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公开(公告)号：US06201633B1
公开(公告)日：2001-03-13
申请号：US09326876
申请日：1999-06-07
申请人： Eric Peeters , Jackson Ho , Feixia Pan , Raj B. Apte , Joel A. Kubby , Ronald T. Fulks , Decai Sun , Patrick Y. Maeda , David Fork , Robert Thornton , Ross Bringans , G. A. Neville Connell , Philip Don Floyd , Tuan Anh Vo , Koenraad Van Schuylenbergh
发明人： Eric Peeters , Jackson Ho , Feixia Pan , Raj B. Apte , Joel A. Kubby , Ronald T. Fulks , Decai Sun , Patrick Y. Maeda , David Fork , Robert Thornton , Ross Bringans , G. A. Neville Connell , Philip Don Floyd , Tuan Anh Vo , Koenraad Van Schuylenbergh
IPC分类号： G02B2600
CPC分类号： G09G3/3433 , G02B26/02 , G09G3/2011 , G09G3/2018 , G09G3/207 , G09G2300/06 , G09G2310/04 , G09G2310/061 , H04N5/66 , H04N5/7416 , H04N9/30 , H04N9/3102
摘要： A micro-electromechanical bistable shutter display device is provided capable of being implemented for both small screen, high resolution devices and for large billboard-type displays. The micro-electromechanical shutter assembly has bi-stability characteristics which allow the use of only a holding voltage to maintain an image. The micro-electromechanical shutter assembly includes a shutter having petal-like shutter segments covering reflective or transmittive films. To expose the film in a particular shutter assembly, its shutter segments are moved from the horizontal to a vertical position using electrostatic attraction forces to “collapse” the torsionally-hinged shutter segments. The shutter assembly can have a number of segments, as long as the resulting shutter assembly shape can be stacked to form a dense 2D array.
摘要翻译： 提供了一种能够实现小屏幕，高分辨率设备和大型广告牌型显示器的微机电双稳态快门显示设备。 微机电快门组件具有允许仅使用保持电压来维持图像的双稳定性特性。 微机电快门组件包括具有覆盖反射或透射膜的花瓣状快门段的快门。 为了在特定的快门组件中曝光胶片，使用静电吸引力使其快门部分从水平位置移动到垂直位置，以使“扭转”的快门片段“折叠”。 快门组件可以具有多个段，只要所得到的快门组件形状可以被堆叠以形成致密的2D阵列。
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2.发明申请公开(公告)号：US20050270135A1
公开(公告)日：2005-12-08
申请号：US11197675
申请日：2005-08-04
申请人： Christopher Chua , Francesco Lemmi , Koenraad Van Schuylenbergh , Jeng Lu , David Fork , Eric Peeters , Decai Sun , Donald Smith , Linda Romano
发明人： Christopher Chua , Francesco Lemmi , Koenraad Van Schuylenbergh , Jeng Lu , David Fork , Eric Peeters , Decai Sun , Donald Smith , Linda Romano
IPC分类号： H01F41/04 , G01R1/067 , G01R3/00 , G03C5/00 , H01F17/00 , H01F17/02 , H01F27/29 , H01L21/02 , H01L21/60 , H01L21/768 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/522 , H01R9/03 , H05K7/02
CPC分类号： H01L24/13 , G01R1/06727 , G01R3/00 , H01F17/0033 , H01F17/02 , H01F41/041 , H01L21/76838 , H01L21/7688 , H01L23/498 , H01L23/49811 , H01L23/5227 , H01L24/11 , H01L24/16 , H01L24/48 , H01L28/10 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13099 , H01L2224/4847 , H01L2224/8592 , H01L2924/0001 , H01L2924/00014 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/01061 , H01L2924/01068 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12034 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/4902 , Y10T29/49071 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49218 , H01L2924/00 , H01L2224/05599 , H01L2224/85399 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.
摘要翻译： 可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。 光刻图案的线圈结构包括具有固有应力分布的弹性构件。 固有的应力分布使形成环绕的基板远离基板偏移。 锚固部分保持固定到基底上。 自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。 一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。
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公开(公告)号：US20070139899A1
公开(公告)日：2007-06-21
申请号：US11314827
申请日：2005-12-21
IPC分类号： H05K7/00
CPC分类号： H01L23/36 , H01L23/22 , H01L23/295 , H01L23/315 , H01L23/3185 , H01L23/32 , H01L23/3675 , H01L23/4006 , H01L23/42 , H01L23/49833 , H01L23/552 , H01L23/562 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/72 , H01L24/81 , H01L2023/4043 , H01L2224/10135 , H01L2224/13109 , H01L2224/16 , H01L2224/17517 , H01L2224/29109 , H01L2224/2919 , H01L2224/73203 , H01L2224/73251 , H01L2224/73253 , H01L2224/81136 , H01L2224/81139 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/81901 , H01L2224/83951 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/16152 , H01L2924/16195 , H01L2924/19043 , H01L2924/3025 , Y10T29/49147 , H01L2924/0132 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/72
摘要： An integrated circuit (IC) die/substrate assembly includes an IC die and a substrate that are electrically coupled through an interconnect formed on the IC die. The IC die/substrate assembly further includes at least one coupling that facilitates maintaining an IC die/substrate gap definition between the IC die and the substrate.
