公开(公告)号：US06700320B2

公开(公告)日：2004-03-02

申请号：US10138487

申请日：2002-05-06

申请人： Eung-Suk Lee ,  Jong-Heon Kim

发明人： Eung-Suk Lee ,  Jong-Heon Kim

IPC分类号： H01J2980

CPC分类号： H01J29/06 ,  H01J2229/003

摘要： A cathode ray tube includes a panel having a front screen portion on which a phosphor screen is formed and a panel flange formed on an edge of the front screen portion; a funnel connected to the panel flange; a deflection yoke disposed around the funnel; a neck connected to the funnel, an electron gun disposed in the neck; a color selection apparatus for selecting electron beams emitted from the electron gun and allowing the selected electron beams to land on corresponding phosphors, the color selection apparatus including a frame having a pair of supporting members disposed at a predetermined distance from each other in parallel and a pair of elastic members fixed on both ends of the supporting members to correspond to the lateral sides of the mask; and a shield apparatus for shielding geomagnetism, the shield apparatus being mounted on a circumference of the frame of the color selection apparatus and extended toward the neck. The shield apparatus includes disconnection parts defined corresponding to the corners of the frame, the shield apparatus being extended toward the phosphor screen over one of longitudinal and lateral sidewalls of the frame.

摘要翻译： 阴极射线管包括具有形成荧光屏的前屏幕部分和形成在前屏幕部分的边缘上的面板凸缘的面板; 连接到面板法兰的漏斗; 设置在漏斗周围的偏转线圈; 连接到漏斗的颈部，设置在颈部的电子枪; 一种选色装置，用于选择从电子枪发射的电子束，并使所选择的电子束着陆在相应的荧光体上，该颜色选择装置包括一个框架，该框架具有平行彼此预定距离设置的一对支撑构件， 一对弹性构件固定在支撑构件的两端以对应于掩模的侧面; 以及用于屏蔽地磁的屏蔽装置，所述屏蔽装置安装在所述选色装置的框架的圆周上并朝向所述颈部延伸。 屏蔽装置包括对应于框架的角部限定的断开部分，屏蔽装置在框架的纵向侧壁和侧壁之一上朝着荧光屏延伸。

公开(公告)号：US06987350B2

公开(公告)日：2006-01-17

申请号：US10640501

申请日：2003-08-12

申请人： Jong-Heon Kim ,  Eung-Suk Lee

发明人： Jong-Heon Kim ,  Eung-Suk Lee

IPC分类号： H01J29/80

CPC分类号： H01J29/06 ,  H01J2229/003

摘要： An inner shield for a cathode ray tube includes a screen opening and an electron gun opening through which electron beams pass, and a main body including a pair of long sections and a pair of short sections interconnected to form the screen opening and the electron gun opening. A cathode ray tube includes the inner shield. Each of the short sections includes a cutaway section having a pair of first cutaway sections formed starting from the electron gun opening and extending at a predetermined angle for a predetermined distance toward the screen opening, and a second cutaway section formed starting from where the first cutaway sections end and extending inwardly toward the screen opening, the second cutaway section being formed to extend past imaginary lines formed from where the first cutaway sections end to a furthermost inward point of the second cutaway section, that is, the point of the second cutaway section closest to the screen opening.

摘要翻译： 用于阴极射线管的内屏蔽罩包括屏幕开口和电子束通过的电子枪开口，以及主体，其包括一对长部分和一对互连以形成屏幕开口的短部分和电子枪开口 。 阴极射线管包括内屏蔽。 每个短部分包括切割部分，其具有从电子枪开口开始并以预定角度向屏幕开口延伸预定距离形成的一对第一切除部分，以及从第一切口开始形成的第二切除部分 所述第二切除部分形成为延伸越过从所述第一切除部分终止于所述第二切除部分的最远内侧点的位置形成的假想线，即所述第二切除部分的点 最接近屏幕开口。

公开(公告)号：US20110262625A1

公开(公告)日：2011-10-27

申请号：US13176701

申请日：2011-07-05

申请人： Hyun-Sook PARK ,  Chang-Mog Jo ,  Hee-Cheol Kang ,  Yun-Mi Lee ,  Un-Cheol Sung ,  Yong-Sup Choi ,  Jong-Heon Kim ,  Jae-Kwang Ryu

发明人： Hyun-Sook PARK ,  Chang-Mog Jo ,  Hee-Cheol Kang ,  Yun-Mi Lee ,  Un-Cheol Sung ,  Yong-Sup Choi ,  Jong-Heon Kim ,  Jae-Kwang Ryu

