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公开(公告)号：US20110297318A1
公开(公告)日：2011-12-08
申请号：US13211908
申请日：2011-08-17
申请人： Emilie Barriau , David Farrell , Dennis Bankmann , Michael Doherty , Ciaran B. McArdle , Martin Renkel , Sven Wucherpfennig , Siegfried Kopannia
发明人： Emilie Barriau , David Farrell , Dennis Bankmann , Michael Doherty , Ciaran B. McArdle , Martin Renkel , Sven Wucherpfennig , Siegfried Kopannia
IPC分类号： B32B37/12
CPC分类号： B32B1/08 , B32B5/147 , B32B15/08 , B32B15/18 , B32B15/20 , B32B27/285 , B32B27/32 , B32B27/34 , B32B27/36 , B32B27/365 , B32B37/12 , B32B37/153 , B32B2307/714 , B32B2309/02 , B32B2597/00 , C09J163/00 , F16L58/1054
摘要： A process of bonding a metal substrate to a non-halogenated polymer, especially of bonding a polyolefin overcoat to a metallic tube or pipe, using an epoxy-based adhesive which comprises at least one salt of a metal ion M in an oxidation state of n which has a standard reduction potential E0M more positive than the standard reduction potential of the surface of the metal substrate; an object comprising a metal substrate and a non-halogenated polymer bonded together by this process; a tube or pipe made of a metal substrate onto which a layer of a non-halogenated polymer is bonded by a cured epoxy-based adhesive.
摘要翻译： 使用包含至少一种氧化态为n的金属离子M的盐的环氧基粘合剂将金属基材与非卤化聚合物结合，特别是将聚烯烃外涂层粘合到金属管或管上的方法 其具有比金属基板的表面的标准还原电位更正的标准还原电位E0M; 包括通过该方法粘合在一起的金属基底和非卤化聚合物的物体; 由金属基材制成的管或管，其上通过固化的环氧基粘合剂将非卤化聚合物层粘合在该基材上。
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公开(公告)号：US5883172A
公开(公告)日：1999-03-16
申请号：US939425
申请日：1997-09-29
IPC分类号： C08G69/34 , C09J177/08 , C08K3/26 , C08L77/08
CPC分类号： C09J177/08 , C08G69/34
摘要： A composition of matter useful as a hotmelt adhesive is provided. The composition is comprised of a polyamide based on dimerized fatty acid and having an amine value higher by at least two units than the acid value of said polyamide and a filler comprised of a carbonate. The filler is preferably comprised of fine particles of calcium carbonate. The adhesive is particularly useful for bonding metals, e.g. to plastics and the bonding of cables with multilayer sheaths, e.g. in optical cables and power cables.
摘要翻译： 提供了用作热熔粘合剂的物质组合物。 该组合物由基于二聚脂肪酸的聚酰胺组成，并且胺值比所述聚酰胺的酸值和由碳酸酯组成的填料高至少两个单位。 填料优选由碳酸钙的细颗粒组成。 粘合剂特别适用于粘合金属，例如 塑料和电缆与多层护套的接合，例如。 在光缆和电力电缆。
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公开(公告)号：US20120175817A1
公开(公告)日：2012-07-12
申请号：US13423670
申请日：2012-03-19
申请人： Bettina Becker , Siegfried Kopannia , Tina Nataniel , Fabio Ticozzelli , Dwight Heinrich , Luca Marchese
发明人： Bettina Becker , Siegfried Kopannia , Tina Nataniel , Fabio Ticozzelli , Dwight Heinrich , Luca Marchese
IPC分类号： B29C45/00
CPC分类号： C08G69/265 , C08G69/34 , C08G69/40 , C08L77/08
摘要： The invention relates to the use of polyamides on the basis of reaction products from at least one dimeric fatty acid, at least one aliphatic dicarboxylic acid having 6 to 24 C atoms and aliphatic, cycloaliphatic and/or polyether diamines, wherein the quantities of amine components are selected so that primarily terminal amine groups are contained therein, and the polyamide comprises an amine count from 2 to 20 mg KOH/g to produce molded parts in the low pressure injection molding method.
