公开(公告)号：US20060104031A1

公开(公告)日：2006-05-18

申请号：US10904555

申请日：2004-11-16

申请人： Evan Colgan ,  Frank Pompeo ,  Glenn Daves ,  Hilton Toy ,  Bruce Furman ,  David Edwards ,  Michael Gaynes ,  Mukta Farooq ,  Sung Kang ,  Steven Ostrander ,  Jaimal Williamson ,  Da-Yuan Shih ,  Donald Henderson

发明人： Evan Colgan ,  Frank Pompeo ,  Glenn Daves ,  Hilton Toy ,  Bruce Furman ,  David Edwards ,  Michael Gaynes ,  Mukta Farooq ,  Sung Kang ,  Steven Ostrander ,  Jaimal Williamson ,  Da-Yuan Shih ,  Donald Henderson

IPC分类号： H05K7/20

CPC分类号： H01L23/4735 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/0401

摘要： A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.

摘要翻译： 提供了一种用于组件载体上的电子部件的冷却系统。 该系统包括框架，喷雾歧管和密封构件。 框架具有开口并且可连接到部件载体，使得在开口和电子部件之间限定环形区域。 喷雾歧管被密封在开口上以限定电子部件的后表面上方的喷射区域。 喷雾歧管在后表面喷洒冷却液。 密封构件密封环形区域，使得部件载体上的输入/输出连接器与冷却流体隔离。

公开(公告)号：US20070166994A1

公开(公告)日：2007-07-19

申请号：US11657000

申请日：2007-01-23

申请人： Sung Kang ,  Da-Yuan Shih ,  Yoon-Chul Son

发明人： Sung Kang ,  Da-Yuan Shih ,  Yoon-Chul Son

IPC分类号： H01L21/44 ,  H01L29/40

CPC分类号： H01L24/11 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3463

摘要： In using Ni(P) and Sn-rich solders in Pb free interconnections, the prevention and control of the formation of intermetallic compound inclusions, can be achieved through a reaction preventive or control layer that is positioned on top of an electroless Ni(P) metallization, such as by application of a thin layer of Sn on the Ni(P) or through the application of a thin layer of Cu on the Ni(P

摘要翻译： 在无铅互连中使用Ni（P）和富含Sn的焊料，可以通过位于无电Ni（P）的顶部的反应预防或控制层来实现金属间化合物夹杂物形成的预防和控制， 例如通过在Ni（P）上施加Sn的薄层，或者通过在Ni（P）上施加薄层的Cu，

公开(公告)号：US20060024943A1

公开(公告)日：2006-02-02

申请号：US10903365

申请日：2004-07-30

申请人： Sung Kang ,  Da-Yuan Shih ,  Yoon-Chul Son

发明人： Sung Kang ,  Da-Yuan Shih ,  Yoon-Chul Son

IPC分类号： H01L21/44

CPC分类号： H01L24/11 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3463

摘要： In using Ni(P) and Sn-rich solders in Pb free interconnections, the prevention and control of the formation of intermetallic compound inclusions, can be achieved through a reaction preventive or control layer that is positioned on top of an electroless Ni(P) metallization, such as by application of a thin layer of Sn on the Ni(P) or through the application of a thin layer of Cu on the Ni(P

摘要翻译： 在无铅互连中使用Ni（P）和富含Sn的焊料，可以通过位于无电Ni（P）的顶部的反应预防或控制层来实现金属间化合物夹杂物形成的预防和控制， 例如通过在Ni（P）上施加Sn的薄层，或者通过在Ni（P）上施加薄层的Cu，

公开(公告)号：US20060118604A1

公开(公告)日：2006-06-08

申请号：US11005557

申请日：2004-12-05

申请人： Stephen Buchwalter ,  Claudius Feger ,  Peter Gruber ,  Sung Kang ,  Paul Lauro ,  Da-Yuan Shih

发明人： Stephen Buchwalter ,  Claudius Feger ,  Peter Gruber ,  Sung Kang ,  Paul Lauro ,  Da-Yuan Shih

IPC分类号： B23K35/12

CPC分类号： H05K3/3436 ,  B23K35/26 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13176 ,  H01L2224/13181 ,  H01L2224/13184 ,  H01L2224/1357 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3426 ,  H05K3/3468 ,  H05K2201/10287 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0415 ,  H05K2203/128 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Improved interconnects are produced by injection molded solder which fills mold arrays with molten solder so that columns that have much greater height to width aspect ratios greater than one are formed, rather than conventional flip chip bumps. The columns may have filler particles or reinforcing conductors therein. In the interconnect structures produced, the cost and time of a subsequent underfill step is reduced or avoided. The problem of incompatibility with optical interconnects between chips because underfills require high loading of silica fillers which scatter light, is solved, thus allowing flip chips to incorporate optical interconnects.

