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    Atomic-layer deposition apparatus
    1.
    发明授权
    Atomic-layer deposition apparatus 有权

    公开(公告)号：US09976216B2

    公开(公告)日：2018-05-22

    申请号：US15259670

    申请日：2016-09-08

    Applicant: Eastman Kodak Company

    Inventor： Kurt D. Sieber ,  Kam Chuen Ng ,  Ronald Steven Cok

    IPC: C23C16/458 ,  C23C16/455 ,  C23C16/44

    CPC classification number: C23C16/4584 ,  C23C16/4412 ,  C23C16/45544 ,  C23C16/45574 ,  C23C16/45576 ,  C23C16/458 ,  C23C16/4581 ,  C23C16/4585 ,  C23C16/4586

    Abstract: A thin film deposition system for depositing a thin film on a moveable substrate using atmospheric pressure atomic-layer deposition includes a chamber and a moveable substrate having a levitation stabilizing structure located on the moveable substrate that defines an enclosed interior impingement area of the moveable substrate. A stationary support, located in the chamber, supports the moveable substrate. The stationary support extends beyond the enclosed interior impingement area. A pressurized-fluid source provides a fluid flow through the stationary support that impinges on the moveable substrate within the enclosed interior impingement area of the moveable substrate sufficient to levitate the moveable substrate and expose the moveable substrate to the fluid while restricting the lateral motion of the moveable substrate with the levitation stabilizing structure.

    Micro-channel electrode structure
    3.
    发明授权
    Micro-channel electrode structure 有权

    公开(公告)号：US09695069B2

    公开(公告)日：2017-07-04

    申请号：US14695097

    申请日：2015-04-24

    Applicant: Eastman Kodak Company

    Inventor： Ronald Steven Cok

    IPC: H01L33/42 ,  C02F1/461

    CPC classification number: C02F1/46109 ,  C02F2001/46152 ,  C02F2201/4611

    Abstract: A micro-channel electrode structure includes a layer and an electrode micro-channel formed in the layer, the electrode micro-channel having an electrode micro-channel bottom forming the bottom of the electrode micro-channel and an electrode micro-channel top forming the top the electrode micro-channel. The electrode micro-channel is at least partially filled with an electrode that extends along the electrode micro-channel and extends from the electrode micro-channel bottom toward the electrode micro-channel top. A fluid micro-channel adapted to carry a fluid is formed in the layer. An electrical power source is connected to the electrode. The fluid micro-channel intersects the electrode micro-channel in the layer to form a micro-channel intersection and the electrode extends from the electrode micro-channel into the micro-channel intersection without occluding the fluid micro-channel.

    Multi-layer micro-wire structure
    6.
    发明授权
    Multi-layer micro-wire structure 有权
    多层微线结构

    公开(公告)号：US09513759B2

    公开(公告)日：2016-12-06

    申请号：US14217544

    申请日：2014-03-18

    Applicant: Eastman Kodak Company

    Inventor： Ronald Steven Cok

    IPC: H01L29/41 ,  G06F3/047 ,  H01L33/42 ,  H01L51/52 ,  G06F3/044 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K1/09

    CPC classification number: G06F3/047 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01L29/413 ,  H01L33/42 ,  H01L51/5215 ,  H05K1/0289 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/117 ,  H05K3/465 ,  H05K3/4664 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09845 ,  H05K2201/10128 ,  Y10T29/49155

    Abstract: A multi-layer micro-wire structure includes first and second substrates having first and second layers extending to first and second layer edges, respectively. The first layer includes first micro-wire electrodes and first connection pads. Each first micro-wire electrode includes one or more electrically connected first micro-wires and each first connection pad electrically connects to a corresponding first micro-wire electrode. The second layer includes second micro-wire electrodes and second connection pads. Each second micro-wire electrode includes one or more electrically connected second micro-wires, and each second connection pad electrically connects to a corresponding second micro-wire electrode. The second layer is located between the first substrate and the second substrate and the second layer edge extends at least partly beyond the first layer edge so that one or more of the second connection pads is located between at least a portion of the first layer edge and the second layer edge.

    Abstract translation: 多层微线结构包括分别具有延伸到第一和第二层边缘的第一和第二层的第一和第二基底。 第一层包括第一微线电极和第一连接焊盘。 每个第一微线电极包括一个或多个电连接的第一微线，并且每个第一连接焊盘电连接到对应的第一微线电极。 第二层包括第二微线电极和第二连接焊盘。 每个第二微线电极包括一个或多个电连接的第二微线，并且每个第二连接焊盘电连接到对应的第二微线电极。 第二层位于第一衬底和第二衬底之间，并且第二层边缘至少部分地延伸超过第一层边缘，使得一个或多个第二连接焊盘位于第一层边缘的至少一部分和 第二层边缘。

    Electrically-conductive article with improved bus region
    8.
    发明授权
    Electrically-conductive article with improved bus region 有权
    具有改善总线区域的导电制品

    公开(公告)号：US09430113B2

    公开(公告)日：2016-08-30

    申请号：US14281953

    申请日：2014-05-20

    Applicant: Eastman Kodak Company

    Inventor： Ronald Steven Cok ,  James Edward Sutton ,  Kenneth James Lushington

    IPC: G06F3/047

    CPC classification number: G06F3/047 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112