IPC分类号： B05D5/06 ,  B05C5/00

CPC分类号： C23C14/042 ,  C23C14/12 ,  C23C14/24

摘要： A thin film deposition apparatus including a chamber; a deposition source accommodated in the chamber and configured to discharge a deposition material; a deposition source nozzle unit located at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; and a patterning slit sheet located opposite the deposition source nozzle unit inside the chamber and including a plurality of patterning slits arranged in a second direction perpendicular to the first direction, the patterning slit sheet being spaced apart from the substrate, and the thin film deposition apparatus being configured to perform a deposition while at least one of the substrate or the thin film deposition apparatus moves relative to the other in the first direction.

摘要翻译： 一种薄膜沉积设备，包括：室; 沉积源，其容纳在所述室中并且构造成排出沉积材料; 沉积源喷嘴单元，位于沉积源的一侧并且包括沿第一方向布置的多个沉积源喷嘴; 以及图案化缝隙片，其与所述腔室内的所述沉积源喷嘴单元相对，并且包括沿垂直于所述第一方向的第二方向布置的多个图案化狭缝，所述图案化缝隙片与所述衬底间隔开，并且所述薄膜沉积设备 被配置为在所述基板或所述薄膜沉积装置中的至少一个在所述第一方向上相对于另一个移动时执行沉积。

公开(公告)号：US20110052791A1

公开(公告)日：2011-03-03

申请号：US12869830

申请日：2010-08-27

申请人： Chang-Mog JO ,  Jong-Heon Kim ,  Yong-Sup Choi ,  Sang-Soo Kim ,  Hee-Cheol Kang ,  Young-Mook Choi

发明人： Chang-Mog JO ,  Jong-Heon Kim ,  Yong-Sup Choi ,  Sang-Soo Kim ,  Hee-Cheol Kang ,  Young-Mook Choi

IPC分类号： C23C16/52 ,  B05C11/00 ,  B05D3/00 ,  B05D5/00

CPC分类号： H01L33/005 ,  C23C14/042 ,  C23C14/12 ,  C23C14/243 ,  C23C14/246 ,  C23C14/568 ,  H01L21/67173 ,  H01L21/67225 ,  H01L21/67236 ,  H01L21/6831 ,  H01L27/3211 ,  H01L51/001 ,  H01L51/0011 ,  H01L51/56

摘要： A thin film deposition apparatus used to manufacture large substrates on a mass scale and that allows high-definition patterning, and a method of manufacturing an organic light-emitting display apparatus using the same, the apparatus includes a loading unit fixing a substrate onto an electrostatic chuck; a deposition unit including a chamber maintained in a vacuum state and a thin film deposition assembly disposed in the chamber, separated from the substrate by a predetermined distance, to deposit a thin film on the substrate fixed on the electrostatic chuck; an unloading unit separating the substrate on which a deposition process is completed, from the electrostatic chuck; a first circulation unit sequentially moving the electrostatic chuck on which the substrate is fixed, to the loading unit, the deposition unit, and the unloading unit; and a second circulation unit returning the electrostatic chuck separated from the substrate to the loading unit from the unloading unit, wherein the first circulation unit passes through the chamber when passing through the deposition unit.

摘要翻译： 一种薄膜沉积装置，用于大规模制造大型基板并允许高分辨率图案化，以及制造使用其的有机发光显示装置的方法，该装置包括将基板固定在静电上的装载单元 卡盘 沉积单元，其包括保持在真空状态的室和设置在所述室中的薄膜沉积组件，其与所述基板隔开预定距离，以在固定在所述静电卡盘上的所述基板上沉积薄膜; 从所述静电卡盘将分离完成了沉积处理的基板的卸载单元; 顺序地将固定有基板的静电卡盘移动到加载单元，沉积单元和卸载单元的第一循环单元; 以及第二循环单元，其将从所述基板分离的所述静电卡盘从所述卸载单元返回到所述装载单元，其中所述第一循环单元在通过所述沉积单元时通过所述室。

公开(公告)号：US07491572B2

公开(公告)日：2009-02-17

申请号：US10574316

申请日：2004-09-30

申请人： Jong-Heon Kim ,  Chi-Jung Song

发明人： Jong-Heon Kim ,  Chi-Jung Song

IPC分类号： H01L21/00 ,  H01L31/0328

CPC分类号： H01L27/14618 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A package for semiconductor image pickup device is provided. The package is fabricated by using flip chip bumping. During deposition process of forming a metallic bonding layer and a metal layer for plating, a surface of a semiconductor image pickup device is maintained at the range between room temperature and 200° C. in accordance with a first embodiment. A polymer layer for preventing stress from generating can absorb stress generated during the deposition process in accordance with a second embodiment. According to the present invention, a functional polymer layer on the surface of a semiconductor image pickup device can be prevent from being deteriorated in its properties and from transforming at its surface.

