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公开(公告)号:US6001235A
公开(公告)日:1999-12-14
申请号:US881040
申请日:1997-06-23
申请人: David M. Arken , Andrew Chiu , Joseph John Fatula, Jr. , Robert William Hitzfield , Wen-Chien David Hsiao , Yiping Hsiao
发明人: David M. Arken , Andrew Chiu , Joseph John Fatula, Jr. , Robert William Hitzfield , Wen-Chien David Hsiao , Yiping Hsiao
CPC分类号: C25D7/123 , C25D17/001 , C25D21/00 , C25D21/18 , C25D5/08 , Y10S204/07
摘要: A rotary plater and method of plating are provided which improve the uniformity of plating across a plating surface of a workpiece. A plating solution distribution device is located in a plating cup between an anode and a cathode in a spaced relationship therebetween and is centered about a vertical axis of the plating cup. A motor is provided for relatively rotating the cathode and the plating solution distribution device with respect to one another. The plating solution distribution device distributes the plating solution over the plating surface at a distribution rate which increases radially outwardly from the vertical axis. With this arrangement the volume of plating solution at the outer periphery of the plating surface is enriched with ions to promote plating uniformity.
摘要翻译: 提供了一种旋转镀层和电镀方法,其提高了跨工件的镀层表面的电镀均匀性。 电镀溶液分配装置位于阳极和阴极之间的电镀杯中,间隔开的关系,并且以电镀杯的垂直轴为中心。 提供电动机用于相对于彼此相对旋转阴极和电镀液分配装置。 电镀溶液分配装置以从垂直轴径向向外增加的分布率将电镀液分布在电镀表面上。 通过这种布置,电镀表面外周的电镀溶液的体积富含离子以促进电镀均匀性。