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    Method for shaping a laminate substrate
    3.
    发明授权
    Method for shaping a laminate substrate 有权
    层压基板成型方法

    公开(公告)号：US09048245B2

    公开(公告)日：2015-06-02

    申请号：US13488678

    申请日：2012-06-05

    申请人： Edmund Blackshear ,  Thomas E. Lombardi ,  Donald A. Merte ,  Steven P. Ostrander ,  Thomas Weiss ,  Jiantao Zheng

    发明人： Edmund Blackshear ,  Thomas E. Lombardi ,  Donald A. Merte ,  Steven P. Ostrander ,  Thomas Weiss ,  Jiantao Zheng

    IPC分类号： B23K31/00 ,  B23K31/02 ,  B23K1/00 ,  B23K1/008 ,  B23K1/19 ,  B23K37/00 ,  B23K37/04 ,  H01L23/00 ,  H01L21/673

    CPC分类号： H01L23/562 ,  H01L21/67333 ,  H01L22/12 ,  H01L22/20 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/81024 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2924/3511 ,  Y02P80/30

    摘要： A method including providing a fixture comprising a trap ring, a base plate having a recess adapted to receive a laminate substrate, the base plate including an opening and an adjustable height center button disposed in the opening, the opening being located within the recess and located in a center of the laminate substrate, characterizing the laminate substrate for warpage characteristics by using one of room temperature techniques and elevated temperature techniques, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into the fixture with an adjustment to correct the horizontal plane distortion, the adjustment is provided by the adjustable height center button, wherein the adjustable height center button contacts the laminate substrate. The method further includes fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate.

    摘要翻译： 一种方法，包括提供包括陷阱环的固定装置，具有适于接收层压基板的凹部的基板，所述基板包括设置在所述开口中的开口和可调节的高度中心按钮，所述开口位于所述凹部内并且位于 在层压基板的中心，通过使用室温技术和高温技术中的一种来表征层压基板的翘曲特性，基于翘曲特性确定水平面变形，并将层压基板放置到固定装置中， 校正水平面失真，调节由可调高度中心按钮提供，其中可调节的高度中心按钮接触层压基板。 该方法还包括使层压基板熔化，将芯片放置在层压基板上，并将固定装置放入回流炉中以连接芯片和层叠基板。

    Tool for filling vias in a greensheet
    8.
    发明授权
    Tool for filling vias in a greensheet 有权
    用于在毛坯中填充过孔的工具

    公开(公告)号：US07984546B2

    公开(公告)日：2011-07-26

    申请号：US12166373

    申请日：2008-07-02

    申请人： Mark J. LaPlante ,  Thomas Weiss

    发明人： Mark J. LaPlante ,  Thomas Weiss

    IPC分类号： B23P19/00

    CPC分类号： H05K3/4061 ,  H05K3/225 ,  H05K2201/10204 ,  H05K2203/0108 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/163 ,  Y10T29/49144 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T83/04 ,  Y10T156/1052 ,  Y10T156/1056 ,  Y10T156/107 ,  Y10T156/137

    摘要： An apparatus tool for filling vias in a product greensheet and/or repairing vias in a product greensheet. The apparatus tool utilizes a transfer greensheet having filled vias in a fixed array, which vias are punched into the product greensheet to either repair or fill the via of the product greensheet. The apparatus tool employs position determining means such as a camera, a punch head and a corresponding punch die and an activating means to activate the punch head to punch the transfer greensheet via to fill the product greensheet via. The transfer greensheet has a fixed array of filled vias and a transfer greensheet station employs a fixed plate having a plurality of vacuum ports positioned in the non-via areas of the transfer greensheet which secures the transfer greensheet during the repair or fill method. The product greensheet is held by a vacuum plate.

    摘要翻译： 一种用于在产品毛坯中填充通孔和/或修理产品毛坯中的通孔的装置工具。 该设备工具使用具有固定阵列中的填充通孔的转移毛坯，该通孔冲入产品毛坯中以修复或填充产品毛坯的通孔。 设备工具采用位置确定装置，例如照相机，打孔头和相应的冲头模具以及激活装置，以激活打孔头以冲压传送毛坯通过以填充产品毛坯通孔。 转移毛坯具有固定的填充通孔阵列，并且转移毛坯站采用固定板，其具有定位在转移毛坯的非通孔区域中的多个真空端口，其在修复或填充方法期间固定转移毛坯。 产品毛坯由真空板保持。