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1.
公开(公告)号:US09960468B2
公开(公告)日:2018-05-01
申请号:US13607539
申请日:2012-09-07
申请人: Sean S. Cahill , Eric A. Sanjuan
发明人: Sean S. Cahill , Eric A. Sanjuan
CPC分类号: H01P1/208 , H01P1/207 , H01P1/213 , H01P1/2138 , H01P5/12 , H01P11/002 , Y10T29/49016
摘要: Waveguide components that have a high degree of performance accuracy over the temperature range of interest are provided. The components require no post-formation trimming steps, are light-weight, and dimensionally stable. In addition, a method for the manufacture of these millimeter wave components is provided.
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公开(公告)号:US08839508B2
公开(公告)日:2014-09-23
申请号:US13308351
申请日:2011-11-30
申请人: Eric A. Sanjuan , Sean S. Cahill
发明人: Eric A. Sanjuan , Sean S. Cahill
IPC分类号: H01R43/00 , H01L23/66 , H01L23/00 , H01L23/047 , H05K1/02
CPC分类号: H01L23/66 , H01L23/047 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2223/6627 , H01L2224/05599 , H01L2224/32245 , H01L2224/45014 , H01L2224/45015 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48471 , H01L2224/4903 , H01L2224/73265 , H01L2224/8592 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/181 , H01L2924/1903 , H01L2924/19032 , H01L2924/19033 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H05K1/0243 , Y10T29/49002 , Y10T29/49018 , Y10T29/49121 , Y10T29/49126 , Y10T29/49144 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/45099 , H01L2924/20752
摘要: A fabrication method for a low-cost high-frequency electronic device package having waveguide structures formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.
摘要翻译: 一种低成本高频电子器件封装的制造方法,其具有由高频器件到封装引线转变形成的波导结构。 封装引线转换优化,以利用波导互连结构。
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公开(公告)号:US08581113B2
公开(公告)日:2013-11-12
申请号:US11960681
申请日:2007-12-19
申请人: Eric A. Sanjuan , Sean S. Cahill
发明人: Eric A. Sanjuan , Sean S. Cahill
IPC分类号: H05K1/11
CPC分类号: H01L23/66 , H01L23/047 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2223/6627 , H01L2224/05599 , H01L2224/32245 , H01L2224/45014 , H01L2224/45015 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48471 , H01L2224/4903 , H01L2224/73265 , H01L2224/8592 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/181 , H01L2924/1903 , H01L2924/19032 , H01L2924/19033 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H05K1/0243 , Y10T29/49002 , Y10T29/49018 , Y10T29/49121 , Y10T29/49126 , Y10T29/49144 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/45099 , H01L2924/20752
摘要: A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.
摘要翻译: 描述了一种低成本高频电子器件封装和相关的制造方法,其中波导结构从高频器件形成为封装引线转变。 封装引线转换优化,以利用波导互连结构。
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公开(公告)号:US20120234588A1
公开(公告)日:2012-09-20
申请号:US13485573
申请日:2012-05-31
申请人: Eric A. Sanjuan , Sean S. Cahill
发明人: Eric A. Sanjuan , Sean S. Cahill
IPC分类号: H05K1/16
CPC分类号: H01L23/66 , H01L23/047 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2223/6627 , H01L2224/05599 , H01L2224/32245 , H01L2224/45014 , H01L2224/45015 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48471 , H01L2224/4903 , H01L2224/73265 , H01L2224/8592 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/181 , H01L2924/1903 , H01L2924/19032 , H01L2924/19033 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H05K1/0243 , Y10T29/49002 , Y10T29/49018 , Y10T29/49121 , Y10T29/49126 , Y10T29/49144 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/45099 , H01L2924/20752
摘要: A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.