摘要翻译： 本发明涉及基于来自至少一种二聚脂肪酸，至少一种具有6至24个C原子的脂族二羧酸和脂族，脂环族和/或聚醚二胺的反应产物的聚酰胺的用途，其中胺组分 被选择为使得主要包含末端胺基团，并且聚酰胺包含2至20mg KOH / g的胺计数，以在低压注射成型方法中制备模制部件。
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公开(公告)号：US20090291288A1
公开(公告)日：2009-11-26
申请号：US12474559
申请日：2009-05-29
CPC分类号： C08J5/128 , C08L23/0869 , C08L77/00
摘要： The invention relates to a molded part for bonding to metal or plastic substrates for use as a fastening element. Said molded part comprises a hot melt adhesive, said hot melt adhesive being based on polyamide, polyolefins, polyesters, polyacrylates or polystyrene. The molded part according to the invention is characterized in that the hot melt adhesive has a softening point between 100° and 250° C., a tensile stress at yield of between 1 and 35 MPa and the molded part consists entirely of the hot melt adhesive. The invention also relates to a method for bonding molded parts from hot melt adhesives to substrates by way of inductive heating.
摘要翻译： 本发明涉及一种用于粘接到用作紧固元件的金属或塑料基底的模制部件。 所述模制部件包括热熔粘合剂，所述热熔粘合剂基于聚酰胺，聚烯烃，聚酯，聚丙烯酸酯或聚苯乙烯。 根据本发明的模制部件的特征在于，热熔粘合剂的软化点在100℃和250℃之间，产率在1和35MPa之间的拉伸应力和模制部件完全由热熔粘合剂 。 本发明还涉及通过感应加热将模制部件从热熔胶粘合剂粘合到基板上的方法。
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公开(公告)号：US20080196831A1
公开(公告)日：2008-08-21
申请号：US12027418
申请日：2008-02-07
申请人： Carsten Friese , Rainer Schoenfeld , Siegfried Kopannia , Julius Herold , Karel Mazac , Christian Lammel
发明人： Carsten Friese , Rainer Schoenfeld , Siegfried Kopannia , Julius Herold , Karel Mazac , Christian Lammel
IPC分类号： B29C65/14
CPC分类号： C09J5/06 , B60J1/006 , C03C27/048 , C09J5/10 , C09J2400/143 , C09J2400/163
摘要： A method of adhesively bonding a first component to a second component, which comprises a peripheral zone with which the first component is adhesively bonded in overlapping manner is provided. In such method, a) at least one body of hot-melt adhesive is adhesively bonded to the first component in such a way that it comes into contact with the peripheral zone upon adhesive bonding of the first component to the second component, b) the peripheral zone is heated locally at at least one point, at which the applied body of hot-melt adhesive comes into contact with the peripheral zone upon adhesive bonding of the first component, indirectly or directly by electromagnetic induction to a temperature above the melting temperature of the hot-melt adhesive, c) the first component is brought into contact with the peripheral zone of the second component in such a way that the body of the hot-melt adhesive comes into contact with the point of the peripheral zone heated in step b), such that the hot-melt adhesive melts at the point of contact with the peripheral zone and bonds the first component to the peripheral zone of the second component after cooling. In addition, prior to step b) or after step c) a reactive adhesive is introduced in such a way between the first and the second component that it bonds the first component to the peripheral zone of the second component, the reactive adhesive being cured or allowed to cure.
