公开(公告)号：US10792782B2

公开(公告)日：2020-10-06

申请号：US15514785

申请日：2016-01-18

申请人： EBARA CORPORATION

发明人： Kuniaki Yamaguchi ,  Itsuki Kobata ,  Toshio Mizuno

IPC分类号： B24B37/005 ,  B24B37/10 ,  B24B49/16 ,  B24B37/34 ,  H01L21/306 ,  H01L21/66

摘要： The invention simulates polishing amount taking into account pressure concentration that occurs in the vicinity of the edge of a substrate when a small-diameter buffing pad overhangs the substrate to be buffed.One embodiment of the invention provides a method for simulating polishing amount in a case where a polishing pad of a smaller size than a substrate is used to buff the substrate. The method includes measuring distributions of pressure that is applied from the polishing pad to the substrate according to each overhang amount of the polishing pad relative to the substrate by using a pressure sensor, and correcting the pressure that is used in the polishing amount simulation in accordance with the overhang amounts and the measured pressure distributions.

公开(公告)号：US10573509B2

公开(公告)日：2020-02-25

申请号：US15631149

申请日：2017-06-23

申请人： Ebara Corporation

发明人： Koji Maeda ,  Hiroshi Shimomoto ,  Kuniaki Yamaguchi ,  Hiroshi Aono ,  Tetsuya Yashima ,  Hidetatsu Isokawa ,  Kenji Shinkai ,  Mitsuhiko Inaba ,  Koichi Hashimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Fujihiko Toyomasu

IPC分类号： H01L21/02

摘要： The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.

公开(公告)号：US10201888B2

公开(公告)日：2019-02-12

申请号：US15604328

申请日：2017-05-24

申请人： EBARA CORPORATION

发明人： Kuniaki Yamaguchi ,  Itsuki Kobata ,  Toshio Mizuno ,  Mitsuru Miyazaki ,  Naoki Toyomura ,  Takuya Inoue

IPC分类号： B24B53/00 ,  B24B53/017 ,  B08B3/02 ,  B08B1/04 ,  H01L21/67

摘要： An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

公开(公告)号：US09700988B2

公开(公告)日：2017-07-11

申请号：US14832767

申请日：2015-08-21

申请人： EBARA CORPORATION

发明人： Kuniaki Yamaguchi ,  Itsuki Kobata ,  Toshio Mizuno ,  Mitsuru Miyazaki ,  Naoki Toyomura ,  Takuya Inoue

IPC分类号： B24B53/00 ,  B24B53/017 ,  B08B3/02 ,  B08B1/04 ,  H01L21/67

CPC分类号： B24B53/017 ,  B08B1/04 ,  B08B3/02 ,  B08B2203/0288 ,  H01L21/67046 ,  H01L21/67051

摘要： An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

公开(公告)号：US11192216B2

公开(公告)日：2021-12-07

申请号：US15898028

申请日：2018-02-15

申请人： EBARA CORPORATION

发明人： Hiromitsu Watanabe ,  Kuniaki Yamaguchi ,  Itsuki Kobata ,  Yutaka Wada

IPC分类号： B24B57/00 ,  B24B37/04 ,  B24B37/34

摘要： A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a polishing liquid, which has passed through a filter, is supplied onto the polishing pad. The polishing method includes: passing the polishing liquid through the filter while increasing a physical quantity of the polishing liquid until the physical quantity reaches a predetermined set value, the physical quantity being one of flow rate and pressure of the polishing liquid; and polishing the substrate W on the polishing pad while supplying the polishing liquid that has passed through the filter onto the polishing pad.

公开(公告)号：US10818531B2

公开(公告)日：2020-10-27

申请号：US16204979

申请日：2018-11-29

申请人： EBARA CORPORATION

发明人： Kuniaki Yamaguchi ,  Haiyang Xu ,  Koji Maeda ,  Mitsuhiko Inaba

IPC分类号： H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  B65G47/90 ,  H01L21/67 ,  B25J9/16

摘要： A substrate transport system includes a hand, a main positioning member permanently mounted on a base, where the main positioning member is engageable with the hand at a position offset by a first distance in the first axis direction and offset by a second distance in the second axis direction from a substrate transfer position, and a control unit that stores a position coordinate in the first axis direction and a position coordinate in the second axis direction of the hand in a state where the hand is positioned by being engaged with the main positioning member.