摘要翻译： 集成电路（IC）管芯/衬底组件包括通过形成在IC管芯上的互连电耦合的IC管芯和衬底。 IC芯片/基板组件还包括至少一个耦合，其有助于保持IC管芯和衬底之间的IC管芯/衬底间隙限定。
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公开(公告)号：US20060030179A1
公开(公告)日：2006-02-09
申请号：US10913904
申请日：2004-08-05
IPC分类号： H01R12/00
CPC分类号： H01L24/72 , G01R1/06716 , G01R1/06727 , G01R1/06761 , G01R1/06772 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01P3/081 , H01P3/085 , H01R12/718 , H01R13/24 , H01R13/6461 , H01R13/6477 , H05K1/0218 , H05K3/4092
摘要： A curved transmission-line spring structure formed by self-bending materials (e.g., stress-engineered materials, intermetallic compounds and/or bimorphs) that are layered to form a stripline or microstrip transmission line. A dielectric layer is sandwiched between two conductive layers, which form the signal and ground lines of the structure. The various layers are etched to form an elongated spring structure, and then one end of the spring structure is released from the underlying substrate, causing the tip of the released end to bend away from the substrate for contact with a second device. One or both of the conductive layers is fabricated using self-bending spring metals to facilitate the bending process, and plated metal is utilized for conductivity. Alternatively, or in addition, the dielectric layer is formed using a stress-engineered dielectric material. Two-tip and three-tip structures are used to facilitate connection of both the ground and signal lines.
摘要翻译： 通过层叠以形成带状线或微带传输线的自弯曲材料（例如，应力工程材料，金属间化合物和/或双压电晶片）形成的弯曲传输线弹簧结构。 介电层夹在两个导电层之间，形成结构的信号和接地线。 蚀刻各种层以形成细长的弹簧结构，然后弹簧结构的一端从下面的基底释放，使得释放端的尖端远离基板弯曲以与第二装置接触。 使用自弯曲弹簧金属制造一个或两个导电层以促进弯曲过程，并且将电镀金属用于导电性。 或者或另外，使用应力工程介电材料形成电介质层。 两端和三端结构用于促进接地和信号线的连接。
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公开(公告)号：US20050130462A1
公开(公告)日：2005-06-16
申请号：US10737272
申请日：2003-12-15
IPC分类号： H01R12/00
CPC分类号： H01R13/2407
摘要： An electrical interconnect structure that includes a spring portion that extends out of a plane. The electrical interconnect including curved regions to improve the lateral compliance of the interconnect. The curved region may be incorporated into a release region of the spring. The release region may include either or both an uplifted region and a planar region. The curves in the release region are arranged to improve the spring contact with a mating surface and also improve lateral compliance compared to prior art spring designs.
摘要翻译： 一种电互连结构，其包括从平面延伸的弹簧部分。 电互连包括弯曲区域，以改善互连的横向顺应性。 弯曲区域可以结合到弹簧的释放区域中。 释放区域可以包括隆起区域和平坦区域中的一个或两个。 释放区域中的曲线布置成改进与配合表面的弹簧接触，并且与现有技术的弹簧设计相比，还改善了侧向顺从性。
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公开(公告)号：US20070126536A1
公开(公告)日：2007-06-07
申请号：US11292421
申请日：2005-12-02
IPC分类号： H01H51/22
CPC分类号： H01H59/0009 , H01H2059/0081
摘要： In one aspect, an electromechanical switching device is illustrated. The electromechanical switching device includes a relay with at least one first conductive portion, at least one second conductive portion, and at least one actuation component that moves the at least one first conductive portion and the at least one second conductive portion into and out of conductive contact. The at least one first conductive portion includes a conductive stationary end coupled to a substrate and a conductive free-floating end. The at least one actuation component includes an actuation stationary end coupled to the substrate and an actuation free-floating end. The actuation free floating end, when the at least one actuation component is not energized, curls, which curls the conductive free floating end into or out of conductive contact with the at least one second conductive portion.
