Fault tolerant laser diode package
    1.
    发明授权
    Fault tolerant laser diode package 有权
    容错激光二极管封装

    公开(公告)号:US07860136B2

    公开(公告)日:2010-12-28

    申请号:US11975951

    申请日:2007-10-23

    IPC分类号: H01S3/00

    摘要: A laser diode package (10) according to the present invention is tolerant of short-circuit and open-circuit failures. The laser diode package (10) includes a laser diode bar (12), a forward-biased diode (14), a heat sink (18), and a lid (16) which may have fusible links (86). The laser diode bar (12) and the forward-biased diode (14) are electrically connected in parallel between the heat sink (18) and the lid (16). The emitting region of the laser diode bar (12) is aligned to emit radiation away from the forward-biased diode (14). Several packages can be stacked together to form a laser diode array (42). The forward-biased diode (14) allows current to pass through it when an open-circuit failure has occurred in the corresponding laser diode bar (12), thus preventing an open-circuit failure from completely disabling the array (42). The fusible links (86), if used on the lid (16), prevent damaged active regions (90) in a laser diode bar (12) from short-circuiting and drawing more electrical current than the other active regions (90).

    摘要翻译: 根据本发明的激光二极管封装(10)容忍短路和开路故障。 激光二极管封装(10)包括激光二极管条(12),正向偏置二极管(14),散热器(18)和可能具有易熔链(86)的盖子(16)。 激光二极管条(12)和正向偏置二极管(14)在散热器(18)和盖(16)之间并联电连接。 对准激光二极管条(12)的发射区域以发射远离正向偏置二极管(14)的辐射。 可以将多个封装堆叠在一起以形成激光二极管阵列(42)。 当相应的激光二极管条(12)中发生开路故障时,正向偏置二极管(14)允许电流通过它,从而防止开路故障完全禁用阵列(42)。 如果在盖子(16)上使用可熔连接件(86),则防止激光二极管条(12)中损坏的有源区域(90)与其它有源区域(90)相比短路并吸引更多的电流。

    Fault tolerant laser diode package
    2.
    发明授权
    Fault tolerant laser diode package 有权
    容错激光二极管封装

    公开(公告)号:US07330491B2

    公开(公告)日:2008-02-12

    申请号:US10827981

    申请日:2004-04-20

    IPC分类号: H01S3/04

    摘要: A laser diode package (10) according to the present invention is tolerant of short-circuit and open-circuit failures. The laser diode package (10) includes a laser diode bar (12), a forward-biased diode (14), a heat sink (18), and a lid (16) which may have fusible links (86). The laser diode bar (12) and the forward-biased diode (14) are electrically connected in parallel between the heat sink (18) and the lid (16). The emitting region of the laser diode bar (12) is aligned to emit radiation away from the forward-biased diode (14). Several packages can be stacked together to form a laser diode array (42). The forward-biased diode (14) allows current to pass through it when an open-circuit failure has occurred in the corresponding laser diode bar (12), thus preventing an open-circuit failure from completely disabling the array (42). The fusible links (86), if used on the lid (16), prevent damaged active regions (90) in a laser diode bar (12) from short-circuiting and drawing more electrical current than the other active regions (90).

    摘要翻译: 根据本发明的激光二极管封装(10)容忍短路和开路故障。 激光二极管封装(10)包括激光二极管条(12),正向偏置二极管(14),散热器(18)和可能具有易熔链(86)的盖子(16)。 激光二极管条(12)和正向偏置二极管(14)在散热器(18)和盖(16)之间并联电连接。 对准激光二极管条(12)的发射区域以发射远离正向偏置二极管(14)的辐射。 可以将多个封装堆叠在一起以形成激光二极管阵列(42)。 当相应的激光二极管条(12)中发生开路故障时,正向偏置二极管(14)允许电流通过它,从而防止开路故障完全禁用阵列(42)。 如果在盖子(16)上使用可熔连接件(86),则防止激光二极管条(12)中损坏的有源区域(90)与其它有源区域(90)相比短路并吸引更多的电流。

