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    ABRASIVE COMPOSITION FOR ELECTROCHEMICAL MECHANICAL POLISHING
    1.
    发明申请
    ABRASIVE COMPOSITION FOR ELECTROCHEMICAL MECHANICAL POLISHING 审中-公开
    电化学机械抛光磨料组合物

    公开(公告)号：US20070254485A1

    公开(公告)日：2007-11-01

    申请号：US11735801

    申请日：2007-04-16

    申请人： Daxin Mao ,  You Wang ,  Junzi Zhao ,  Stan D. Tsai ,  Renhe Jia ,  Jie Diao ,  Yongqi Hu ,  Lakshmanan Karuppiah

    发明人： Daxin Mao ,  You Wang ,  Junzi Zhao ,  Stan D. Tsai ,  Renhe Jia ,  Jie Diao ,  Yongqi Hu ,  Lakshmanan Karuppiah

    IPC分类号： H01L21/461 ,  H01L21/302 ,  C09K13/00

    CPC分类号： H01L21/32125 ,  B23H5/08 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  C25F3/02 ,  H01L21/7684

    摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In certain embodiments, a composition for processing a substrate having a conductive material layer disposed thereon is provided wherein the composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, an amount of a pH adjusting agent sufficient to provide a pH between about 3 and about 10, anionic polymer abrasive particles, and a solvent. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

    摘要翻译： 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在某些实施方案中，提供了一种用于处理其上设置有导电材料层的基材的组合物，其中所述组合物包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，一定量的pH调节剂， 提供约3至约10个的阴离子聚合物研磨剂颗粒和溶剂之间的pH。 该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除导电材料层。

    Process and composition for conductive material removal by electrochemical mechanical polishing
    4.
    发明授权
    Process and composition for conductive material removal by electrochemical mechanical polishing 失效
    通过电化学机械抛光去除导电材料的工艺和组成

    公开(公告)号：US07582564B2

    公开(公告)日：2009-09-01

    申请号：US11123274

    申请日：2005-05-05

    申请人： Zhihong Wang ,  You Wang ,  Daxin Mao ,  Renhe Jia ,  Stan D. Tsai ,  Yongqi Hu ,  Yuan A. Tian ,  Liang-Yuh Chen

    发明人： Zhihong Wang ,  You Wang ,  Daxin Mao ,  Renhe Jia ,  Stan D. Tsai ,  Yongqi Hu ,  Yuan A. Tian ,  Liang-Yuh Chen

    IPC分类号： H01L21/302

    CPC分类号： C25F3/02 ,  B23H5/08 ,  C09G1/02 ,  H01L21/32125 ,  H01L21/7684

    摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

    摘要翻译： 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在一个实施方案中，提供了一种用于处理其上设置导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，溶剂和 pH为约3至约10.该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除 导电材料层。

    Method and apparatus for reduced wear polishing pad conditioning
    5.
    发明授权
    Method and apparatus for reduced wear polishing pad conditioning 失效
    降低磨损抛光垫调理的方法和装置

    公开(公告)号：US07210988B2

    公开(公告)日：2007-05-01

    申请号：US11209167

    申请日：2005-08-22

    申请人： Yan Wang ,  Stan D. Tsai ,  Yongqi Hu ,  Feng Q. Liu ,  Liang-Yuh Chen ,  Daxin Mao ,  Huyen Karen Tran ,  Martin S. Wohlert ,  Renhe Jia ,  Yuan A. Tian

    发明人： Yan Wang ,  Stan D. Tsai ,  Yongqi Hu ,  Feng Q. Liu ,  Liang-Yuh Chen ,  Daxin Mao ,  Huyen Karen Tran ,  Martin S. Wohlert ,  Renhe Jia ,  Yuan A. Tian

    IPC分类号： B24B53/00

    CPC分类号： B24B53/017 ,  B23H5/08

    摘要： Embodiments of a conditioning head for in-situ conditioning and/or cleaning a processing pad of a CMP, ECMP, or other processing system are provided. In one embodiment, the conditioning head includes a brush disposed in a central cavity. A cleaning fluid is provided through the central cavity of the conditioning head to a processing pad. The brush spins and moves laterally across the surface of the processing pad. The cleaning solution dispensed through the conditioning head dissolves by-products of the processing operation while the brush gently wipes the processing pad. A lip of the conditioning head retains the cleaning fluid and cleaning waste, thereby minimizing contamination of the area outside of the conditioning head. The cleaning waste is removed from the processing pad via passages formed near the outer periphery of the conditioning head.

