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公开(公告)号：US07348738B2
公开(公告)日：2008-03-25
申请号：US10934015
申请日：2004-09-02
申请人： Donald Franklin Foust , Anil Raj Duggal , Joseph John Shiang , William Francis Nealon , Jacob Charles Bortscheller
发明人： Donald Franklin Foust , Anil Raj Duggal , Joseph John Shiang , William Francis Nealon , Jacob Charles Bortscheller
CPC分类号： H01L27/3293 , F21S6/00 , F21Y2105/00 , F21Y2115/15 , H01L27/322 , H01L2251/5361 , H05B33/0896
摘要： The present invention relates to an area illumination light source comprising a plurality of individual OLED panels. The individual OLED panels are configured in a physically modular fashion. Each OLED panel comprising a plurality of OLED devices. Each OLED panel comprises a first electrode and a second electrode such that the power being supplied to each individual OLED panel may be varied independently. A power supply unit capable of delivering varying levels of voltage simultaneously to the first and second electrodes of each of the individual OLED panels is also provided. The area illumination light source also comprises a mount within which the OLED panels are arrayed.
摘要翻译： 本发明涉及一种包括多个单独的OLED面板的区域照明光源。 单个OLED面板以物理模块化的方式配置。 每个OLED面板包括多个OLED器件。 每个OLED面板包括第一电极和第二电极，使得提供给每个单独的OLED面板的功率可以独立地变化。 还提供能够向各个OLED面板的每个的第一和第二电极同时传送不同电平的电压的电源单元。 区域照明光源还包括其中排列OLED面板的安装件。
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公开(公告)号：US07049757B2
公开(公告)日：2006-05-23
申请号：US10212182
申请日：2002-08-05
申请人： Donald Franklin Foust , Ernest Wayne Balch , Anil Raj Duggal , Christian Maria Anton Heller , Renato Guida , William Francis Nealon , Tami Janene Faircloth
发明人： Donald Franklin Foust , Ernest Wayne Balch , Anil Raj Duggal , Christian Maria Anton Heller , Renato Guida , William Francis Nealon , Tami Janene Faircloth
IPC分类号： H05B39/00
CPC分类号： H01L27/3239 , G09F9/33 , H01L27/3204 , H01L2251/564 , H05B33/0896 , Y02B20/36
摘要： A light emitting device comprises a plurality of organic light emitting diode (OLED) modules. The OLED modules are arranged into a series group where the individual OLED modules are electrically connected in series. The device is configured to be coupled to a power supply. A display is also provided. The display includes a plurality of OLED modules arranged to depict a shape selected from the group consisting of at least one letter, at least one number, at least one image, and a combination thereof.
摘要翻译： 一种发光器件包括多个有机发光二极管（OLED）模块。 OLED模块被布置成串联组，其中各个OLED模块串联电连接。 该设备被配置为耦合到电源。 还提供显示。 显示器包括多个OLED模块，其布置成描绘从由至少一个字母，至少一个数字，至少一个图像及其组合组成的组中选择的形状。
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公开(公告)号：US07259391B2
公开(公告)日：2007-08-21
申请号：US11020338
申请日：2004-12-22
申请人： Jie Liu , Anil Raj Duggal , Christian Maria Anton Heller , Donald Franklin Foust , Tami Janene Faircloth
发明人： Jie Liu , Anil Raj Duggal , Christian Maria Anton Heller , Donald Franklin Foust , Tami Janene Faircloth
IPC分类号： H01L51/00
CPC分类号： H01L51/5203 , H01L27/3202 , H01L27/3204 , H01L27/3225 , H01L51/0021 , H01L51/0024 , H01L2251/5338 , Y02E10/549
摘要： A device includes a plurality of organic electronic devices disposed on a substrate, wherein each of the organic electronic devices comprises a first electrode and a second electrode. Furthermore, the device includes an organic layer disposed between the first and second electrodes of each of the plurality of organic electronic devices. Additionally, the device includes an interconnect element, wherein the interconnect element is configured to electrically couple the respective first and second electrodes of each of the plurality of organic electronic devices.
摘要翻译： 一种器件包括设置在衬底上的多个有机电子器件，其中每个有机电子器件包括第一电极和第二电极。 此外，该器件包括设置在多个有机电子器件中的每一个的第一和第二电极之间的有机层。 另外，该器件包括互连元件，其中互连元件被配置为电耦合多个有机电子器件中的每一个的相应的第一和第二电极。
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公开(公告)号：US07534635B1
公开(公告)日：2009-05-19
申请号：US12053772
申请日：2008-03-24
IPC分类号： H01L21/00 , H01L29/207 , B32B9/00
CPC分类号： H01L23/26 , H01L51/5259 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/00
摘要： Hermetically sealed packages include a getter precursor disposed within an interior region of the package. The getter precursor includes a cation portion and a non-oxidizing anion portion, which is configured to thermally decompose to change an oxidation state of cation to zero. Also disclosed herein are processes for hermetically sealing a package by coating a solution of the getter precursor onto interior defining wall surface of the package.
