公开(公告)号：US5939828A

公开(公告)日：1999-08-17

申请号：US906264

申请日：1997-08-05

申请人： Eiji Matsuzaki ,  Nobuyuki Ushifusa ,  Seiichi Tsuchida ,  Kazuo Suzuki ,  Teruo Takai ,  Kyoko Amemiya ,  Shiyuki Sakaue ,  Fusaji Shoji

发明人： Eiji Matsuzaki ,  Nobuyuki Ushifusa ,  Seiichi Tsuchida ,  Kazuo Suzuki ,  Teruo Takai ,  Kyoko Amemiya ,  Shiyuki Sakaue ,  Fusaji Shoji

IPC分类号： H01J9/38 ,  G09F9/313 ,  H01J9/02 ,  H01J11/12 ,  H01J11/20 ,  H01J11/24 ,  H01J11/26 ,  H01J11/28 ,  H01J11/32 ,  H01J11/34 ,  H01J11/36 ,  H01J11/38 ,  H01J11/40 ,  H01J11/42 ,  H01J11/44 ,  H01J11/50 ,  H01J17/49 ,  G09G3/28

CPC分类号： H01J11/32 ,  H01J11/12 ,  H01J2211/326

摘要： In order to reduce the address voltage in a gas discharge type display pane, the address electrodes in the display panel are formed on the barrier ribs. Further, a fluorescent layer is coated on the wall surface of the barrier ribs thereby suppressing erroneous light emission or degradation of the fluorescent layer during address discharge.

摘要翻译： 为了降低气体放电型显示窗格中的寻址电压，显示面板中的寻址电极形成在隔壁上。 此外，荧光层被涂覆在隔壁的壁表面上，从而在寻址放电期间抑制荧光层的错误发光或劣化。

公开(公告)号：US5150274A

公开(公告)日：1992-09-22

申请号：US727042

申请日：1991-07-09

申请人： Kenichi Okada ,  Kyoko Amemiya ,  Takao Terabayashi ,  Hideaki Sasaki ,  Kuninori Imai ,  Shinichi Kazui

发明人： Kenichi Okada ,  Kyoko Amemiya ,  Takao Terabayashi ,  Hideaki Sasaki ,  Kuninori Imai ,  Shinichi Kazui

IPC分类号： H01L23/373 ,  H01L23/433 ,  H01L23/473

CPC分类号： H01L23/3733 ,  H01L23/4338 ,  H01L23/473 ,  H01L2224/16 ,  H01L2224/73253

摘要： A multi-channel module with a plurality of chips is mounted on a multilayer circuit board and has a simple and highly reliable structure cooling system for cooling the heat generated by the chips consuming a large amount of electric power. The cooling system uses in the horizontal direction a coolant supply pipe having straight tube sections and flexible bellows sections alternately disposed in the axial direction of the pipe. The straight tube sections of the aforesaid coolant supply pipe are brought into contact with the upper faces of the chips by a spring force so as to cool continuously the plurality of chips with the coolant flowing in one coolant supply pipe thereby providing a simply structured cooling system for chips. Such a structured cooling system enables the collective assembly of cooling parts for a plurality of chips with only a small number of parts and produces highly reliable effects thereby being able to implement the miniaturization of a main frame computer.

摘要翻译： 具有多个芯片的多通道模块安装在多层电路板上，并且具有简单且高度可靠的结构冷却系统，用于冷却由消耗大量电力的芯片产生的热量。 冷却系统在水平方向上使用具有直管段的冷却剂供应管和沿管的轴向交替设置的柔性波纹管部。 上述冷却剂供给管的直管段通过弹簧力与芯片的上表面接触，以便冷却剂在一个冷却剂供应管中流动而连续地冷却多个芯片，从而提供简单的结构化冷却系统 用于芯片 这种结构化的冷却系统使得能够将多个芯片的冷却部件集中组装，仅具有少量的部件，并且产生高度可靠的效果，从而能够实现主机计算机的小型化。