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    PERFORMANCE AND NOISE CONTROL FOR A HEAT SINK AIR MOVER
    1.
    发明申请
    PERFORMANCE AND NOISE CONTROL FOR A HEAT SINK AIR MOVER 审中-公开
    散热风机的性能和噪音控制

    公开(公告)号：US20130153199A1

    公开(公告)日：2013-06-20

    申请号：US13325198

    申请日：2011-12-14

    申请人： Diane S. Busch ,  Michael S. June ,  Mark E. Steinke

    发明人： Diane S. Busch ,  Michael S. June ,  Mark E. Steinke

    IPC分类号： F28F27/00

    CPC分类号： F28F27/00 ,  F28D2021/0029 ,  F28F13/16 ,  F28F2250/00 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A system and method for cooling a heat-generating device. The system comprises a heat sink base for contacting the heat-generating device, and a plurality of heat sink fins extending from the heat sink base, wherein the fins provide airflow passages that are open along a top, a first side and a second side. An ionic air moving device is disposed along at least one side of the heat sink for moving air through the airflow passages, and a fan is mounted adjacent to the top of the fins for moving air through the airflow passages. A controller selectively controls the airflow through the heat sink using only the ionic device, only the fan, or both the ionic device and the fan. A user or a system component may instruct the controller to enter a performance mode, an energy efficiency mode, or an acoustic mode.

    摘要翻译： 一种用于冷却发热装置的系统和方法。 该系统包括用于接触发热装置的散热器基座和从散热器基座延伸的多个散热鳍片，其中翅片提供沿顶部，第一侧面和第二侧开放的气流通道。 离子空气移动装置沿着散热器的至少一侧设置，用于使空气通过气流通道，并且风扇靠近翅片的顶部安装，以使空气通过气流通道。 控制器仅使用离子装置，仅风扇或离子装置和风扇来选择性地控制通过散热器的气流。 用户或系统组件可以指示控制器进入演奏模式，能量效率模式或声学模式。

    HEAT SINK FIN STRUCTURE BLOCKING ELECTROMAGNETIC RADIATION
    2.
    发明申请
    HEAT SINK FIN STRUCTURE BLOCKING ELECTROMAGNETIC RADIATION 审中-公开
    散热片结构阻塞电磁辐射

    公开(公告)号：US20130145612A1

    公开(公告)日：2013-06-13

    申请号：US13323811

    申请日：2011-12-12

    申请人： Diane S. Busch ,  Troy W. Glover ,  Michael S. June ,  Pradeep Ramineni

    发明人： Diane S. Busch ,  Troy W. Glover ,  Michael S. June ,  Pradeep Ramineni

    IPC分类号： G06F1/20 ,  H01P1/22 ,  H05K7/20

    CPC分类号： G06F1/20 ,  G06F1/182 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K9/0041 ,  Y10T29/49018 ,  H01L2924/00

    摘要： A system to remove heat from a heat-generating electronic component within a computer chassis and to contain electromagnetic radiation from traversing high-throughput vents in a bezel that forms a portion of the chassis containment structure comprises a heat sink having a fin structure with an inlet face, an outlet face and interconnected air channels therethrough, a base to engage the component and to transfer heat from the component to the fin structure, wherein the inlet face of the fin structure is disposed proximate the vents to block electromagnetic radiation from traversing the vents. In one embodiment, a heat pipe or a spreader bar moves heat from a base engaging a component distal from the bezel to the fin structure having an air inlet face proximal to the vents.

