摘要:
A laser diode package (10) according to the present invention is tolerant of short-circuit and open-circuit failures. The laser diode package (10) includes a laser diode bar (12), a forward-biased diode (14), a heat sink (18), and a lid (16) which may have fusible links (86). The laser diode bar (12) and the forward-biased diode (14) are electrically connected in parallel between the heat sink (18) and the lid (16). The emitting region of the laser diode bar (12) is aligned to emit radiation away from the forward-biased diode (14). Several packages can be stacked together to form a laser diode array (42). The forward-biased diode (14) allows current to pass through it when an open-circuit failure has occurred in the corresponding laser diode bar (12), thus preventing an open-circuit failure from completely disabling the array (42). The fusible links (86), if used on the lid (16), prevent damaged active regions (90) in a laser diode bar (12) from short-circuiting and drawing more electrical current than the other active regions (90).
摘要:
A laser diode package (10) according to the present invention is tolerant of short-circuit and open-circuit failures. The laser diode package (10) includes a laser diode bar (12), a forward-biased diode (14), a heat sink (18), and a lid (16) which may have fusible links (86). The laser diode bar (12) and the forward-biased diode (14) are electrically connected in parallel between the heat sink (18) and the lid (16). The emitting region of the laser diode bar (12) is aligned to emit radiation away from the forward-biased diode (14). Several packages can be stacked together to form a laser diode array (42). The forward-biased diode (14) allows current to pass through it when an open-circuit failure has occurred in the corresponding laser diode bar (12), thus preventing an open-circuit failure from completely disabling the array (42). The fusible links (86), if used on the lid (16), prevent damaged active regions (90) in a laser diode bar (12) from short-circuiting and drawing more electrical current than the other active regions (90).
摘要:
A laser diode package (10) according to the present invention is tolerant of short-circuit and open-circuit failures. The laser diode package (10) includes a laser diode bar (12), a forward-biased diode (14), a heat sink (18), and a lid (16) which may have fusible links (86). The laser diode bar (12) and the forward-biased diode (14) are electrically connected in parallel between the heat sink (18) and the lid (16). The emitting region of the laser diode bar (12) is aligned to emit radiation away from the forward-biased diode (14). Several packages can be stacked together to form a laser diode array (42). The forward-biased diode (14) allows current to pass through it when an open-circuit failure has occurred in the corresponding laser diode bar (12), thus preventing an open-circuit failure from completely disabling the array (42). The fusible links (86), if used on the lid (16), prevent damaged active regions (90) in a laser diode bar (12) from short-circuiting and drawing more electrical current than the other active regions (90).
摘要:
A method of fabricating a high-density laser diode stack is disclosed. The laser diode bars each have an emitter surface and opposing surfaces on either side of the emitter surface. Each laser diode bar has metallization layers on the opposing surfaces and a solder layer on at least one of the metallization layers. The solder layer is applied to a semiconductor wafer prior to cleaving the wafer to create the laser diode bars. The laser diode bars are arranged in a stack such that the emitter surfaces of the bars are facing the same direction. The stack of laser diode bars is placed in a vacuum chamber. An anti-reflection coating is deposited on the emitter surfaces of the laser diode bars in the chamber. The laser diode bars are joined by applying a temperature sufficient to reflow the solder layers in the chamber.
摘要:
A laser diode package includes a laser diode, a cooler, and control circuitry, such as an integrated circuit. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets. The ceramic sheets are fused together. The ceramic sheets include traces or vias that provide electrically conductive paths to the integrated circuit. The control circuitry controls the output of the laser diode, e.g. the output at each of the laser diode's emitters. Multiple laser diode packages are placed together to form an array.
摘要:
A method of fabricating a high-density laser diode stack is disclosed. The laser diode bars each have an emitter surface and opposing surfaces on either side of the emitter surface. Each laser diode bar has metallization layers on the opposing surfaces and a solder layer on at least one of the metallization layers. The solder layer is applied to a semiconductor wafer prior to cleaving the wafer to create the laser diode bars. The laser diode bars are arranged in a stack such that the emitter surfaces of the bars are facing the same direction. The stack of laser diode bars is placed in a vacuum chamber. An anti-reflection coating is deposited on the emitter surfaces of the laser diode bars in the chamber. The laser diode bars are joined by applying a temperature sufficient to reflow the solder layers in the chamber.
摘要:
A laser diode package includes a laser diode, a cooler, and control circuitry, such as an integrated circuit. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets. The ceramic sheets are fused together. The ceramic sheets include traces or vias that provide electrically conductive paths to the integrated circuit. The control circuitry controls the output of the laser diode, e.g. the output at each of the laser diode's emitters. Multiple laser diode packages are placed together to form an array.
摘要:
A laser system that allows transverse arrangement of laser emitters around a laser medium. The system includes a laser medium with a coolant source such as a pump and electrical controls. A pump layer has a mounting surface, an opposite bottom surface and a center aperture through which the laser medium is inserted. A plurality of laser diode emitters are disposed on the mounting surface of the pump layer circumferentially around the laser medium. An intermediate layer has at least one radial channel in fluid communication with the coolant conduit of the pump layer. The intermediate layer is in contact with the bottom surface of the pump layer. A middle layer has a plurality of micro-channels formed therethrough and a center aperture. The micro-channels are radially arranged around the center aperture and the middle layer in contact with the intermediate layer. The coolant source is fluidly coupled to the micro-channels to allow coolant to be directed through the microchannels and the radial channel to impinge on the bottom surface of the pump layer.
摘要:
A laser diode package according to the present invention is composed of CTE mismatched components soldered together. The laser diode package includes a laser diode bar, at least one heat sink, and at least one exothermic layer. Solder layers are adjacent the heat sink(s) and laser diode bar, respectively. The exothermic layer(s) are positioned between the solder layers. The exothermic layer(s) are exposed to an energy source which causes an exothermic reaction to propagate through the exothermic layer thereby melting the solder layers and solder layers. The exothermic layer(s) may be designed to provide sufficient heat to melt the solder layers and solder layers but provide only minimal heat to the laser diode bar and heat sink(s). Several packages can be stacked together to form a laser diode array.
摘要:
A laser system that allows transverse arrangement of laser emitters around a laser medium. The system includes a laser medium with a coolant source and electrical controls. A pump layer has a mounting surface, an opposite bottom surface and a center aperture through which the laser medium is inserted. Laser diode emitters are disposed on the mounting surface circumferentially around the laser medium. An intermediate layer has at least one radial channel in fluid communication with the coolant conduit. The intermediate layer is in contact with the bottom surface. A middle layer has micro-channels formed therethrough and a center aperture. The micro-channels are radially arranged around the center aperture and the middle layer is in contact with the intermediate layer. The coolant source is fluidly coupled to the micro-channels to allow coolant to be directed through the microchannels and the radial channel to impinge on the bottom surface.