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    Optical devices and methods of fabricating the same
    2.
    发明授权
    Optical devices and methods of fabricating the same 有权
    光学器件及其制造方法

    公开(公告)号：US09335474B2

    公开(公告)日：2016-05-10

    申请号：US14311372

    申请日：2014-06-23

    申请人： Electronics and Telecommunications Research Institute

    发明人： Young-Tak Han ,  Sang Ho Park ,  Dong-Hun Lee ,  Jang Uk Shin ,  Sang-Pil Han ,  Yongsoon Baek

    IPC分类号： G02B6/136 ,  G02B6/42 ,  G02B6/12 ,  H01L23/00

    CPC分类号： G02B6/136 ,  G02B6/423 ,  G02B6/4231 ,  G02B2006/12176 ,  H01L24/11 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/00

    摘要： Provided is an optical device. The optical device includes a substrate having a waveguide region and a mounting region, a planar lightwave circuit (PLC) waveguide including a lower-clad layer and an upper-clad layer on the waveguide region of the substrate and a platform core between the lower-clad layer and the upper-clad layer, a terrace defined by etching the lower-clad layer on the mounting region of the substrate, the terrace including an interlocking part, an optical active chip mounted on the mounting region of the substrate, the optical active chip including a chip core therein, and a chip alignment mark disposed on a mounting surface of the optical active chip. The optical active chip is aligned by interlocking between the interlocking part of the terrace and the chip alignment mark of the optical active chip and mounted on the mounting region.

    摘要翻译： 提供了一种光学装置。 光学装置包括具有波导区域和安装区域的基板，在基板的波导区域上包括下覆盖层和上覆盖层的平面光波导路（PLC）波导和位于基板的波导区域之间的平台铁心， 包覆层和上包层，通过蚀刻衬底的安装区域上的下包覆层限定的平台，所述露台包括互锁部分，安装在衬底的安装区域上的光学有源芯片，光学活动 芯片，其中包括芯片芯片，以及设置在光学有源芯片的安装表面上的芯片对准标记。 光学有源芯片通过在平台的互锁部分和光学有源芯片的芯片对准标记之间的互锁对准并且安装在安装区域上。

    Optical transmitter module
    9.
    发明授权
    Optical transmitter module 有权

    公开(公告)号：US11381315B2

    公开(公告)日：2022-07-05

    申请号：US17156073

    申请日：2021-01-22

    申请人： Electronics and Telecommunications Research Institute

    发明人： Young-Tak Han ,  Seok Jun Yun ,  Seoktae Kim ,  Sang Ho Park ,  Yongsoon Baek ,  Jang Uk Shin ,  Seo Young Lee

    IPC分类号： H04B10/50 ,  H01S3/00 ,  H01S3/23 ,  H04J14/02 ,  H04Q11/00 ,  G02B6/12

    摘要： Disclosed is an optical transmitter module including a directly modulated laser transmitter based on a directly modulated laser (DML) and an arrayed waveguide grating (AWG) chip that is vertically polished. The directly modulated laser transmitter includes a directly modulated laser chip array including one or more directly modulated laser chips, an impedance matching circuit that allows each of the one or more directly modulated laser chips to operate at a critical speed of 100 Gbps per channel or higher, and a radio frequency-flexible printed circuit board (RF-FPCB) that transmits a radio frequency (RF) modulating signal to the directly modulated laser chip array. The arrayed waveguide grating chip includes an optical waveguides that transfer multi-channel optical signals and a wavelength multiplexer that multiplexes the multi-channel optical signals. The directly modulated laser transmitter and the arrayed waveguide grating chip are spaced apart from each other and are optically coupled in chip-to-chip.