    摘要翻译： 用于从计算机机箱内的发热电子部件移除热量并且在形成所述底盘容纳结构的一部分的边框中容纳穿过高通风口的电磁辐射的系统包括散热片，所述散热片具有翅片结构，所述散热片结构具有入口 面，出口面和相互连通的空气通道，底座，以接合部件并将热量从部件转移到散热片结构，其中散热片结构的入口面靠近通风口设置，以阻挡电磁辐射穿过通风口 。 在一个实施例中，热管或扩张杆将热量从接合远离边框的组件的基座移动到具有靠近通风口的进气面的翅片结构。

    HEAT SINK WITH ORIENTABLE FINS
    3.
    发明申请
    HEAT SINK WITH ORIENTABLE FINS 有权
    加热与定向FINS

    公开(公告)号：US20130138262A1

    公开(公告)日：2013-05-30

    申请号：US13305177

    申请日：2011-11-28

    申请人： Diane S. Busch ,  Michael S. June ,  Chunjian Ni ,  Pradeep Ramineni

    发明人： Diane S. Busch ,  Michael S. June ,  Chunjian Ni ,  Pradeep Ramineni

    IPC分类号： G05D23/19 ,  G06F1/20 ,  H05K7/20

    CPC分类号： G06F1/20 ,  H01L23/34 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink comprises a plurality of fins that may be positioned in a plurality of orientations relative to a heat-generating electronic component to which the heat sink is thermally coupled. A controller may be used to detect an elevated processor temperature and to activate a drive member to automatically adjust the orientation of fins on the heat sink. The fins may be moved and aligned with an air flow made over the heat sink. The adjustable-fin heat sink affords added flexibility in arranging a processor or other heat-generating electronic component on a circuit board. The orientation or position of the heat sink fins may also be automatically changed in response to a change in the air flow direction as manifested by a rise in the temperature of the heat sink or the heat-generating member.

    摘要翻译： 散热器包括多个翅片，其可以相对于散热器热耦合到的发热电子部件定位成多个取向。 可以使用控制器来检测升高的处理器温度并且激活驱动部件以自动调节散热器上的翅片的取向。 翅片可以移动并与在散热器上方形成的空气流对准。 可调节翅片散热片在电路板上布置处理器或其他发热电子部件提供了更大的灵活性。 散热鳍片的取向或位置也可以响应于空气流动方向的变化而自动改变，这表现为散热器或发热元件的温度升高。

    Heat sink with orientable fins
    4.
    发明授权
    Heat sink with orientable fins 有权
    带定向翅片的散热片

    公开(公告)号：US09507391B2

    公开(公告)日：2016-11-29

    申请号：US13305177

    申请日：2011-11-28

    申请人： Diane S. Busch ,  Michael S. June ,  Chunjian Ni ,  Pradeep Ramineni

    发明人： Diane S. Busch ,  Michael S. June ,  Chunjian Ni ,  Pradeep Ramineni

    IPC分类号： G06F1/20 ,  H01L23/34 ,  H01L23/467

    CPC分类号： G06F1/20 ,  H01L23/34 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink comprises a plurality of fins that may be positioned in a plurality of orientations relative to a heat-generating electronic component to which the heat sink is thermally coupled. A controller may be used to detect an elevated processor temperature and to activate a drive member to automatically adjust the orientation of fins on the heat sink. The fins may be moved and aligned with an air flow made over the heat sink. The adjustable-fin heat sink affords added flexibility in arranging a processor or other heat-generating electronic component on a circuit board. The orientation or position of the heat sink fins may also be automatically changed in response to a change in the air flow direction as manifested by a rise in the temperature of the heat sink or the heat-generating member.

    摘要翻译： 散热器包括多个翅片，其可以相对于散热器热耦合到的发热电子部件定位成多个取向。 可以使用控制器来检测升高的处理器温度并且激活驱动部件以自动调节散热器上的翅片的取向。 翅片可以移动并与在散热器上方形成的空气流对准。 可调节翅片散热片在电路板上布置处理器或其他发热电子部件提供了更大的灵活性。 散热鳍片的取向或位置也可以响应于空气流动方向的变化而自动改变，这表现为散热器或发热元件的温度升高。

    Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter array
    6.
    发明授权
    Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter array 有权
    使用非平面离子发射器阵列穿过散热器的电流动力气流