    Fault tolerant laser diode package

    公开(公告)号:US06728275B2

    公开(公告)日:2004-04-27

    申请号:US10246972

    申请日:2002-09-19

    IPC分类号: H01S304

    摘要: A laser diode package (10) according to the present invention is tolerant of short-circuit and open-circuit failures. The laser diode package (10) includes a laser diode bar (12), a forward-biased diode (14), a heat sink (18), and a lid (16) which may have fusible links (86). The laser diode bar (12) and the forward-biased diode (14) are electrically connected in parallel between the heat sink (18) and the lid (16). The emitting region of the laser diode bar (12) is aligned to emit radiation away from the forward-biased diode (14). Several packages can be stacked together to form a laser diode array (42). The forward-biased diode (14) allows current to pass through it when an open-circuit failure has occurred in the corresponding laser diode bar (12), thus preventing an open-circuit failure from completely disabling the array (42). The fusible links (86), if used on the lid (16), prevent damaged active regions (90) in a laser diode bar (12) from short-circuiting and drawing more electrical current than the other active regions (90).

    Methods of fabrication of high-density laser diode stacks
    4.
    发明授权
    Methods of fabrication of high-density laser diode stacks 有权
    制造高密度激光二极管叠层的方法

    公开(公告)号:US08518814B2

    公开(公告)日:2013-08-27

    申请号:US13310432

    申请日:2011-12-02

    IPC分类号: H01L21/44

    摘要: A method of fabricating a high-density laser diode stack is disclosed. The laser diode bars each have an emitter surface and opposing surfaces on either side of the emitter surface. Each laser diode bar has metallization layers on the opposing surfaces and a solder layer on at least one of the metallization layers. The solder layer is applied to a semiconductor wafer prior to cleaving the wafer to create the laser diode bars. The laser diode bars are arranged in a stack such that the emitter surfaces of the bars are facing the same direction. The stack of laser diode bars is placed in a vacuum chamber. An anti-reflection coating is deposited on the emitter surfaces of the laser diode bars in the chamber. The laser diode bars are joined by applying a temperature sufficient to reflow the solder layers in the chamber.

    摘要翻译: 公开了制造高密度激光二极管堆叠的方法。 激光二极管条各自具有发射极表面和发射器表面两侧的相对表面。 每个激光二极管棒在相对表面上具有金属化层,并且在至少一个金属化层上具有焊料层。 在切割晶片之前将焊料层施加到半导体晶片以形成激光二极管条。 激光二极管条布置成堆叠,使得条的发射器表面面向相同的方向。 将激光二极管棒的叠层放置在真空室中。 防反射涂层沉积在腔室中的激光二极管条的发射器表面上。 通过施加足以使室中的焊料层回流的温度来连接激光二极管条。

    Laser Diode Ceramic Cooler Having Circuitry For Control And Feedback Of Laser Diode Performance
    5.
    发明申请
    Laser Diode Ceramic Cooler Having Circuitry For Control And Feedback Of Laser Diode Performance 有权
    具有电路的激光二极管陶瓷冷却器用于激光二极管性能的控制和反馈

    公开(公告)号:US20110026551A1

    公开(公告)日:2011-02-03

    申请号:US12841810

    申请日:2010-07-22

    IPC分类号: H01S3/04

    CPC分类号: H01S5/02423 H01S5/4025

    摘要: A laser diode package includes a laser diode, a cooler, and control circuitry, such as an integrated circuit. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets. The ceramic sheets are fused together. The ceramic sheets include traces or vias that provide electrically conductive paths to the integrated circuit. The control circuitry controls the output of the laser diode, e.g. the output at each of the laser diode's emitters. Multiple laser diode packages are placed together to form an array.

    摘要翻译: 激光二极管封装包括激光二极管,冷却器和控制电路,例如集成电路。 激光二极管用于将电能转换为光能。 冷却器通过内部通道从冷却源接收冷却液。 冷却器包括多个陶瓷片。 陶瓷片融合在一起。 陶瓷片包括向集成电路提供导电路径的迹线或通​​孔。 控制电路控制激光二极管的输出,例如, 每个激光二极管的发射极的输出。 将多个激光二极管封装放在一起形成阵列。