公开(公告)号：US20050224966A1

公开(公告)日：2005-10-13

申请号：US10815103

申请日：2004-03-31

申请人： Keith Fogel ,  Balaram Ghosal ,  Sung Kang ,  Stephen Kilpatrick ,  Paul Lauro ,  Henry Nye ,  Da-Yuan Shih ,  Donna Zupanski-Nielsen

发明人： Keith Fogel ,  Balaram Ghosal ,  Sung Kang ,  Stephen Kilpatrick ,  Paul Lauro ,  Henry Nye ,  Da-Yuan Shih ,  Donna Zupanski-Nielsen

IPC分类号： H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H05K3/34

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/00014

摘要： An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.

摘要翻译： 一种适于将微电子器件芯片倒装连接到封装的互连结构，包括二层，三层或四层限球组合物，包括粘附/反应阻挡层，并且具有与含锡的组分反应的焊料可湿性层 无铅焊料，使得可焊接层在焊接期间可以完全消耗，但在焊接期间与无铅焊料接触后，阻挡层保持不变。 一个或多个无铅焊料球选择性地位于焊料润湿层上，该无铅焊球包含锡作为主要成分和一种或多种合金成分。

公开(公告)号：US20080117378A1

公开(公告)日：2008-05-22

申请号：US12010046

申请日：2008-01-18

申请人： Dong Son ,  Seo Ha ,  Sung Kang ,  Jong Lee ,  Aoki Toshhiro ,  Jai Jung

发明人： Dong Son ,  Seo Ha ,  Sung Kang ,  Jong Lee ,  Aoki Toshhiro ,  Jai Jung

IPC分类号： G02F1/1339

CPC分类号： G02F1/13394 ,  G02F1/133512 ,  G02F1/133514

摘要： A liquid crystal display device includes a first substrate having a plurality of first electrodes, a second substrate facing the first substrate and having a plurality of second electrodes perpendicular to the first electrodes to define sub-pixels at intersection regions between the first and second electrodes, a liquid crystal layer between the first and second substrates, a plurality of color filters between the first and second substrates adapted to correspond to respective sub-pixels, the color filters including first color filters and second color filters having a different shape than the first color filters, a black matrix between the color filters, the black matrix including vertical portions, horizontal portions, and step portions, each of the step portions corresponding to a respective second color filter, and a plurality of patterned spacers between the first and second substrates, each of the patterned spacers overlaps with a respective step-portion of the black matrix.

摘要翻译： 液晶显示装置包括具有多个第一电极的第一基板，与第一基板相对的第二基板，具有与第一电极垂直的多个第二电极，以在第一和第二电极之间的交叉区域限定子像素， 在所述第一和第二基板之间的液晶层，在所述第一和第二基板之间适于对应于各个子像素的多个滤色器，所述滤色器包括具有与所述第一颜色不同的形状的第一滤色器和第二滤色器 滤色器，滤色器之间的黑矩阵，黑矩阵包括垂直部分，水平部分和台阶部分，每个阶梯部分对应于相应的第二滤色器，以及在第一和第二基板之间的多个图案化间隔物， 每个图案化间隔物与黑矩阵的相应台阶部分重叠。

公开(公告)号：US20080016891A1

公开(公告)日：2008-01-24

申请号：US11779735

申请日：2007-07-18

申请人： Jae Seng Sim ,  Sung Kang ,  Jong Shin ,  Su Won Lee ,  Deok-Hyun Youn ,  Dong Kim

发明人： Jae Seng Sim ,  Sung Kang ,  Jong Shin ,  Su Won Lee ,  Deok-Hyun Youn ,  Dong Kim

IPC分类号： F25B41/04

CPC分类号： F25B41/04 ,  F16K11/0743 ,  F25B5/02 ,  F25B2500/221

摘要： A refrigerator includes a valve assembly located at a refrigerant path from a condenser to at least one expansion valve for controlling flow of a refrigerant from the condenser to the at least one expansion valve. The valve assembly includes a valve chamber, wherein the refrigerant drawn from the condenser is held in the valve chamber; at least one outlet hole through which the refrigerant held in the valve chamber is discharged to a corresponding outlet path connected to the at least one expansion valve; and a valve body for selectively opening and closing the at least one outlet hole as the valve body rotates, such that the refrigerant held in the valve chamber is selectively discharged to the corresponding outlet path.

摘要翻译： 冰箱包括位于从冷凝器到至少一个膨胀阀的制冷剂路径的阀组件，用于控制制冷剂从冷凝器到至少一个膨胀阀的流动。 阀组件包括阀室，其中从冷凝器抽出的制冷剂保持在阀室中; 至少一个出口孔，保持在阀室中的制冷剂通过该出口孔排放到与至少一个膨胀阀连接的相应出口路径; 以及阀体，用于当阀体旋转时选择性地打开和关闭至少一个出口孔，使得保持在阀室中的制冷剂被选择性地排放到相应的出口路径。

