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    Method of reworking a semiconductor substrate and method of forming a pattern of a semiconductor device
    1.
    发明授权
    Method of reworking a semiconductor substrate and method of forming a pattern of a semiconductor device 有权
    半导体衬底的再加工方法以及形成半导体器件的图案的方法

    公开(公告)号：US07825041B2

    公开(公告)日：2010-11-02

    申请号：US12068410

    申请日：2008-02-06

    申请人： Eun-Sung Kim ,  Tae-Kyu Kim ,  Seok-Hwan Oh

    发明人： Eun-Sung Kim ,  Tae-Kyu Kim ,  Seok-Hwan Oh

    IPC分类号： H01L21/31 ,  H01L21/469

    CPC分类号： H01L21/31133 ,  H01L21/32139

    摘要： A method of reworking a semiconductor substrate and a method of forming a pattern of semiconductor device using the same without damage to an organic anti-reflective coating (ARC) is provided. The method of reworking a semiconductor substrate includes forming a photoresist pattern on a substrate having the organic ARC formed thereon. An entire surface of the substrate having the photoresist pattern formed thereon may be exposed when a defect is present in the photoresist pattern. The entire-surface-exposed photoresist pattern may be removed by performing a developing process without damage to the organic ARC.

    摘要翻译： 提供了对半导体衬底进行再加工的方法和使用其形成半导体器件的图案而不损坏有机抗反射涂层（ARC）的方法。 半导体衬底的再加工方法包括在其上形成有机ARC的衬底上形成光致抗蚀剂图案。 当在光致抗蚀剂图案中存在缺陷时，可以暴露出其上形成有光致抗蚀剂图案的基板的整个表面。 可以通过执行显影过程而不损坏有机ARC来去除全表面暴露的光致抗蚀剂图案。

    Method of reworking a semiconductor substrate and method of forming a pattern of a semiconductor device
    2.
    发明申请
    Method of reworking a semiconductor substrate and method of forming a pattern of a semiconductor device 有权
    半导体衬底的再加工方法以及形成半导体器件的图案的方法

    公开(公告)号：US20080194097A1

    公开(公告)日：2008-08-14

    申请号：US12068410

    申请日：2008-02-06

    申请人： Eun-Sung Kim ,  Tae-Kyu Kim ,  Seok-Hwan Oh

    发明人： Eun-Sung Kim ,  Tae-Kyu Kim ,  Seok-Hwan Oh

    IPC分类号： H01L21/4757 ,  H01L21/4763

    CPC分类号： H01L21/31133 ,  H01L21/32139

    摘要： A method of reworking a semiconductor substrate and a method of forming a pattern of semiconductor device using the same without damage to an organic anti-reflective coating (ARC) is provided. The method of reworking a semiconductor substrate includes forming a photoresist pattern on a substrate having the organic ARC formed thereon. An entire surface of the substrate having the photoresist pattern formed thereon may be exposed when a defect is present in the photoresist pattern. The entire-surface-exposed photoresist pattern may be removed by performing a developing process without damage to the organic ARC.

    摘要翻译： 提供了对半导体衬底进行再加工的方法和使用其形成半导体器件的图案而不损坏有机抗反射涂层（ARC）的方法。 半导体衬底的再加工方法包括在其上形成有机ARC的衬底上形成光致抗蚀剂图案。 当在光致抗蚀剂图案中存在缺陷时，可以暴露出其上形成有光致抗蚀剂图案的基板的整个表面。 可以通过执行显影过程而不损坏有机ARC来去除全表面暴露的光致抗蚀剂图案。

    Sealing inspection device and sealing inspection method of flat panel display apparatus by using the sealing inspection device
    6.
    发明申请
    Sealing inspection device and sealing inspection method of flat panel display apparatus by using the sealing inspection device 有权
    使用密封检测装置的平板显示装置的密封检查装置和密封检验方法

    公开(公告)号：US20120099106A1

    公开(公告)日：2012-04-26

    申请号：US13137893

    申请日：2011-09-21

    申请人： Soon-Ryong Park ,  Woo-Suk Jung ,  Hee-Seong Jeong ,  Tae-Kyu Kim ,  Sun-Hwa Kim

    发明人： Soon-Ryong Park ,  Woo-Suk Jung ,  Hee-Seong Jeong ,  Tae-Kyu Kim ,  Sun-Hwa Kim

    IPC分类号： G01J4/00

    CPC分类号： H01L51/5246 ,  G02F1/1309 ,  G02F1/1339 ,  H01L2251/568

    摘要： A sealing inspection device for detecting a bonding error at a sealing region of an upper and a lower plate in a flat panel display apparatus in which the upper and lower plates are bonded to each other by a sealing member, the sealing inspection device includes a light source configured to emit light, a polarizer configured to polarize the light emitted from the light source, the polarized light being incident on and reflected from the sealing region of the flat panel display, an optical spectrum analyzer configured to analyze the light reflected from the sealing region with respect to wavelength ranges and to determine whether a bonding error exits at the sealing region, and a beam splitter configured to change a path of the reflected light toward the optical spectrum analyzer.