    METHODS OF FABRICATION OF HIGH-DENSITY LASER DIODE STACKS
    6.
    发明申请
    METHODS OF FABRICATION OF HIGH-DENSITY LASER DIODE STACKS 有权
    高密度激光二极管堆叠的制造方法

    公开(公告)号:US20130143338A1

    公开(公告)日:2013-06-06

    申请号:US13310432

    申请日:2011-12-02

    IPC分类号: H01L21/50

    摘要: A method of fabricating a high-density laser diode stack is disclosed. The laser diode bars each have an emitter surface and opposing surfaces on either side of the emitter surface. Each laser diode bar has metallization layers on the opposing surfaces and a solder layer on at least one of the metallization layers. The solder layer is applied to a semiconductor wafer prior to cleaving the wafer to create the laser diode bars. The laser diode bars are arranged in a stack such that the emitter surfaces of the bars are facing the same direction. The stack of laser diode bars is placed in a vacuum chamber. An anti-reflection coating is deposited on the emitter surfaces of the laser diode bars in the chamber. The laser diode bars are joined by applying a temperature sufficient to reflow the solder layers in the chamber.

    摘要翻译: 公开了制造高密度激光二极管堆叠的方法。 激光二极管条各自具有发射极表面和发射器表面两侧的相对表面。 每个激光二极管棒在相对表面上具有金属化层,并且在至少一个金属化层上具有焊料层。 在切割晶片之前将焊料层施加到半导体晶片以形成激光二极管条。 激光二极管条布置成堆叠,使得条的发射器表面面向相同的方向。 将激光二极管棒的叠层放置在真空室中。 防反射涂层沉积在腔室中的激光二极管条的发射器表面上。 通过施加足以使室中的焊料层回流的温度来连接激光二极管条。

    Laser diode ceramic cooler having circuitry for control and feedback of laser diode performance
    7.
    发明授权
    Laser diode ceramic cooler having circuitry for control and feedback of laser diode performance 有权
    激光二极管陶瓷冷却器具有控制和反馈激光二极管性能的电路

    公开(公告)号:US08345720B2

    公开(公告)日:2013-01-01

    申请号:US12841810

    申请日:2010-07-22

    IPC分类号: H01S5/024 H01S5/40

    CPC分类号: H01S5/02423 H01S5/4025

    摘要: A laser diode package includes a laser diode, a cooler, and control circuitry, such as an integrated circuit. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets. The ceramic sheets are fused together. The ceramic sheets include traces or vias that provide electrically conductive paths to the integrated circuit. The control circuitry controls the output of the laser diode, e.g. the output at each of the laser diode's emitters. Multiple laser diode packages are placed together to form an array.

    摘要翻译: 激光二极管封装包括激光二极管,冷却器和控制电路,例如集成电路。 激光二极管用于将电能转换为光能。 冷却器通过内部通道从冷却源接收冷却液。 冷却器包括多个陶瓷片。 陶瓷片融合在一起。 陶瓷片包括向集成电路提供导电路径的迹线或通​​孔。 控制电路控制激光二极管的输出,例如, 每个激光二极管的发射极的输出。 将多个激光二极管封装放在一起形成阵列。

    Microchannel Cooler for a Single Laser Diode Emitter Based System
    8.
    发明申请
    Microchannel Cooler for a Single Laser Diode Emitter Based System 有权
    用于单个激光二极管发射器系统的微通道冷却器

    公开(公告)号:US20120177073A1

    公开(公告)日:2012-07-12

    申请号:US13004536

    申请日:2011-01-11

    IPC分类号: H01S3/04

    CPC分类号: H01S5/02423

    摘要: A laser system that allows transverse arrangement of laser emitters around a laser medium. The system includes a laser medium with a coolant source such as a pump and electrical controls. A pump layer has a mounting surface, an opposite bottom surface and a center aperture through which the laser medium is inserted. A plurality of laser diode emitters are disposed on the mounting surface of the pump layer circumferentially around the laser medium. An intermediate layer has at least one radial channel in fluid communication with the coolant conduit of the pump layer. The intermediate layer is in contact with the bottom surface of the pump layer. A middle layer has a plurality of micro-channels formed therethrough and a center aperture. The micro-channels are radially arranged around the center aperture and the middle layer in contact with the intermediate layer. The coolant source is fluidly coupled to the micro-channels to allow coolant to be directed through the microchannels and the radial channel to impinge on the bottom surface of the pump layer.