摘要翻译： 提供了将第一部件粘合到第二部件上的方法，该第二部件包括与第一部件以重叠方式粘合的周边区域。 在这种方法中，a）至少一个热熔粘合剂体以与第一组分粘合到第二组分的方式与第一组分粘合，使其与周边区接触，b） 周边区域在至少一个点处被局部加热，在该点处，施加的热熔粘合剂体通过第一部件的粘合而间接地或直接地通过电磁感应而与周边区域接触，其温度高于 所述热熔粘合剂，c）使所述第一部件与所述第二部件的周边区域接触，使得所述热熔粘合剂的主体与步骤b中加热的周边区域的点接触 ），使得热熔粘合剂在与周边区域接触的点处熔融，并且在冷却后将第一组分粘合到第二组分的周边区域。 此外，在步骤b）之前或步骤c）之后，反应性粘合剂以这样的方式引入第一和第二组分之间，使其将第一组分与第二组分的周边区结合，反应性粘合剂被固化或 允许治愈
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公开(公告)号：US06677394B1
公开(公告)日：2004-01-13
申请号：US08991365
申请日：1997-12-16
IPC分类号： C08K505
CPC分类号： G02B6/4494 , H01B7/288
摘要： Thermoplastic compositions based on a water-insoluble component of one or more thermoplastic copolymers and one or more resins with a saponification number and a water-soluble or water-dispersible component and a water-swellable component from the class of superabsorbers are suitable as water-swellable hotmelt adhesives. Such water-swellable hotmelt adhesives are preferably used for the production of watertight constructions, more particularly for the production of longitudinally watertight cable constructions.
摘要翻译： 基于一种或多种热塑性共聚物的水不溶性组分和一种或多种皂化物和水溶性或水分散性组分的树脂和来自超吸收剂类的水溶胀性组分的热塑性组合物适合作为水 - 可膨胀热熔胶。 这种水溶胀性热熔粘合剂优选用于生产水密结构，更具体地用于生产纵向水密电缆结构。
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公开(公告)号：US06228456B1
公开(公告)日：2001-05-08
申请号：US09380863
申请日：1999-09-09
IPC分类号： B32B302
CPC分类号： G11B7/26 , Y10S428/913 , Y10S430/146 , Y10T428/21 , Y10T428/31678
摘要： Hotmelt adhesives with a melt viscosity of >100,000 mPas at 160° C. are suitable for bonding substrate halves in the production of digital versatile discs (DVDs) and afford major process-related advantages over known UV-curing adhesives. In their pigmented embodiment, they are able to combine the three functions of adhesive bonding, protecting the metallic reflection layer against corrosion and forming a covering background for a text/graphics layer.
摘要翻译： 在160℃下熔体粘度> 100,000mPa·s的热熔粘合剂适用于在半导体制造数字多功能光盘（DVD）中粘合，并且比已知的UV固化粘合剂提供主要的工艺相关优点。 在它们着色的实施例中，它们能够结合粘合剂粘合的三个功能，保护金属反射层免受腐蚀并形成文本/图形层的覆盖背景
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公开(公告)号：US06803400B1
公开(公告)日：2004-10-12
申请号：US09646321
申请日：2001-03-30
IPC分类号： C08J300
CPC分类号： D06M17/06 , C08L23/0869 , C08L33/08 , C08L33/10 , C08L71/02 , C08L2205/02 , C08L2205/03 , C08L2666/02 , C09J11/08 , C09J123/0853 , D04H1/587 , D04H1/64
摘要： Water-swellable hot-melt adhesives based on a tackifying resin, a water-dispersible EVA wax, an ethylene/acrylic ester copolymer, a water-soluble homo- or co-polymer and a super absorber polymer powder having an average particle size of less than 80 &mgr;m display a clearly improved swelling behavior in comparison with the prior art. Furthermore, the swelling agent is significantly more homogeneously distributed in the matrix. Such hot-melt adhesives are suitable for ensuring longitudinal water impermeability in modern cable structures, as water-swellable jointing compounds in the building industry in the area of building conservation and restoration. Such hot-melt adhesives are further suitable for the manufacture of absorbent textile fabrics in the personal hygiene sector.
