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公开(公告)号：US09507391B2
公开(公告)日：2016-11-29
申请号：US13305177
申请日：2011-11-28
申请人： Diane S. Busch , Michael S. June , Chunjian Ni , Pradeep Ramineni
发明人： Diane S. Busch , Michael S. June , Chunjian Ni , Pradeep Ramineni
IPC分类号： G06F1/20 , H01L23/34 , H01L23/467
CPC分类号： G06F1/20 , H01L23/34 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink comprises a plurality of fins that may be positioned in a plurality of orientations relative to a heat-generating electronic component to which the heat sink is thermally coupled. A controller may be used to detect an elevated processor temperature and to activate a drive member to automatically adjust the orientation of fins on the heat sink. The fins may be moved and aligned with an air flow made over the heat sink. The adjustable-fin heat sink affords added flexibility in arranging a processor or other heat-generating electronic component on a circuit board. The orientation or position of the heat sink fins may also be automatically changed in response to a change in the air flow direction as manifested by a rise in the temperature of the heat sink or the heat-generating member.
摘要翻译： 散热器包括多个翅片，其可以相对于散热器热耦合到的发热电子部件定位成多个取向。 可以使用控制器来检测升高的处理器温度并且激活驱动部件以自动调节散热器上的翅片的取向。 翅片可以移动并与在散热器上方形成的空气流对准。 可调节翅片散热片在电路板上布置处理器或其他发热电子部件提供了更大的灵活性。 散热鳍片的取向或位置也可以响应于空气流动方向的变化而自动改变，这表现为散热器或发热元件的温度升高。
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公开(公告)号：US20130138262A1
公开(公告)日：2013-05-30
申请号：US13305177
申请日：2011-11-28
申请人： Diane S. Busch , Michael S. June , Chunjian Ni , Pradeep Ramineni
发明人： Diane S. Busch , Michael S. June , Chunjian Ni , Pradeep Ramineni
CPC分类号： G06F1/20 , H01L23/34 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink comprises a plurality of fins that may be positioned in a plurality of orientations relative to a heat-generating electronic component to which the heat sink is thermally coupled. A controller may be used to detect an elevated processor temperature and to activate a drive member to automatically adjust the orientation of fins on the heat sink. The fins may be moved and aligned with an air flow made over the heat sink. The adjustable-fin heat sink affords added flexibility in arranging a processor or other heat-generating electronic component on a circuit board. The orientation or position of the heat sink fins may also be automatically changed in response to a change in the air flow direction as manifested by a rise in the temperature of the heat sink or the heat-generating member.
摘要翻译： 散热器包括多个翅片，其可以相对于散热器热耦合到的发热电子部件定位成多个取向。 可以使用控制器来检测升高的处理器温度并且激活驱动部件以自动调节散热器上的翅片的取向。 翅片可以移动并与在散热器上方形成的空气流对准。 可调节翅片散热片在电路板上布置处理器或其他发热电子部件提供了更大的灵活性。 散热鳍片的取向或位置也可以响应于空气流动方向的变化而自动改变，这表现为散热器或发热元件的温度升高。
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公开(公告)号：US20130133859A1
公开(公告)日：2013-05-30
申请号：US13307562
申请日：2011-11-30
申请人： Troy W. Glover , Michael S. June , Bejoy J. Kochuparambil , Chunjian Ni , Pradeep Ramineni , Whitcomb R. Scott, III
发明人： Troy W. Glover , Michael S. June , Bejoy J. Kochuparambil , Chunjian Ni , Pradeep Ramineni , Whitcomb R. Scott, III
CPC分类号： H01L23/367 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink to remove heat from a processor within a chassis to air moving through a fin structure on the heat sink. An embodiment of the heat sink comprises a heat bus engaging the processor to conduct heat from the processor to a fin structure having interconnected, repeating cellular air channels. A U-shaped heat bus comprises a base and first and second legs extending therefrom connected to opposite sides of the fin structure. An embodiment of the heat bus has a solid conductive core to conductively transfer heat from the processor through the base and the first and second legs to sides of the fin structure. Alternately, an embodiment of the heat bus has a hollow core containing a fluid to evaporatively transfer heat from the processor through the base and the first and second legs to sides of the fin structure.
摘要翻译： 散热器，用于从机箱内的处理器移除热量，使空气流过散热片上的翅片结构。 散热器的实施例包括接合处理器的热母线，以将热量从处理器传导到具有相互连接的重复蜂窝空气通道的翅片结构。 U形热母线包括底座以及从翅片结构的相对侧延伸的第一和第二腿部。 热量总线的一个实施例具有固体导电芯，以将热量从处理器传导通过基座，第一和第二支腿传导到翅片结构的侧面。 或者，热量总线的一个实施例具有一个中空的芯，该中空芯含有一种流体，用于将来自处理器的热量从底部以及第一和第二支腿蒸发地传递到翅片结构的侧面。
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公开(公告)号：US20130145612A1
公开(公告)日：2013-06-13
申请号：US13323811
申请日：2011-12-12
CPC分类号： G06F1/20 , G06F1/182 , H01L23/427 , H01L23/467 , H01L2924/0002 , H05K9/0041 , Y10T29/49018 , H01L2924/00
摘要： A system to remove heat from a heat-generating electronic component within a computer chassis and to contain electromagnetic radiation from traversing high-throughput vents in a bezel that forms a portion of the chassis containment structure comprises a heat sink having a fin structure with an inlet face, an outlet face and interconnected air channels therethrough, a base to engage the component and to transfer heat from the component to the fin structure, wherein the inlet face of the fin structure is disposed proximate the vents to block electromagnetic radiation from traversing the vents. In one embodiment, a heat pipe or a spreader bar moves heat from a base engaging a component distal from the bezel to the fin structure having an air inlet face proximal to the vents.
摘要翻译： 用于从计算机机箱内的发热电子部件移除热量并且在形成所述底盘容纳结构的一部分的边框中容纳穿过高通风口的电磁辐射的系统包括散热片，所述散热片具有翅片结构，所述散热片结构具有入口 面，出口面和相互连通的空气通道，底座，以接合部件并将热量从部件转移到散热片结构，其中散热片结构的入口面靠近通风口设置，以阻挡电磁辐射穿过通风口 。 在一个实施例中，热管或扩张杆将热量从接合远离边框的组件的基座移动到具有靠近通风口的进气面的翅片结构。
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