    公开(公告)号：US08807204B2

    公开(公告)日：2014-08-19

    申请号：US12872107

    申请日：2010-08-31

    申请人： Michael S. June ,  Chunjian Ni ,  Dana S. Royer ,  Mark E. Steinke

    发明人： Michael S. June ,  Chunjian Ni ,  Dana S. Royer ,  Mark E. Steinke

    IPC分类号： F25B29/00 ,  F28F7/00 ,  F28D15/00 ,  F28F1/36

    CPC分类号： H05K7/2039 ,  F28F13/16 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

    摘要： A system for cooling a heat generating device comprises a heat sink and a plurality of ion emitter elements that form an electrohydrodynamic (EHD) air flow device. The heat sink has a base disposed in thermal communication with a heat generating device, such as a processor. A plurality of heat sink fins is coupled to electrical ground to form ion collectors. Ion emitter elements are disposed in a non-planar pattern along first ends of the plurality of fins so that each ion emitter element is equidistant from the first end of a nearest fin. A power supply applies an electrical potential between the plurality of ion emitter elements and the plurality of fins to induce a flow of ions that cause airflow across the heat sink. It is preferable to have at least three ion emitter elements that are equidistant from each fin of the heat sink.

    摘要翻译： 用于冷却发热装置的系统包括形成电动力（EHD）空气流动装置的散热器和多个离子发射器元件。 散热器具有与诸如处理器之类的发热装置热连通的基座。 多个散热鳍片耦合到电接地以形成离子收集器。 离子发射器元件沿着多个翅片的第一端设置在非平面图案中，使得每个离子发射器元件与最近翅片的第一端等距。 电源在多个离子发射器元件和多个翅片之间施加电势，以引起使散热器流过散热器的离子流。 优选具有与散热片的每个翅片等距的至少三个离子发射器元件。

    ELECTROHYDRODYNAMIC AIRFLOW ACROSS A HEAT SINK USING A NON-PLANAR ION EMITTER ARRAY
    8.
    发明申请
    ELECTROHYDRODYNAMIC AIRFLOW ACROSS A HEAT SINK USING A NON-PLANAR ION EMITTER ARRAY 有权
    使用非平面离子发射器阵列的散热器进行电动气动

    公开(公告)号：US20120048529A1

    公开(公告)日：2012-03-01

    申请号：US12872107

    申请日：2010-08-31

    申请人： Michael S. June ,  Chunjian Ni ,  Dana S. Royer ,  Mark E. Steinke

    发明人： Michael S. June ,  Chunjian Ni ,  Dana S. Royer ,  Mark E. Steinke

    IPC分类号： F28D15/00 ,  F28F27/00

    CPC分类号： H05K7/2039 ,  F28F13/16 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

    摘要： A system for cooling a heat generating device comprises a heat sink and a plurality of ion emitter elements that form an electrohydrodynamic (EHD) air flow device. The heat sink has a base disposed in thermal communication with a heat generating device, such as a processor. A plurality of heat sink fins is coupled to electrical ground to form ion collectors. Ion emitter elements are disposed in a non-planar pattern along first ends of the plurality of fins so that each ion emitter element is equidistant from the first end of a nearest fin. A power supply applies an electrical potential between the plurality of ion emitter elements and the plurality of fins to induce a flow of ions that cause airflow across the heat sink. It is preferable to have at least three ion emitter elements that are equidistant from each fin of the heat sink.

    摘要翻译： 用于冷却发热装置的系统包括形成电动力（EHD）空气流动装置的散热器和多个离子发射器元件。 散热器具有与诸如处理器之类的发热装置热连通的基座。 多个散热鳍片耦合到电接地以形成离子收集器。 离子发射器元件沿着多个翅片的第一端设置在非平面图案中，使得每个离子发射器元件与最近翅片的第一端等距。 电源在多个离子发射器元件和多个翅片之间施加电势，以引起使散热器流过散热器的离子流。 优选具有与散热片的每个翅片等距的至少三个离子发射器元件。