PLASMA SURFACE TREATMENT TO PREVENT PATTERN COLLAPSE IN IMMERSION LITHOGRAPHY
    1.
    发明申请
    PLASMA SURFACE TREATMENT TO PREVENT PATTERN COLLAPSE IN IMMERSION LITHOGRAPHY 审中-公开
    等离子体表面处理,以防止浸渍图中的图案褶皱

    公开(公告)号:US20090104541A1

    公开(公告)日:2009-04-23

    申请号:US11877559

    申请日:2007-10-23

    IPC分类号: G03F1/00

    CPC分类号: G03F7/091 G03F7/11

    摘要: The present invention comprises a method of reducing photoresist mask collapse when the photoresist mask is dried after immersion development. As feature sizes continue to shrink, the capillary force of water used to rinse a photoresist mask approaches the point of being greater than adhesion force of the photoresist to the ARC. When the capillary force exceeds the adhesion force, the features of the mask may collapse because the water pulls adjacent features together as the water dries. By depositing a hermetic oxide layer over the ARC before depositing the photoresist, the adhesion force may exceed the capillary force and the features of the photoresist mask may not collapse.

    摘要翻译: 本发明包括当浸渍显影后干燥光致抗蚀剂掩模时减少光致抗蚀剂掩模塌陷的方法。 随着特征尺寸的不断缩小,用于冲洗光致抗蚀剂掩模的水的毛细管力接近光致抗蚀剂对ARC的粘附力。 当毛细管力超过粘附力时,面具的特征可能会因为水干燥而将相邻的特征拉到一起而崩溃。 通过在沉积光致抗蚀剂之前在ARC上沉积气密的氧化物层,粘合力可能会超过毛细管力,并且光致抗蚀剂掩模的特征可能不会崩溃。

    PLASMA SURFACE TREATMENT TO PREVENT PATTERN COLLAPSE IN IMMERSION LITHOGRAPHY
    2.
    发明申请
    PLASMA SURFACE TREATMENT TO PREVENT PATTERN COLLAPSE IN IMMERSION LITHOGRAPHY 审中-公开
    等离子体表面处理,以防止浸渍图中的图案褶皱

    公开(公告)号:US20110111604A1

    公开(公告)日:2011-05-12

    申请号:US13007963

    申请日:2011-01-17

    IPC分类号: H01L21/31

    CPC分类号: G03F7/091 G03F7/11

    摘要: The present invention comprises a method of reducing photoresist mask collapse when the photoresist mask is dried after immersion development. As feature sizes continue to shrink, the capillary force of water used to rinse a photoresist mask approaches the point of being greater than adhesion force of the photoresist to the ARC. When the capillary force exceeds the adhesion force, the features of the mask may collapse because the water pulls adjacent features together as the water dries. By depositing a hermetic oxide layer over the ARC before depositing the photoresist, the adhesion force may exceed the capillary force and the features of the photoresist mask may not collapse.

    摘要翻译: 本发明包括当浸渍显影后干燥光致抗蚀剂掩模时减少光致抗蚀剂掩模塌陷的方法。 随着特征尺寸的不断缩小,用于冲洗光致抗蚀剂掩模的水的毛细管力接近光致抗蚀剂对ARC的粘附力。 当毛细管力超过粘附力时,面具的特征可能会因为水干燥而将相邻的特征拉到一起而崩溃。 通过在沉积光致抗蚀剂之前在ARC上沉积气密的氧化物层,粘合力可能会超过毛细管力,并且光致抗蚀剂掩模的特征可能不会崩溃。

    ELIMINATION OF PHOTORESIST MATERIAL COLLAPSE AND POISONING IN 45-NM FEATURE SIZE USING DRY OR IMMERSION LITHOGRAPHY
    8.
    发明申请
    ELIMINATION OF PHOTORESIST MATERIAL COLLAPSE AND POISONING IN 45-NM FEATURE SIZE USING DRY OR IMMERSION LITHOGRAPHY 审中-公开
    使用干涉或倾斜光刻技术消除45-NM特征尺寸的光电材料收缩和沉淀

    公开(公告)号:US20090197086A1

    公开(公告)日:2009-08-06

    申请号:US12025615

    申请日:2008-02-04

    CPC分类号: G03F7/091 G03F7/11 Y10T428/30

    摘要: A method and structure for the fabrication of semiconductor devices having feature sizes in the range of 90 nm and smaller is provided. In one embodiment of the invention, a method is provided for processing a substrate including depositing an anti-reflective coating layer on a surface of the substrate, depositing an adhesion promotion layer on the anti-reflective coating layer, and depositing a resist material on the adhesion promotion layer. In another embodiment of the invention, a semiconductor substrate structure is provided including a dielectric substrate, an amorphous carbon layer deposited on the dielectric layer, an anti-reflective coating layer deposited on the amorphous carbon layer, an adhesion promotion layer deposited on the anti-reflective coating layer, and a resist material deposited on the adhesion promotion layer.

    摘要翻译: 提供了具有尺寸在90nm以下的特征尺寸的半导体器件的制造方法和结构。 在本发明的一个实施例中,提供了一种处理衬底的方法,包括在衬底的表面上沉积抗反射涂层,在抗反射涂层上沉积粘合促进层,以及在抗反射涂层上沉积抗蚀剂材料 粘附促进层。 在本发明的另一个实施例中,提供了一种半导体衬底结构,其包括电介质衬底,沉积在电介质层上的无定形碳层,沉积在无定形碳层上的抗反射涂层, 反射涂层和沉积在粘附促进层上的抗蚀剂材料。