    摘要翻译： 一种密封检查装置，用于检测在通过密封构件将上板和下板彼此接合的平板显示装置中的上板和下板的密封区域处的接合误差，密封检查装置包括光 被配置为发光的偏振器，被配置为使从光源发射的光偏振的偏振器，偏振光入射到平板显示器的密封区域并从其反射;光谱分析器，被配置为分析从密封件反射的光 区域，并且确定接合误差是否在密封区域处退出，并且分束器被配置为将反射光的路径改变为光谱分析器。

    MANUFACTURING METHOD OF HIGH STRENGTH FERRITIC/MARTENSITIC STEELS
    8.
    发明申请
    MANUFACTURING METHOD OF HIGH STRENGTH FERRITIC/MARTENSITIC STEELS 有权
    高强度铁素体/马氏体钢的制造方法

    公开(公告)号：US20100108207A1

    公开(公告)日：2010-05-06

    申请号：US12612101

    申请日：2009-11-04

    申请人： Woo-Gon Kim ,  Chan-Bock Lee ,  Jong-Hyuk Baek ,  Do-Hee Hahn ,  Sung-Ho Kim ,  Chang-Hee Han ,  Tae-Kyu Kim ,  Jun-Hwan Kim

    发明人： Woo-Gon Kim ,  Chan-Bock Lee ,  Jong-Hyuk Baek ,  Do-Hee Hahn ,  Sung-Ho Kim ,  Chang-Hee Han ,  Tae-Kyu Kim ,  Jun-Hwan Kim

    IPC分类号： C21D8/00

    CPC分类号： C21D8/1266 ,  C21D2211/004 ,  C21D2211/005 ,  C21D2211/008

    摘要： Provided is a method of manufacturing a high strength ferritic/martensitic steel. The method includes melting a ferritic/martensitic steel, hot-working the melted ferritic/martensitic steel, normalizing the hot-worked ferritic/martensitic steel at a temperature of about 1050° C. to about 1200° C., tempering the ferritic/martensitic steel at a temperature of about 600° C. or less, and leaving MX precipitates while preventing a M23C6 precipitate from being precipitated, and cold-working and thermal-treating the ferritic/martensitic steel in a multistage fashion, and precipitating M23C6 precipitates. Through the above described configuration, the high strength ferritic/martensitic steel that prevents a ductility from being deteriorated even in a high-temperature environment may be manufactured.

    摘要翻译： 提供一种制造高强度铁素体/马氏体钢的方法。 该方法包括熔化铁素体/马氏体钢，对熔融的铁素体/马氏体钢进行热加工，使热处理的铁素体/马氏体钢在约1050℃至约1200℃的温度下归一化，回火铁素体/马氏体 钢在约600℃以下，留下MX析出物，同时防止M23C6沉淀物析出，并对铁素体/马氏体钢进行多级冷加工和热处理，并析出M23C6沉淀物。 通过上述结构，可以制造即使在高温环境下也能够防止延展性劣化的高强度铁素体/马氏体钢。

    Display apparatus including enhanced sealing portion
    10.
    发明授权
    Display apparatus including enhanced sealing portion 有权
    显示装置包括增强的密封部分

    公开(公告)号：US08564198B2

    公开(公告)日：2013-10-22

    申请号：US13399899

    申请日：2012-02-17

    申请人： Tae-Kyu Kim ,  Eun-Ah Kim

    发明人： Tae-Kyu Kim ,  Eun-Ah Kim

    IPC分类号： H05B33/04

    CPC分类号： H05B33/04 ,  H01L51/5246

    摘要： A display apparatus includes an enhanced sealing portion. The display apparatus includes a substrate unit that includes a first substrate and a second substrate facing each other; a sealing portion that is disposed between the first substrate and the second substrate; and a metal film that is disposed between the first substrate and the sealing portion. Open holes having different sizes are formed in proportion to energy intensities of an energy source applied to the metal film. During sealing in a sealing region by using a laser, since the metal film having a specific shape is patterned, even when energy having an irregular Gaussian shape is applied, uniform energy may be applied to the sealing portion. Accordingly, an adhesive force in the sealing region may be increased.

    摘要翻译： 显示装置包括增强的密封部分。 显示装置包括：基板单元，其包括彼此面对的第一基板和第二基板; 密封部，其设置在所述第一基板和所述第二基板之间; 以及设置在第一基板和密封部之间的金属膜。 与施加到金属膜的能量源的能量强度成比例地形成具有不同尺寸的开放孔。 在通过使用激光在密封区域中密封时，由于具有特定形状的金属膜被图案化，所以即使施加具有不规则高斯形状的能量，也可以向密封部分施加均匀的能量。 因此，可以增加密封区域中的粘合力。