摘要翻译： 密封包装包括设置在包装的内部区域内的吸气剂前体。 吸气剂前体包括阳离子部分和非氧化阴离子部分，其被配置为热分解以将阳离子的氧化态改变为零。 本文还公开了通过将吸气剂前体的溶液涂覆到包装的内部限定壁表面上来密封包装的方法。
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公开(公告)号：US20080116815A1
公开(公告)日：2008-05-22
申请号：US11601538
申请日：2006-11-17
申请人： Donald Franklin Foust , Larry Gene Turner , Ernest Wayne Balch , Hak Fei Poon , William Francis Nealon , Jie Liu , Tami Janene Faircloth
发明人： Donald Franklin Foust , Larry Gene Turner , Ernest Wayne Balch , Hak Fei Poon , William Francis Nealon , Jie Liu , Tami Janene Faircloth
CPC分类号： H01L51/5203 , H01L27/3204 , H01L51/56 , H01L2251/5361
摘要： Large-Area lighting systems and methods of making the same. More specifically, groups of organic light emitting modules, such as organic light emitting diode modules, coupled in series with respect to on another are provided. The modules cathode of each organic light emitting module is electrically coupled to the anode of an adjacent light emitting module in an interconnect region. A portion of the cathode of each module extends adjacent to an active area of an adjacent module at an interconnect region. Methods of fabricating series groups of organic light emitting modules employing continuous material layers is also provided.
摘要翻译： 大面积照明系统及其制作方法。 更具体地，提供了相对于另一个串联耦合的有机发光模块（例如有机发光二极管模块）的组。 每个有机发光模块的模块阴极电耦合到互连区域中的相邻发光模块的阳极。 每个模块的阴极的一部分在互连区域附近邻近相邻模块的有源区域延伸。 还提供了使用连续材料层制造串联组的有机发光模块的方法。
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公开(公告)号：US06908561B1
公开(公告)日：2005-06-21
申请号：US10245948
申请日：2002-09-18
IPC分类号： B32B9/04 , H01L21/60 , H01L23/538 , H01L25/16
CPC分类号： H01L24/82 , H01L23/5389 , H01L24/24 , H01L24/29 , H01L24/76 , H01L25/16 , H01L2224/04105 , H01L2224/2402 , H01L2224/24227 , H01L2224/29 , H01L2224/2919 , H01L2224/29298 , H01L2224/32225 , H01L2224/73267 , H01L2224/82039 , H01L2224/83191 , H01L2224/83855 , H01L2224/92244 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01072 , H01L2924/01075 , H01L2924/0665 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19042 , H01L2924/3025 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： Methods for adhering polyimide dielectric materials to copper-, titanium-, aluminum-, or copper-and-titanium-containing portions of a substrate are described. The methods include the steps of applying adhesion promoter to a clean surface of the substrate, and curing the adhesion promoter. SPIE varnish is applied over the cured adhesion promoter, and is itself cured. A further layer of adhesion promoter is applied over the cured SPIE varnish, and is cured. The polyimide dielectric material is then laminated to the adhesion promoter. Cleaning of the copper-containing substrate portions is performed by etching with etchant including cupric chloride, cleaning of the titanium-containing substrate portions is performed with etchant including HF, and cleaning of copper- and titanium-containing portions is performed by HF etching followed by cupric chloride etching. Aluminum-containing portions of the substrate are not etched.
摘要翻译： 描述了将聚酰亚胺电介质材料粘附到基底的铜，钛，铝或铜和钛的部分的方法。 所述方法包括将粘合促进剂施加到基材的清洁表面并固化粘合促进剂的步骤。 SPIE清漆涂覆在固化的粘合促进剂上，并自身固化。 在固化的SPIE清漆上施加另一层粘合促进剂，并固化。 然后将聚酰亚胺电介质材料层压到粘合促进剂上。 含铜基材部分的清洗是通过用包括氯化铜在内的蚀刻剂进行蚀刻来进行的，用包含HF的蚀刻剂进行含钛基板部分的清洗，并且通过HF蚀刻然后进行清洗 氯化铜蚀刻。 不对基板的含铝部分进行蚀刻。
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公开(公告)号：US20080185701A1
公开(公告)日：2008-08-07
申请号：US12062364
申请日：2008-04-03
CPC分类号： H01L51/5246 , H01L51/524 , H01L51/5243
摘要： Hermetically sealed packages having organic electronic devices are presented. A number of sealing mechanisms are provided to hermetically seal the package to protect the organic electronic device from environmental elements. A metal alloy sealant layer is employed proximate to the organic electronic device. Alternatively, a metal alloy sealant layer in combination with primer layer may also be implemented. Further, superstrates and edge wraps may be provided to completely surround the organic electronic device.