摘要翻译： 提供了一种用于半导体图像拾取装置的封装。 封装通过使用倒装芯片凸块来制造。 在形成金属接合层和用于电镀的金属层的沉积工艺期间，根据第一实施例，半导体图像拾取装置的表面保持在室温和200℃之间的范围内。 用于防止产生应力的聚合物层可以吸收根据第二实施方案的沉积工艺期间产生的应力。 根据本发明，可以防止半导体图像拾取装置的表面上的功能性聚合物层的性质劣化，并且防止其表面变形。

公开(公告)号：US20070085180A1

公开(公告)日：2007-04-19

申请号：US10574316

申请日：2004-09-30

申请人： Jong-Heon Kim ,  Chi-Jung Song

发明人： Jong-Heon Kim ,  Chi-Jung Song

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A package for semiconductor image pickup device is provided. The package is fabricated by using flip chip bumping. During deposition process of forming a metallic bonding layer and a metal layer for plating, a surface of a semiconductor image pickup device is maintained at the range between room temperature and 200° C. in accordance with a first embodiment. A polymer layer for preventing stress from generating can absorb stress generated during the deposition process in accordance with a second embodiment. According to the present invention, a functional polymer layer on the surface of a semiconductor image pickup device can be prevent from being deteriorated in its properties and from transforming at its surface.

摘要翻译： 提供了一种用于半导体图像拾取装置的封装。 封装通过使用倒装芯片凸块来制造。 在形成金属接合层和用于电镀的金属层的沉积工艺期间，根据第一实施例，半导体图像拾取装置的表面保持在室温和200℃之间的范围内。 用于防止产生应力的聚合物层可以吸收根据第二实施方案的沉积工艺期间产生的应力。 根据本发明，可以防止半导体图像拾取装置的表面上的功能性聚合物层的性质劣化，并且防止其表面变形。

公开(公告)号：US20060197431A1

公开(公告)日：2006-09-07

申请号：US11366503

申请日：2006-03-03

申请人： Sang-Shin Choi ,  Chang-Ryon Byon ,  Soon-Cheol Shin ,  Joon-Soo Bae ,  Hyung-Seok Oh ,  Seok-Nam Lee ,  Jong-Heon Kim ,  Jeong-Hoon Kim ,  Hoo-Deuk Kim

发明人： Sang-Shin Choi ,  Chang-Ryon Byon ,  Soon-Cheol Shin ,  Joon-Soo Bae ,  Hyung-Seok Oh ,  Seok-Nam Lee ,  Jong-Heon Kim ,  Jeong-Hoon Kim ,  Hoo-Deuk Kim

IPC分类号： H01J29/82

CPC分类号： H01J29/87

摘要： A cathode ray tube includes a tube having a panel having an inner phosphor screen, a funnel connected to the panel, a neck connected to the funnel, a deflection unit disposed around the funnel, an electron gun installed in the neck, and a scatter-proof unit installed on the panel and the funnel such that the panel shares the scatter-proof unit with the funnel for preventing the tube from breaking and scattering into many pieces.

摘要翻译： 阴极射线管包括具有内荧光屏的面板，连接到面板的漏斗，连接到漏斗的颈部，设置在漏斗周围的偏转单元，安装在颈部中的电子枪， 安装在面板和漏斗上的防爆单元，使得面板与漏斗共享防散射单元，以防止管破裂并分散成多个部件。

公开(公告)号：US06897141B2

公开(公告)日：2005-05-24

申请号：US10842883

申请日：2004-05-10

申请人： Jong-Heon Kim

发明人： Jong-Heon Kim

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/44

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/3651 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/05124 ,  H01L2224/05166

摘要： A solder terminal and a fabrication method thereof are provided. According to one embodiment of the present invention, a solder terminal structure includes an adhesion metal layer formed on an electrode pad of a semiconductor device, a thermal diffusion barrier, a solder bonding layer, and a solder bump formed on upper portion of the solder bonding layer. With the thermal diffusion layer, the characteristic deterioration caused by the probe mark generated on the electrode pad can be prevented during a semiconductor reliability test, and at the same time, material movement between the layers of the electrode pad, the solder bonding layer and the adhesion metal layer can be reduced. Also, by having the thermal diffusion barrier act as a solder dam (a layer to confine the melted solder area to prevent the solder from being wetted), an additional deposition or etching process can be omitted.

