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    Electronic module adjustment design and process using shims
    7.
    发明授权
    Electronic module adjustment design and process using shims 有权
    电子模块调整设计和使用垫片的过程

    公开(公告)号：US6049456A

    公开(公告)日：2000-04-11

    申请号：US152904

    申请日：1998-09-14

    申请人： Gaetano P. Messina ,  Armando S. Cammarano ,  Patrick A. Coico ,  Ronald L. Hering ,  Eric B. Hultmark ,  Raed A. Sherif

    发明人： Gaetano P. Messina ,  Armando S. Cammarano ,  Patrick A. Coico ,  Ronald L. Hering ,  Eric B. Hultmark ,  Raed A. Sherif

    IPC分类号： H01L23/40 ,  H05K7/20

    CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/09701

    摘要： A thermal conduction module for cooling one or more integrated circuit chips mounted on a substrate is described. At least one shim is disposed between the base plate and the cover plate of the module to establish a predetermined dimension between the cover plate and the integrated circuit chips mounted on the substrate for insertion of a thermal paste. The shims may be metal, engineered plastic, or thermally and electrically conductive or nonconductive creep resistant materials able to withstand the stress and load within the module over time. The shim may be a plurality of shims having the same thickness or a plurality of shims having a multiplicity of thicknesses. Most preferably, the shim conforms to the periphery of the cover plate or base plate. A method of determining the proper shim thickness is also described wherein an initial reading of the thickness of the cover plate and base plate of the module is obtained. A second reading of the thickness of the module is obtained after the substrate, mounted with at least one integrated circuit chip, is placed onto the base plate followed by a temporary spacer and the cover plate. One or more shims are selected which are equal to the difference between the initial reading and the second reading. The cover plate is removed and the spacer is replaced with the appropriate shim. The cover plate is then fastened to the base plate. Also described is a kit for fixing the thermal paste gap dimension in electronic modules comprising a base plate, cover plate, and a plurality of shims having a multiplicity of thicknesses.

    摘要翻译： 描述了用于冷却安装在基板上的一个或多个集成电路芯片的热传导模块。 在基板和模块的盖板之间设置至少一个垫片，以在盖板和安装在基板上的用于插入热粘贴的集成电路芯片之间建立预定尺寸。 垫片可以是金属，工程塑料，或导热或非导电的抗蠕变材料，能够经受住模块内的应力和负荷。 垫片可以是具有相同厚度的多个垫片或具有多个厚度的多个垫片。 最优选地，垫片符合盖板或底板的周边。 还描述了确定适当垫片厚度的方法，其中获得了模块的盖板和基板的厚度的初始读数。 在安装有至少一个集成电路芯片的基板被放置在基板上，之后是临时间隔件和盖板之后，获得模块厚度的二读。 选择一个或多个垫片，其等于初始读数和第二读数之间的差。 拆下盖板，并用适当的垫片更换垫片。 然后将盖板固定在基板上。 还描述了一种用于将热糊料间隙尺寸固定在包括基板，盖板和多个厚度的多个垫片的电子模块中的套件。