    摘要翻译： 提供了用于原位调理和/或清洁CMP，ECMP或其它处理系统的处理垫的调节头的实施例。 在一个实施例中，调节头包括设置在中心腔中的刷子。 清洁流体通过调节头的中心空腔设置到处理垫。 刷子旋转并横向移动到处理垫的表面上。 通过调节头分配的清洁溶液溶解处理操作的副产物，同时刷子轻轻擦拭处理垫。 调节头的唇缘保持清洁流体和清洁废物，从而最小化调节头外部区域的污染。 清洁废物通过在调节头的外周附近形成的通道从处理垫移除。

    Method and apparatus for electroprocessing a substrate with edge profile control
    6.
    发明授权
    Method and apparatus for electroprocessing a substrate with edge profile control 失效
    用边缘轮廓控制对基底进行电处理的方法和装置

    公开(公告)号：US07422982B2

    公开(公告)日：2008-09-09

    申请号：US11483843

    申请日：2006-07-07

    申请人： You Wang ,  Jie Diao ,  Stan D. Tsai ,  Lakshmanan Karuppiah

    发明人： You Wang ,  Jie Diao ,  Stan D. Tsai ,  Lakshmanan Karuppiah

    IPC分类号： H01L21/302 ,  H01L21/461

    CPC分类号： B23H5/08 ,  C25D17/10 ,  C25D17/12 ,  C25D21/12

    摘要： A method and apparatus for electroprocessing a substrate is provided. In one embodiment, a method for electroprocessing a substrate includes the steps of biasing a first electrode to establish a first electroprocessing zone between the electrode and the substrate, and biasing a second electrode disposed radially inward of the first electrode with a bias that is different than the bias applied to the first electrode. In one embodiment, the first electrode is coated with an inert material and in this way the same polish rate is obtained with a lower potential level applied to the first electrode.

    摘要翻译： 提供了一种用于电子处理衬底的方法和装置。 在一个实施例中，用于对衬底进行电处理的方法包括以下步骤：偏置第一电极以在电极和衬底之间建立第一电处理区，并且以不同于第一电极的偏压来偏置设置在第一电极的径向内侧的第二电极 施加到第一电极的偏压。 在一个实施例中，第一电极被涂覆有惰性材料，并且以这种方式获得相同的抛光速率，并且施加到第一电极的较低电位电平。

    Method and composition for electrochemically polishing a conductive material on a substrate
    8.
    发明授权
    Method and composition for electrochemically polishing a conductive material on a substrate 失效
    在基材上电化学研磨导电材料的方法和组合物

    公开(公告)号：US07879255B2

    公开(公告)日：2011-02-01

    申请号：US11556593

    申请日：2006-11-03

    申请人： Huyen Karen Tran ,  Renhe Jia ,  You Wang ,  Stan D. Tsai ,  Martin S. Wohlert ,  Daxin Mao

    发明人： Huyen Karen Tran ,  Renhe Jia ,  You Wang ,  Stan D. Tsai ,  Martin S. Wohlert ,  Daxin Mao

    IPC分类号： C09K13/00

    CPC分类号： B23H5/08

    摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. The method includes providing a substrate comprising dielectric feature definitions, a barrier material disposed in the feature definitions, and a bulk conductive material disposed on the barrier material in an amount sufficient to fill feature definitions; polishing the substrate to substantially remove the bulk conductive material; polishing a residual conductive material to expose feature definitions, comprising: applying a first voltage for a first time period, wherein the first voltage is less than the critical voltage; and applying a second voltage for a second time period, wherein the second voltage is greater than the critical voltage.

    摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 该方法包括提供包括介电特征定义的基底，设置在特征定义中的阻挡材料和以足以填充特征定义的量设置在阻挡材料上的体导电材料; 抛光衬底以基本上去除体导电材料; 抛光残余导电材料以暴露特征定义，包括：施加第一电压第一时间段，其中所述第一电压小于所述临界电压; 以及施加第二时间段的第二电压，其中所述第二电压大于所述临界电压。

    Method for electrochemically mechanically polishing a conductive material on a substrate
    9.
    发明授权
    Method for electrochemically mechanically polishing a conductive material on a substrate 失效
    在基板上进行电化学机械研磨导电材料的方法

    公开(公告)号：US07576007B2

    公开(公告)日：2009-08-18

    申请号：US11328958

    申请日：2006-01-09

    申请人： You Wang ,  Zhihong Wang ,  Renhe Jia ,  Stan D. Tsai ,  Yongqi Hu

    发明人： You Wang ,  Zhihong Wang ,  Renhe Jia ,  Stan D. Tsai ,  Yongqi Hu

    IPC分类号： H01L21/302

    CPC分类号： H01L21/7684 ,  B23H5/08 ,  H01L21/32125

    摘要： Aspects of the present invention include a method and an apparatus that may be utilized to reduce dishing and improve cleaning efficiency of a material layer residue (e.g., copper residual) by varying a substrate potential in a substrate processing system. For example, by utilizing multiple polishing steps and applying different voltages (e.g., while a substrate is being in a polishing station), ECMP can be used to effectively reduce dishing and it can be used to enhance copper residual cleaning as well as minimizing a possibility of arcing, which can occur at the end of the polishing process, when a substrate is moved from a polishing station.

    摘要翻译： 本发明的方面包括可以通过改变衬底处理系统中的衬底电位来减少凹陷并提高材料层残留物（例如铜残留物）的清洁效率的方法和装置。 例如，通过利用多个抛光步骤和施加不同的电压（例如，当衬底处于抛光站中时），ECMP可以用于有效地减少凹陷，并且可以用于增强铜残留清洁以及最小化可能性 当抛光工位移动基板时，可能在抛光过程结束时发生电弧。

    TEMPERATURE CONTROL FOR ECMP PROCESS
    10.
    发明申请
    TEMPERATURE CONTROL FOR ECMP PROCESS 审中-公开
    ECMP过程温度控制

    公开(公告)号：US20090036032A1

    公开(公告)日：2009-02-05

    申请号：US12248414

    申请日：2008-10-09

    申请人： Yongqi Hu ,  Paul D. Butterfield ,  Junzi Zhao ,  Stan D. Tsai ,  Feng Q. Liu

    发明人： Yongqi Hu ,  Paul D. Butterfield ,  Junzi Zhao ,  Stan D. Tsai ,  Feng Q. Liu

    IPC分类号： B24B1/00

    CPC分类号： B23H5/08 ,  B24B37/015 ,  B24B37/046 ,  B24B37/12 ,  B24B49/14 ,  C25D7/00

    摘要： Methods for polishing a substrate are provided. In one embodiment, the method includes pressing a substrate against a pad assembly disposed on rotating platen assembly, the pad assembly comprising an electrode coupled to a power source, flowing an electrolyte fluid onto the pad assembly, wherein the electrolyte fluid is in contact with the substrate and the electrode, creating an electrical bias between the electrode and the substrate, and heating the electrolyte fluid with an infrared lamp to a temperature of at least 10 degrees Celsius above room temperature.

    摘要翻译： 提供了抛光基板的方法。 在一个实施例中，该方法包括将基板压靠在设置在旋转台板组件上的焊盘组件上，该焊盘组件包括耦合到电源的电极，将电解液流动到焊盘组件上，其中电解质流体与 衬底和电极，在电极和衬底之间产生电偏压，并用红外灯将电解质液体加热到高于室温的至少10摄氏度的温度。