    摘要翻译: 激光系统允许激光发射器在激光介质周围进行横向排列。 该系统包括具有诸如泵和电气控制的冷却剂源的激光介质。 泵层具有安装表面,相对的底表面和激光介质插入的中心孔。 多个激光二极管发射器围绕激光介质设置在泵层的安装表面上。 中间层具有与泵层的冷却剂导管流体连通的至少一个径向通道。 中间层与泵层的底面接触。 中间层具有穿过其形成的多个微通道和中心孔。 微通道围绕中心孔和中间层径向布置,与中间层接触。 冷却剂源流体耦合到微通道,以允许冷却剂被引导通过微通道和径向通道以撞击泵层的底表面。

    Method of manufacturing laser diode packages and arrays
    9.
    发明授权
    Method of manufacturing laser diode packages and arrays 有权
    制造激光二极管封装和阵列的方法

    公开(公告)号:US07724791B2

    公开(公告)日:2010-05-25

    申请号:US12009458

    申请日:2008-01-18

    IPC分类号: H01S3/04

    摘要: A laser diode package according to the present invention is composed of CTE mismatched components soldered together. The laser diode package includes a laser diode bar, at least one heat sink, and at least one exothermic layer. Solder layers are adjacent the heat sink(s) and laser diode bar, respectively. The exothermic layer(s) are positioned between the solder layers. The exothermic layer(s) are exposed to an energy source which causes an exothermic reaction to propagate through the exothermic layer thereby melting the solder layers and solder layers. The exothermic layer(s) may be designed to provide sufficient heat to melt the solder layers and solder layers but provide only minimal heat to the laser diode bar and heat sink(s). Several packages can be stacked together to form a laser diode array.

    摘要翻译: 根据本发明的激光二极管封装由焊接在一起的CTE不匹配部件组成。 激光二极管封装包括激光二极管条,至少一个散热器和至少一个放热层。 焊料层分别与散热片和激光二极管条相邻。 放热层位于焊料层之间。 放热层暴露于能量源,其使放热反应传播通过放热层,从而熔化焊料层和焊料层。 放热层可以设计成提供足够的热量来熔化焊料层和焊料层,但是仅向激光二极管条和散热器提供最小的热量。 可以将多个封装堆叠在一起以形成激光二极管阵列。

    Microchannel cooler for a single laser diode emitter based system
    10.
    发明授权
    Microchannel cooler for a single laser diode emitter based system 有权
    用于单个激光二极管发射器的系统的微通道冷却器

    公开(公告)号:US09590388B2

    公开(公告)日:2017-03-07

    申请号:US13004536

    申请日:2011-01-11

    IPC分类号: H01S5/024

    CPC分类号: H01S5/02423

    摘要: A laser system that allows transverse arrangement of laser emitters around a laser medium. The system includes a laser medium with a coolant source and electrical controls. A pump layer has a mounting surface, an opposite bottom surface and a center aperture through which the laser medium is inserted. Laser diode emitters are disposed on the mounting surface circumferentially around the laser medium. An intermediate layer has at least one radial channel in fluid communication with the coolant conduit. The intermediate layer is in contact with the bottom surface. A middle layer has micro-channels formed therethrough and a center aperture. The micro-channels are radially arranged around the center aperture and the middle layer is in contact with the intermediate layer. The coolant source is fluidly coupled to the micro-channels to allow coolant to be directed through the microchannels and the radial channel to impinge on the bottom surface.

    摘要翻译: 激光系统允许激光发射器在激光介质周围进行横向排列。 该系统包括具有冷却剂源和电气控制的激光介质。 泵层具有安装表面,相对的底表面和激光介质插入的中心孔。 激光二极管发射器围绕激光介质周向设置在安装表面上。 中间层具有与冷却剂导管流体连通的至少一个径向通道。 中间层与底面接触。 中间层具有通过其形成的微通道和中心孔。 微通道围绕中心孔径向布置,中间层与中间层接触。 冷却剂源流体耦合到微通道,以允许冷却剂被引导通过微通道并且径向通道撞击在底表面上。