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公开(公告)号：US08919563B2
公开(公告)日：2014-12-30
申请号：US13847345
申请日：2013-03-19
申请人： Entegris, Inc.
IPC分类号： H01L21/673 , H01L21/677
CPC分类号： B65D25/103 , B65D25/28 , B65D43/02 , B65D85/70 , H01L21/6732 , H01L21/67369 , H01L21/67383 , H01L21/67386 , H01L21/67763
摘要： A front semiconductor opening wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. The container portion can accommodate large diameter wafers, particularly 450 mm wafers. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.
摘要翻译： 用于大直径晶片的前半导体开口晶片容器包括容器部分和门。 容器部分包括左封闭侧，右封闭侧，闭合背部，开放前部和包括用于接收和容纳晶片的多个狭槽的开放内部。 门可附接到容器部分以封闭敞开的前部，并可选择性地闩锁到容器部分。 容器部分可以容纳大直径晶片，特别是450mm晶片。 提供优化的下垂控制以及增强的结构刚度和晶片座位功能。
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公开(公告)号：US10304710B2
公开(公告)日：2019-05-28
申请号：US14899423
申请日：2014-06-18
申请人： ENTEGRIS, INC.
发明人： Eric A. Kirkland , Barry Gregerson , Eric S. Olson , Christian Andersen , Jason Todd Steffens , Ryan Mushel , Karen Anderson
IPC分类号： H01L21/673
摘要： Apparatuses and methods providing a ballast system for adjusting the center of gravity of a standardized front opening wafer container. Various embodiments of the disclosure present ballast systems that are low profile, do not require modifications to the shell of the wafer container, and can be retrofit to existing wafer carriers. In some embodiments, these capabilities are accomplished by a ballast that mounts to a kinematic coupling plate of the wafer container. In one embodiment, the ballasting can also provide sufficient counter force to the lifting forces associated with purging of the wafer container, thereby preventing “lift off” of the wafer container during purging operations. The ballasts can be removed for shipping of the wafer container, thereby decreasing shipping costs.
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公开(公告)号：US10276414B2
公开(公告)日：2019-04-30
申请号：US15269368
申请日：2016-09-19
申请人： Entegris, Inc.
IPC分类号： H01L21/673
摘要： An improved wafer support mechanism in a wafer container useful for carrying a plurality of axially aligned thin mostly circular wafer substrates. The container includes a cassette that has a plurality of adjacently disposed teeth for receiving the substrates, wherein each rib member is continuous from the cassette open top to the cassette open bottom, a removable top cover portion, a removable bottom cover portion, a cushion assembly removably attached to the container top cover, and another cushion assembly removably located in the container bottom cover and held in place by the weight of the wafer cassette. The top cushions are formed of individual segments having an extended lead-in feature at the end of each segment, spring sections in each segment and each segment has a V-shaped cross section to receive the wafer edge. The top and bottom cushions are installed in the top and bottom container covers, respectively, and extend the wafer support to approximately the entire circumference of each wafer.
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公开(公告)号：US09478450B2
公开(公告)日：2016-10-25
申请号：US14391696
申请日：2013-04-09
申请人： ENTEGRIS, INC.
IPC分类号： B65D85/30 , B65D85/00 , H01L21/673
CPC分类号： H01L21/67369 , H01L21/67383 , H01L21/67386
摘要： A wafer container for holding a spaced stack of thin wafers, comprising an H-bar carrier, a base portion for receiving same, a base wafer cushion attached at the bottom wall positioned below the H-bar carrier, the cushion having a plurality of ribs defining slots each with a bottom wafer seating region having a curvature and a pair of ends, each of the ends having a flare whereby the seating region flares outwardly at the ends, a cover portion that connects with the base portion to form a closed interior. The cover portion having an uppermost wall a wafer cushion secured thereto. The cover wafer cushion having a row of wafer engaging finger portions, the finger portions Y shaped and having two legs extending from a support portion and alternatingly extending from opposing support portions, the finger portions may be S shaped with a wafer pad flared in two direction.
摘要翻译： 一种晶片容器，用于保持间隔堆叠的薄晶片，包括H型棒载体，用于接收它的基座部分，安装在位于H型棒载体下方的底壁处的基底晶片垫，该衬垫具有多个肋 限定槽，每个槽具有具有曲率和一对端部的底部晶片座位区域，每个端部具有喇叭口，从而座部区域在端部向外张开，盖部分，其与基部部分连接以形成封闭的内部。 所述盖部分具有固定到其上的晶片缓冲垫的最上壁。 覆盖晶片衬垫具有一排晶片接合指状部分，指状部分Y成形并具有从支撑部分延伸并从相对的支撑部分交替延伸的两个支腿，指状部分可以是S形，其中晶片垫沿两个方向扩张 。
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公开(公告)号：US20150068949A1
公开(公告)日：2015-03-12
申请号：US14391696
申请日：2013-04-09
申请人： ENTEGRIS, INC.
IPC分类号： H01L21/673
CPC分类号： H01L21/67369 , H01L21/67383 , H01L21/67386
摘要： A wafer container for holding a spaced stack of thin wafers, comprising an H-bar carrier, a base portion for receiving same, a base wafer cushion attached at the bottom wall positioned below the H-bar carrier, the cushion having a plurality of ribs defining slots each with a bottom wafer seating region having a curvature and a pair of ends, each of the ends having a flare whereby the seating region flares outwardly at the ends, a cover portion that connects with the base portion to form a closed interior. The cover portion having an uppermost wall a wafer cushion secured thereto. The cover wafer cushion having a row of wafer engaging finger portions, the finger portions Y shaped and having two legs extending from a support portion and alternatingly extending from opposing support portions, the finger portions may be S shaped with a wafer pad flared in two direction.
摘要翻译： 一种晶片容器，用于保持间隔堆叠的薄晶片，包括H型棒载体，用于接收它的基座部分，安装在位于H型棒载体下方的底壁处的基底晶片垫，该衬垫具有多个肋 限定槽，每个槽具有具有曲率和一对端部的底部晶片座位区域，每个端部具有喇叭口，从而座部区域在端部向外张开，盖部分，其与基部部分连接以形成封闭的内部。 所述盖部分具有固定到其上的晶片缓冲垫的最上壁。 覆盖晶片衬垫具有一排晶片接合指状部分，指状部分Y成形并具有从支撑部分延伸并从相对的支撑部分交替延伸的两个支腿，指状部分可以是S形，其中晶片垫沿两个方向扩张 。
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