摘要翻译： 介绍了具有有机电子设备的气密封装。 提供多个密封机构以气密地密封包装以保护有机电子装置免受环境因素的影响。 在有机电子器件附近使用金属合金密封剂层。 或者，也可以实施与底漆层组合的金属合金密封剂层。 此外，可以提供覆盖层和边缘包层以完全围绕有机电子器件。
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公开(公告)号：US07541671B2
公开(公告)日：2009-06-02
申请号：US11095199
申请日：2005-03-31
IPC分类号： H01L23/48
CPC分类号： H01L51/0097 , H01L51/524 , H01L51/5243 , H01L51/5246 , H01L51/5256 , H01L2251/5338 , Y02E10/549
摘要： An organic device package includes a flexible substrate having a topside and a bottom side. Further, the organic device package includes an organic electronic device having a first side and a second side disposed on the topside of the flexible substrate. In addition, the organic device package includes a first barrier layer disposed on the bottom side of the flexible substrate.
摘要翻译： 有机器件封装包括具有顶侧和底侧的柔性衬底。 此外，有机器件封装包括具有设置在柔性基板的顶侧上的第一侧和第二侧的有机电子器件。 此外，有机器件封装包括设置在柔性基板的底侧上的第一阻挡层。
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公开(公告)号：US08053260B2
公开(公告)日：2011-11-08
申请号：US11601538
申请日：2006-11-17
申请人： Donald Franklin Foust , Larry Gene Turner , Ernest Wayne Balch , Hak Fei Poon , William Francis Nealon , Jie Liu , Tami Janene Faircloth
发明人： Donald Franklin Foust , Larry Gene Turner , Ernest Wayne Balch , Hak Fei Poon , William Francis Nealon , Jie Liu , Tami Janene Faircloth
IPC分类号： H01L21/00
CPC分类号： H01L51/5203 , H01L27/3204 , H01L51/56 , H01L2251/5361
摘要： Large-Area lighting systems and methods of making the same. More specifically, groups of organic light emitting modules, such as organic light emitting diode modules, coupled in series with respect to on another are provided. The modules cathode of each organic light emitting module is electrically coupled to the anode of an adjacent light emitting module in an interconnect region. A portion of the cathode of each module extends adjacent to an active area of an adjacent module at an interconnect region. Methods of fabricating series groups of organic light emitting modules employing continuous material layers is also provided.
摘要翻译： 大面积照明系统及其制作方法。 更具体地，提供了相对于另一个串联耦合的有机发光模块（例如有机发光二极管模块）的组。 每个有机发光模块的模块阴极电耦合到互连区域中的相邻发光模块的阳极。 每个模块的阴极的一部分在互连区域附近邻近相邻模块的有源区域延伸。 还提供了使用连续材料层制造串联组的有机发光模块的方法。
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公开(公告)号：US06541378B1
公开(公告)日：2003-04-01
申请号：US10075684
申请日：2002-02-13
IPC分类号： H01L2144
CPC分类号： H01L24/76 , H01L21/486 , H01L23/5384 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/2402 , H01L2224/24227 , H01L2224/32225 , H01L2224/82039 , H01L2224/83191 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01075 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19042 , H01L2924/3025 , H05K1/0393 , H05K1/185 , H05K3/0035 , H05K3/0055 , H05K3/386 , H05K2203/095 , H05K2203/1469
摘要： Components or solid-state chips having electrical contacts containing copper are laminated to Kapton dielectric film, and through vias are formed down to copper-containing material of the component. A fabrication method is described for making reliable connections to the copper-containing materials. The method includes precoating the copper-containing material with SPIE, together with at least argon plasma cleaning, and possibly fluorine plasma etching, of the vias and copper material exposed at the bottoms of the vias.
摘要翻译： 具有包含铜的电触点的部件或固态芯片层压到Kapton电介质膜上，并且通过通孔形成为部件的含铜材料。 描述了一种制造方法，用于与含铜材料的可靠连接。 该方法包括用SPIE预涂含铜材料，以及暴露于通孔底部的通孔和铜材料的至少氩等离子体清洗以及可能的氟等离子体蚀刻。
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