摘要翻译: 描述了一种低成本高频电子器件封装和相关的制造方法,其中波导结构从高频器件形成为封装引线转变。 封装引线转换优化,以利用波导互连结构。
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公开(公告)号:US20090159320A1
公开(公告)日:2009-06-25
申请号:US11960681
申请日:2007-12-19
申请人: Eric A. Sanjuan , Sean S. Cahill
发明人: Eric A. Sanjuan , Sean S. Cahill
CPC分类号: H01L23/66 , H01L23/047 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2223/6627 , H01L2224/05599 , H01L2224/32245 , H01L2224/45014 , H01L2224/45015 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48471 , H01L2224/4903 , H01L2224/73265 , H01L2224/8592 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/181 , H01L2924/1903 , H01L2924/19032 , H01L2924/19033 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H05K1/0243 , Y10T29/49002 , Y10T29/49018 , Y10T29/49121 , Y10T29/49126 , Y10T29/49144 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/45099 , H01L2924/20752
摘要: A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.
摘要翻译: 描述了一种低成本高频电子器件封装和相关的制造方法,其中波导结构从高频器件形成为封装引线转变。 封装引线转换优化,以利用波导互连结构。
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公开(公告)号:US20120066894A1
公开(公告)日:2012-03-22
申请号:US13308351
申请日:2011-11-30
申请人: Eric A. Sanjuan , Sean S. Cahill
发明人: Eric A. Sanjuan , Sean S. Cahill
IPC分类号: H01P11/00
CPC分类号: H01L23/66 , H01L23/047 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2223/6627 , H01L2224/05599 , H01L2224/32245 , H01L2224/45014 , H01L2224/45015 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48471 , H01L2224/4903 , H01L2224/73265 , H01L2224/8592 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/181 , H01L2924/1903 , H01L2924/19032 , H01L2924/19033 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H05K1/0243 , Y10T29/49002 , Y10T29/49018 , Y10T29/49121 , Y10T29/49126 , Y10T29/49144 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/45099 , H01L2924/20752
摘要: A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.
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公开(公告)号:US09275961B2
公开(公告)日:2016-03-01
申请号:US13485573
申请日:2012-05-31
申请人: Eric A. Sanjuan , Sean S. Cahill
发明人: Eric A. Sanjuan , Sean S. Cahill
IPC分类号: H05K1/11 , H01L23/66 , H01L23/047 , H01L23/00 , H05K1/02
CPC分类号: H01L23/66 , H01L23/047 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2223/6627 , H01L2224/05599 , H01L2224/32245 , H01L2224/45014 , H01L2224/45015 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48471 , H01L2224/4903 , H01L2224/73265 , H01L2224/8592 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/181 , H01L2924/1903 , H01L2924/19032 , H01L2924/19033 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H05K1/0243 , Y10T29/49002 , Y10T29/49018 , Y10T29/49121 , Y10T29/49126 , Y10T29/49144 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/45099 , H01L2924/20752
摘要: A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.
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8.METALIZED MOLDED PLASTIC COMPONENTS FOR MILLIMETER WAVE ELECTRONICS AND METHOD FOR MANUFACTURE 有权
标题翻译: 金属化模制塑料组件,用于制造毫米波电子及其制造方法公开(公告)号:US20140070904A1
公开(公告)日:2014-03-13
申请号:US13607539
申请日:2012-09-07
申请人: Sean S. Cahill , Eric A. Sanjuan
发明人: Sean S. Cahill , Eric A. Sanjuan
CPC分类号: H01P1/208 , H01P1/207 , H01P1/213 , H01P1/2138 , H01P5/12 , H01P11/002 , Y10T29/49016
摘要: Waveguide components that have a high degree of performance accuracy over the temperature range of interest are provided. The components require no post-formation trimming steps, are light-weight, and dimensionally stable. In addition, a method for the manufacture of these millimeter wave components is provided.
摘要翻译: 提供了在感兴趣的温度范围内具有高度性能精度的波导部件。 这些部件不需要后部修整步骤,重量轻且尺寸稳定。 另外,提供了制造这些毫米波部件的方法。
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