for a polymer substance that yields desirable characteristics. Furthermore, the H2O level may be measured and controlled according to a pre-defined amount or according to another parameter such as an analysis of the resulting polymer surface. For example, the polymer surface may be provided with an optimal added nitrogen-to-added oxygen ratio and/or an optimal stability based on washed and unwashed advancing contact angles such as by controlling the H2O level within the treater based on these analyses of the treated polymer.
摘要翻译： 方法和系统利用大气压氮介质阻挡放电来处理聚合物物质的表面。 大气压氮介质放电可以以低于预定量的H 2 O 2水平保持，例如通过测量和控制H 2 O 3 O内的H 2 O 处理器，以产生产生期望特性的聚合物物质的表面处理。 此外，H 2 O水平可以根据预定量或根据另一参数如所得聚合物表面的分析来测量和控制。 例如，聚合物表面可以被提供有最佳的添加氮与氧的比例和/或基于洗涤和未洗涤的前进接触角的最佳稳定性，例如通过控制H 2 O 2水平 基于处理过的聚合物的这些分析。
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