公开(公告)号：US20070285519A1

公开(公告)日：2007-12-13

申请号：US11577532

申请日：2005-09-15

申请人： Jung Ahn ,  Sung Kang

发明人： Jung Ahn ,  Sung Kang

IPC分类号： H04N5/228

CPC分类号： H04N5/76 ,  H04N7/181

摘要： The present invention relates to an image signal transmission method in a network camera system, and more particularly, to a network camera system and an image signal transmission method in which a low resolution image formed by down-scaling a high resolution image photographed by a high resolution camera is displayed via a display means of a DVR system, and the high resolution image is compressed to be stored in a memory means of the DVR system, thereby preventing overload on the system that may occur due to compressing, transmitting, or decompressing a plurality of high resolution image signals. The network camera system including: a high resolution image photographing unit photographing an object to generate a high resolution image signal; an A/D converter converting the high resolution image signal into a digital image signal; an image signal compression unit receiving the digital image signals from the A/D conversion unit and generating a first image signal by compressing the digital image signal in high resolution; a network interface unit connected to a predetermined network cable, for transmitting the first image signal to a predetermined DVR system connected by the network cable; a down-scaling unit receiving the digital image signal from the A/D conversion unit and generating a second image signal by down-scaling the digital image signal; an image signal encoding unit converting the second image signal into an analog signal to be encoded to a second analog image signal; and an interface unit transmitting the first image signal and the second analog image signal to the DVR system.

摘要翻译： 本发明涉及一种网络摄像机系统中的图像信号传输方法，更具体地说，涉及一种网络摄像机系统和图像信号传输方法，其中通过降低高分辨率图像的高分辨率图像而形成的低分辨率图像 通过DVR系统的显示装置显示分辨率摄像机，并且高分辨率图像被压缩以存储在DVR系统的存储装置中，从而防止由于压缩，发送或解压缩而可能发生的系统过载 多个高分辨率图像信号。 该网络摄像机系统包括：高分辨率图像拍摄单元拍摄对象以产生高分辨率图像信号; 将高分辨率图像信号转换为数字图像信号的A / D转换器; 图像信号压缩单元，从A / D转换单元接收数字图像信号，并通过以高分辨率压缩数字图像信号产生第一图像信号; 连接到预定网络电缆的网络接口单元，用于将第一图像信号发送到由网络电缆连接的预定DVR系统; 缩小单元，从A / D转换单元接收数字图像信号，并通过对数字图像信号进行缩小来产生第二图像信号; 图像信号编码单元，将第二图像信号转换为要被编码的模拟信号到第二模拟图像信号; 以及将第一图像信号和第二模拟图像信号发送到DVR系统的接口单元。

公开(公告)号：US20070215965A1

公开(公告)日：2007-09-20

申请号：US11596343

申请日：2004-12-20

申请人： Woo Seok Yang ,  Sung Kang ,  Youn Kim

发明人： Woo Seok Yang ,  Sung Kang ,  Youn Kim

IPC分类号： H01L29/84

CPC分类号： B81C1/00952 ,  B81C2201/112

摘要： Provided is a micro-mechanical structure and method for manufacturing the same, including a hydrophilic surface on at least a part of a surface of the micro-mechanical structure, so as to prevent generation of an adhesion phenomenon in the process of removing a sacrificial layer to release the micro-mechanical, wherein the sacrificial layer comes into contact with the surface of the micro-mechanical structure.

摘要翻译： 提供了一种微机械结构及其制造方法，其包括在微机械结构的表面的至少一部分上的亲水表面，以防止在去除牺牲层的过程中产生粘附现象 以释放微机械，其中牺牲层与微机械结构的表面接触。

公开(公告)号：US20070101773A1

公开(公告)日：2007-05-10

申请号：US11500513

申请日：2006-08-08

申请人： Jae Park ,  Hyung Kim ,  Sang Pyo ,  Sun Park ,  Sung Kang

发明人： Jae Park ,  Hyung Kim ,  Sang Pyo ,  Sun Park ,  Sung Kang

IPC分类号： D06F37/00 ,  B08B3/12 ,  D06F25/00

CPC分类号： D06F39/008 ,  D06F39/04

摘要： A drum washing machine, in which scale deposited in a steam generating device installed for improving sterilizing and washing capacities is efficiently eliminated. The drum washing machine includes a housing; a tub for containing washing water; a drum rotatably installed in the tub; and a steam generating device installed in the housing for supplying steam for sterilizing laundry to the drum, wherein a scale eliminating unit is installed in a water supply channel of the steam generating device, and includes at least one protrusion formed on the inner circumferential surface of the water supply channel or a water supply valve and a pulsation circuit for controlling the flow rate and amount of the water. The scale eliminating unit forms turbulence in the steam generating device or supplies water having varied flow rate and amount to the steam generating device, thereby efficiently eliminating scale deposited in the steam generating device.

摘要翻译： 有效地消除了沉积在安装用于提高消毒和洗涤能力的蒸汽发生装置中的水垢的滚筒洗衣机。 滚筒洗衣机包括壳体; 一个含洗涤水的洗手盆; 可旋转地安装在桶中的滚筒; 以及蒸汽发生装置，其安装在所述壳体中，用于向所述滚筒提供用于将衣物消毒的蒸汽，其中，所述除垢单元安装在所述蒸汽发生装置的供水通道中，并且包括形成在所述蒸汽发生装置的内周面上的至少一个突起， 供水通道或供水阀和用于控制水的流量和量的脉动电路。 除垢单元在蒸汽发生装置中形成湍流，或者向蒸汽发生装置供给具有变化的流量和量的水，从而有效地消除蒸汽发生装置中沉积的垢。