摘要翻译： 提供焊接端子及其制造方法。 根据本发明的一个实施例，焊接端子结构包括形成在半导体器件的电极焊盘上的粘附金属层，形成在焊料上部上的热扩散阻挡层，焊料接合层和焊料凸块 层。 利用热扩散层，在半导体可靠性试验中可以防止在电极焊盘上产生的探针标记引起的特性劣化，同时在电极焊盘，焊料接合层和 粘附金属层可以减少。 此外，通过使热扩散阻挡层作为焊料坝（限制熔融焊料区域以防止焊料被润湿的层），可以省略附加的沉积或蚀刻工艺。

公开(公告)号：US06774495B2

公开(公告)日：2004-08-10

申请号：US10279383

申请日：2002-10-23

申请人： Jong-Heon Kim

发明人： Jong-Heon Kim

IPC分类号： H01L2348

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/3651 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/05124 ,  H01L2224/05166

摘要： A solder terminal and a fabrication method thereof are provided. According to one embodiment of the present invention, a solder terminal structure includes an adhesion metal layer formed on an electrode pad of a semiconductor device, a thermal diffusion barrier, a solder bonding layer, and a solder bump formed on upper portion of the solder bonding layer. With the thermal diffusion layer, the characteristic deterioration caused by the probe mark generated on the electrode pad can be prevented during a semiconductor reliability test, and at the same time, material movement between the layers of the electrode pad, the solder bonding layer and the adhesion metal layer can be reduced. Also, by having the thermal diffusion barrier act as a solder dam (a layer to confine the melted solder area to prevent the solder from being wetted), an additional deposition or etching process can be omitted.

摘要翻译： 提供焊接端子及其制造方法。 根据本发明的一个实施例，焊接端子结构包括形成在半导体器件的电极焊盘上的粘附金属层，形成在焊料上部上的热扩散阻挡层，焊料接合层和焊料凸块 层。 利用热扩散层，在半导体可靠性试验中可以防止在电极焊盘上产生的探针标记引起的特性劣化，同时在电极焊盘，焊料接合层和 粘附金属层可以减少。 此外，通过使热扩散阻挡层作为焊料坝（限制熔融焊料区域以防止焊料被润湿的层），可以省略附加的沉积或蚀刻工艺。

公开(公告)号：US09388488B2

公开(公告)日：2016-07-12

申请号：US13015357

申请日：2011-01-27

申请人： Yun-Mi Lee ,  Hyun-Sook Park ,  Jong-Heon Kim ,  Seok-Rak Chang

发明人： Yun-Mi Lee ,  Hyun-Sook Park ,  Jong-Heon Kim ,  Seok-Rak Chang

IPC分类号： B05D1/32 ,  B05D5/06 ,  C23C14/24 ,  C23C14/04 ,  C23C14/12 ,  H01L51/00 ,  H01L51/56

CPC分类号： C23C14/243 ,  B05D5/06 ,  C23C14/042 ,  C23C14/12 ,  H01L51/0011 ,  H01L51/56

摘要： An organic film deposition apparatus includes: a deposition source that discharges a deposition material; a deposition source nozzle unit located at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; a patterning slit sheet spaced apart from the deposition source nozzle unit and having a plurality of patterning slits arranged in a second direction perpendicular to the first direction; a first blocking member between the substrate and the deposition source and movable together with the substrate to be positioned to screen at least a part of the substrate; and a second blocking member between the first blocking member and the substrate and fixedly held relative to the deposition source, wherein the substrate is spaced apart from the organic film deposition apparatus and at least one of the substrate or the organic film deposition apparatus moves relative to the other.

摘要翻译： 有机膜沉积设备包括：放电沉积材料的沉积源; 沉积源喷嘴单元，位于沉积源的一侧并且包括沿第一方向布置的多个沉积源喷嘴; 与沉积源喷嘴单元间隔开并且具有沿垂直于第一方向的第二方向布置的多个图案化狭缝的图案化缝隙片; 在所述基板和所述沉积源之间的第一阻挡构件，并与所述基板一起移动以被定位以筛选所述基板的至少一部分; 以及在所述第一阻挡构件和所述基板之间并相对于所述沉积源固定地保持的第二阻挡构件，其中所述基板与所述有机膜沉积设备间隔开，并且所述基板或所述有机膜沉积设备中的至少一个相对于 另一个。