摘要翻译： 基于增粘树脂，水分散性EVA蜡，乙烯/丙烯酸酯共聚物，水溶性均聚物或共聚物和平均粒径较小的超吸收剂聚合物粉末的水溶胀性热熔粘合剂 与现有技术相比，超过80μm显示出明显改善的溶胀行为。 此外，溶胀剂显着更均匀地分布在基质中。 这种热熔粘合剂适用于确保现代电缆结构中的纵向防水性，作为建筑行业在建筑保护和恢复方面的水溶胀性接合化合物。 这种热熔粘合剂还适用于在个人卫生领域中制造吸收性纺织物。
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公开(公告)号：US06767424B1
公开(公告)日：2004-07-27
申请号：US09807837
申请日：2001-08-03
IPC分类号： B29C4700
CPC分类号： G11B7/26 , C08L53/02 , C08L53/025 , C08L2666/02 , C08L2666/04
摘要： The present invention relates to a process for preparing a digital versatile disc. The process of the present invention includes providing a hot melt adhesive containing at least one thermoplastic elastomer, at least one hydrocarbon resin, at least one poly-&agr;-olefin, and at least one polar wax, and providing at least two disc blanks. The hot melt adhesive is applied directly or indirectly to at least one of the blanks and the blanks are bonded together using the hot melt adhesive. The present invention also provides a digital versatile disc containing the hot melt adhesive.
摘要翻译： 本发明涉及一种数字通用盘的制备方法。 本发明的方法包括提供含有至少一种热塑性弹性体，至少一种烃树脂，至少一种聚-α-烯烃和至少一种极性蜡的热熔粘合剂，并提供至少两个盘坯料。 将热熔粘合剂直接或间接施加到至少一个坯料上，并且使用热熔粘合剂将坯料粘合在一起。 本发明还提供一种包含热熔粘合剂的数字通用盘。
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公开(公告)号：US5548027A
公开(公告)日：1996-08-20
申请号：US307854
申请日：1994-10-13
IPC分类号： C08L77/00 , C08L77/08 , C09J123/08 , C09J125/00 , C09J125/10 , C09J131/04 , C09J177/00 , C09J177/08
CPC分类号： C09J177/08 , C08L77/08
摘要： A hotmelt adhesive based on a number of components is provided. One of the components is at least one polyamide based on dimerized fatty acid, said polyamide being present in an amount by weight of the composition of at least 50%. Another component is from at least one ethylene copolymer selected from the group consisting of ethylene/vinyl acetate, ethylene/acrylate, said acrylate being derived from an alcohol containing 1 to 18 carbon atoms, and ethylene/methacrylate, said methacrylate being derived from an alcohol containing 1 to 18 carbon atoms, said ethylene copolymer being present in an amount by weight of the composition of 5 to 20%. Another component is at least one copolymer of styrene with one or more members selected from the group consisting of ethylene, isoprene and butylene, said copolymer of styrene being present in an amount by weight of the composition of 2 to 10%. Another component is at least one plasticizer, said plasticizer being present in an amount by weight of the composition of 5 to 25% by weight. Optional components are 0 to 10% by weight of at least one tackifying resin from the group consisting of polycyclopentadiene, polyterpene, liquid hydrocarbon resin and 0 to 15% by weight of at least one copolymer of monomers selected from the group consisting of ethylene, propylene, butylene and maleic anhydride.
摘要翻译： PCT No.PCT / EP93 / 00728 Sec。 371日期：1994年10月13日 102（e）日期1994年10月13日PCT 1993年3月25日PCT公布。 WO93 / 20166 PCT公开号 日期：1993年10月14日提供了基于多种成分的热熔粘合剂。 组分之一是至少一种基于二聚脂肪酸的聚酰胺，所述聚酰胺以组合物的重量计存在至少50％。 另一组分是选自乙烯/乙酸乙烯酯，乙烯/丙烯酸酯，所述丙烯酸酯衍生自含有1至18个碳原子的醇和乙烯/甲基丙烯酸酯的至少一种乙烯共聚物，所述甲基丙烯酸酯衍生自醇 含有1至18个碳原子，所述乙烯共聚物的存在量为组合物重量的5-20％。 另一组分是苯乙烯与一种或多种选自乙烯，异戊二烯和丁烯的成员的至少一种共聚物，所述苯乙烯共聚物的存在量为组合物重量的2-10％。 另一种成分是至少一种增塑剂，所述增塑剂的含量按组合物重量的5至25％（重量）存在。 任选的组分为至少一种由聚环戊二烯，多萜烯，液体烃树脂组成的组中的至少一种增粘树脂和0至15重量％的至少一种选自乙烯，丙烯 ，丁烯和马来酸酐。
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