公开(公告)号：US10183374B2

公开(公告)日：2019-01-22

申请号：US14834195

申请日：2015-08-24

申请人： EBARA CORPORATION

发明人： Kuniaki Yamaguchi ,  Toshio Mizuno ,  Itsuki Kobata

IPC分类号： B24B37/04 ,  B24B37/10 ,  B24B37/20 ,  B24B41/00

摘要： A buffing module for buffing a substrate is provided. The buffing module comprises a buff table for supporting the substrate, the buff table being rotatable; and a buff head to which a buff pad is attached, being rotatable and movable in a direction of approaching the buff table and a direction of moving away from the buff table. The buff pad includes a first part and a second part arranged so as to surround the first part on an outer side of the first part, the first part and the second part have different characteristics from each other.

公开(公告)号：US20170372893A1

公开(公告)日：2017-12-28

申请号：US15631149

申请日：2017-06-23

申请人： Ebara Corporation

发明人： Koji Maeda ,  Hiroshi Shimomoto ,  Kuniaki Yamaguchi ,  Hiroshi Aono ,  Tetsuya Yashima ,  Hidetatsu Isokawa ,  Kenji Shinkai ,  Mitsuhiko Inaba ,  Koichi Hashimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Fujihiko Toyomasu

IPC分类号： H01L21/02

摘要： The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.

公开(公告)号：US09108292B2

公开(公告)日：2015-08-18

申请号：US14184655

申请日：2014-02-19

申请人： EBARA CORPORATION

发明人： Takahiro Shimano ,  Mutsumi Tanikawa ,  Hisanori Matsuo ,  Kuniaki Yamaguchi ,  Katsuhide Watanabe

IPC分类号： B24B53/017 ,  B24B53/02 ,  B24B53/00

CPC分类号： B24B53/005 ,  B24B53/017 ,  B24B53/02

摘要： The method includes: calculating an increment of a sliding distance of a dresser by multiplying a relative speed between the dresser and a polishing member by a contact time between them; correcting the increment of the sliding distance by multiplying the calculated increment of the sliding distance by at least one correction coefficient; calculating the sliding distance by repeatedly adding the corrected increment of the sliding distance to the sliding distance according to elapse of time; and producing the sliding-distance distribution of the dresser from the obtained sliding distance and a position of a sliding-distance calculation point. The at least one correction coefficient includes an unevenness correction coefficient provided for the sliding-distance calculation point. The unevenness correction coefficient is a correction coefficient that allows a profile of the polishing member to reflect a difference between an amount of scraped material of the polishing member in its raised portion and an amount of scraped material of the polishing member in its recess portion.

摘要翻译： 该方法包括：通过将修整器和抛光构件之间的相对速度乘以它们之间的接触时间来计算修整器的滑动距离的增量; 通过将计算出的滑动距离的增加乘以至少一个校正系数来校正滑动距离的增量; 通过根据时间经过反复地将滑动距离的校正增量反复地添加到滑动距离来计算滑动距离; 并且从获得的滑动距离和滑动距离计算点的位置产生修整器的滑动距离分布。 所述至少一个校正系数包括为所述滑动距离计算点提供的不均匀性校正系数。 不均匀性校正系数是使研磨部件的轮廓反映研磨部件的凸起部分的刮削材料量与其凹部中研磨部件的刮削材料量之间的差异的校正系数。

公开(公告)号：US11541502B2

公开(公告)日：2023-01-03

申请号：US17041734

申请日：2020-03-04

申请人： EBARA CORPORATION

发明人： Kuniaki Yamaguchi ,  Hiroshi Shimomoto ,  Soichi Isobe ,  Koji Maeda ,  Kenji Shinkai ,  Hidetatsu Isokawa ,  Dai Yoshinari ,  Masayuki Tamura ,  Haiyang Xu ,  Shun Ehara ,  Kentaro Asano

IPC分类号： B24B49/00 ,  B24B37/015 ,  B24B53/00 ,  B24B57/02 ,  B24B53/017

摘要： A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.