摘要翻译： 在一个方面，示出了机电开关装置。 机电开关装置包括具有至少一个第一导电部分，至少一个第二导电部分和至少一个致动部件的继电器，所述至少一个致动部件将至少一个第一导电部分和至少一个第二导电部分移入和移出导电部分 联系。 所述至少一个第一导电部分包括耦合到衬底的导电固定端和导电自由浮动端。 所述至少一个致动部件包括联接到所述基板的致动固定端和致动自由浮动端。 当所述至少一个致动部件未通电时，所述致动自由浮动端部卷曲，所述自由浮动端部将所述导电自由浮动端部与所述至少一个第二导电部分导电接触或者脱离所述至少一个第二导电部分的导电接触。
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公开(公告)号：US20070202310A1
公开(公告)日：2007-08-30
申请号：US11364111
申请日：2006-02-27
IPC分类号： B32B7/02
CPC分类号： C23C30/00 , B81B2203/0118 , B81B2203/019 , B81C1/00007 , B81C1/0019 , C23C28/00 , C23C28/021 , C23C28/023 , C25D1/003 , C25D1/20 , C25D5/022 , C25D5/10 , C25D5/50 , H01F17/0006 , H01L27/08 , Y10T428/24942
摘要： A structure has at least one structure component formed of a first material residing on a substrate, such that the structure is out of a plane of the substrate. A first coating of a second material then coats the structure. A second coating of a non-oxidizing material coats the structure at a thickness less than a thickness of the second material.
摘要翻译： 结构具有由驻留在基板上的第一材料形成的至少一个结构部件，使得该结构在基板的平面之外。 然后第二材料的第一涂层然后涂覆该结构。 非氧化材料的第二涂层以小于第二材料厚度的厚度涂覆结构。
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公开(公告)号：US20080095996A1
公开(公告)日：2008-04-24
申请号：US11959813
申请日：2007-12-19
IPC分类号： B32B7/02
CPC分类号： B81C1/0015 , Y10T428/24942
摘要： A method and structure for forming a spring structure that avoids undesirable kinks in the spring is described. The method converts a portion of a release layer such that the converted portion resists etching. The converted portion then serves as an anchor region for a spring structure deposited over the release layer. When the non-converted portions of the release layer are etched, the spring curls out of the plane of a plane.
摘要翻译： 描述了形成弹簧结构的方法和结构，其避免了弹簧中不希望的扭结。 该方法将释放层的一部分转换成转换部分抵抗蚀刻。 转换的部分然后用作沉积在释放层上的弹簧结构的锚定区域。 当剥离层的未转化部分被蚀刻时，弹簧卷曲在平面的平面之外。
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公开(公告)号：US20060286832A1
公开(公告)日：2006-12-21
申请号：US11463283
申请日：2006-08-08
IPC分类号： H01R13/44
CPC分类号： H01L24/72 , G01R1/06716 , G01R1/06727 , G01R1/06761 , G01R1/06772 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01P3/081 , H01P3/085 , H01R12/718 , H01R13/24 , H01R13/6461 , H01R13/6477 , H05K1/0218 , H05K3/4092
摘要： A curved transmission-line spring structure formed by self-bending materials (e.g., stress-engineered materials, intermetallic compounds and/or bimorphs) that are layered to form a stripline or microstrip transmission line. A dielectric layer is sandwiched between two conductive layers, which form the signal and ground lines of the structure. The various layers are etched to form an elongated spring structure, and then one end of the spring structure is released from the underlying substrate, causing the tip of the released end to bend away from the substrate for contact with a second device. One or both of the conductive layers is fabricated using self-bending spring metals to facilitate the bending process, and plated metal is utilized for conductivity. Alternatively, or in addition, the dielectric layer is formed using a stress-engineered dielectric material. Two-tip and three-tip structures are used to facilitate connection of both the ground and signal lines.
摘要翻译： 通过层叠以形成带状线或微带传输线的自弯曲材料（例如，应力工程材料，金属间化合物和/或双压电晶片）形成的弯曲传输线弹簧结构。 介电层夹在两个导电层之间，形成结构的信号和接地线。 蚀刻各种层以形成细长的弹簧结构，然后弹簧结构的一端从下面的基底释放，使得释放端的尖端远离基板弯曲以与第二装置接触。 使用自弯曲弹簧金属制造一个或两个导电层以促进弯曲过程，并且将电镀金属用于导电性。 或者或另外，使用应力工程介电材料形成电介质层。 两端和三端结构用于促进接地和信号线的连接。
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公开(公告)号：US20050136703A1
公开(公告)日：2005-06-23
申请号：US10742501
申请日：2003-12-19
申请人： Koenraad Van Schuylenbergh , Armin Volkel , Thomas DiStefano , Michel Rosa , David Fork , Eugene Chow , Meng Lean
发明人： Koenraad Van Schuylenbergh , Armin Volkel , Thomas DiStefano , Michel Rosa , David Fork , Eugene Chow , Meng Lean
CPC分类号： H01R12/78 , H05K1/147 , H05K3/323 , H05K3/361 , H05K3/365 , H05K2201/044 , H05K2201/09845
摘要： A data transmission interconnect assembly (e.g., a router) capable of transmission speeds in excess of 40 Gbps in which a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring contact structures are formed on the cables, or on a contact structure pressed against the cables, to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press a contact structure, having micro spring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.
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