    Abstract: Electrically-conductive articles are prepared to have electrically-conductive silver metal electrode grids and electrically-conductive silver connector wire patterns (BUS lines) on one or both supporting sides of a transparent substrate. The electrically-conductive silver connector wire patterns are designed with at least one silver main wire that comprises two or more adjacent silver micro-wires in bundled patterns. These bundled patterns and silver micro-wires are designed with specific dimensions and configurations to provide optimal fidelity (or correspondence) to the mask image used to provide such images in a silver halide emulsion layer. The electrically-conductive articles are provided by imagewise exposure, development, and fixing of corresponding silver halide-containing conductive film element precursors containing photosensitive silver halide emulsion layers. The electrically-conductive articles can be used are parts of various electronic devices including touch screen devices.

    Abstract translation: 制备导电制品以在透明基板的一个或两个支撑侧上具有导电银金属电极网格和导电银连接器线图案（BUS线）。 导电银连接器线图案被设计成具有至少一个银主线，其包括两个或更多个相邻的银微丝线的捆绑图案。 这些捆绑图案和银微线被设计成具有特定的尺寸和构造，以提供与用于在卤化银乳剂层中提供这样的图像的掩模图像的最佳保真度（或对应关系）。 通过成像曝光，显影和固定含有感光卤化银乳剂层的含卤化银的导电膜元件前体来提供导电制品。 导电性物品可以是包括触摸屏装置的各种电子设备的部件。

    ATOMIC-LAYER DEPOSITION APPARATUS USING COMPOUND GAS JET
    9.
    发明申请
    ATOMIC-LAYER DEPOSITION APPARATUS USING COMPOUND GAS JET 有权
    使用复合气体射流的原子沉积沉积装置

    公开(公告)号：US20160237567A1

    公开(公告)日：2016-08-18

    申请号：US14621426

    申请日：2015-02-13

    Applicant: Eastman Kodak Company

    Inventor： Kurt D. Sieber ,  Kam Chuen Ng ,  Ronald Steven Cok

    IPC: C23C16/455 ,  C23C16/458

    CPC classification number: C23C16/45544 ,  C23C16/405 ,  C23C16/4412 ,  C23C16/453 ,  C23C16/45508 ,  C23C16/458 ,  C23C16/4583

    Abstract: An apparatus for depositing a thin film on a substrate using atmospheric pressure atomic-layer deposition includes a chamber having an atmosphere and a moveable substrate. A stationary support is located in the chamber that supports the moveable substrate. A pressurized-fluid source provides a compound fluid flow including an inert fluid surrounding a reactive fluid that flows simultaneously through the stationary support and impinges on at least a portion of the moveable substrate to fluidically levitate the moveable substrate and expose the moveable substrate to the compound fluid flow to deposit a thin film on the moveable substrate.

    Abstract translation: 使用大气压原子层沉积在基板上沉积薄膜的装置包括具有气氛的室和可移动基板。 固定支撑件位于腔室中，其支撑可移动衬底。 加压流体源提供复合流体流动，其包括围绕反应流体的惰性流体，所述惰性流体同时流过固定支撑件并且撞击在可移动基底的至少一部分上以流动地悬浮可移动基底并将可移动基底暴露于化合物 流体流动以在可移动基底上沉积薄膜。

    ATOMIC-LAYER DEPOSITION METHOD USING COMPOUND GAS JET
    10.
    发明申请
    ATOMIC-LAYER DEPOSITION METHOD USING COMPOUND GAS JET 有权
    使用复合气体射流的原子层析沉积方法

    公开(公告)号：US20160237564A1

    公开(公告)日：2016-08-18

    申请号：US14621428

    申请日：2015-02-13

    Applicant: Eastman Kodak Company

    Inventor： Kurt D. Sieber ,  Kam Chuen Ng ,  Ronald Steven Cok

    IPC: C23C16/455 ,  C23C16/458

    CPC classification number: C23C16/45525 ,  C23C16/4412 ,  C23C16/4551 ,  C23C16/45544 ,  C23C16/45574 ,  C23C16/45576 ,  C23C16/458 ,  C23C16/4584 ,  C23C16/4585

    Abstract: A method for depositing a thin film on a substrate using atmospheric pressure atomic-layer deposition includes providing a chamber having an atmosphere and a stationary support located in the chamber. The moveable substrate is located in a spatial relationship with the stationary support. A pressurized compound fluid flow, including an inert fluid surrounding a reactive fluid, is provided simultaneously through the stationary support that impinges on at least a portion of the moveable substrate to fluidically levitate the moveable substrate and expose the moveable substrate to the compound fluid flow to deposit a thin film on the moveable substrate.

    Abstract translation: 使用大气压原子层沉积在基板上沉积薄膜的方法包括提供具有气氛的室和位于室中的固定支撑件。 可移动衬底位于与固定支撑件的空间关系中。 通过固定支架同时提供包括反应流体周围的惰性流体的加压复合流体流动，所述固定支撑件撞击在可移动基板的至少一部分上以流动地悬浮可移动基板并将可移动基板暴露于复合流体流动 在可移动的基板上沉积薄膜。

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