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公开(公告)号:US20070232090A1
公开(公告)日:2007-10-04
申请号:US11395355
申请日:2006-03-31
申请人: Evan Colgan , Paul Coteus , Hubert Harrer , Gareth Hougham , John Magerlein , John Torok
发明人: Evan Colgan , Paul Coteus , Hubert Harrer , Gareth Hougham , John Magerlein , John Torok
IPC分类号: H01R12/00
CPC分类号: H05K1/141 , H01L23/13 , H01L23/49811 , H01L23/49838 , H01L2224/16225 , H01L2224/73253 , H01L2924/09701 , H01L2924/3011 , H01R12/7082 , H01R13/2414 , H05K2201/0367 , H05K2201/049 , H05K2201/10378 , H05K2201/10719
摘要: LGA (land grid array) interposers having variable pitch connectors and distribution wiring to support space transforming I/O interconnections between first level chip modules and second level packaging. Apparatus and methods for constructing high-performance electronic modules (such as processor modules for computer systems) using LGA interposers that provide space transform I/O interconnections between fine pitch I/O contacts on a chip module and coarse pitch contacts on a circuit board.
摘要翻译: 具有可变节距连接器和配线的LGA(地面栅格阵列)插入器,以支持第一级芯片模块与第二级封装之间的空间转换I / O互连。 使用LGA插入器构建高性能电子模块(例如计算机系统的处理器模块)的装置和方法,其提供芯片模块上的精细间距I / O触点与电路板上的粗略俯仰触点之间的空间变换I / O互连。
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公开(公告)号:US20080020601A1
公开(公告)日:2008-01-24
申请号:US11865458
申请日:2007-10-01
申请人: Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人: Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号: H01R12/00
CPC分类号: H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
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公开(公告)号:US20080026607A1
公开(公告)日:2008-01-31
申请号:US11865440
申请日:2007-10-01
申请人: Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人: Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号: H01R12/14
CPC分类号: H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
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公开(公告)号:US20080026606A1
公开(公告)日:2008-01-31
申请号:US11865353
申请日:2007-10-01
申请人: Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人: Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号: H01R12/14
CPC分类号: H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
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公开(公告)号:US20080020597A1
公开(公告)日:2008-01-24
申请号:US11865423
申请日:2007-10-01
申请人: Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人: Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号: H01R12/00
CPC分类号: H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
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公开(公告)号:US20080020600A1
公开(公告)日:2008-01-24
申请号:US11865293
申请日:2007-10-01
申请人: Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人: Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号: H01R12/14
CPC分类号: H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
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公开(公告)号:US20080020599A1
公开(公告)日:2008-01-24
申请号:US11865253
申请日:2007-10-01
申请人: Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人: Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
CPC分类号: H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
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公开(公告)号:US20080026605A1
公开(公告)日:2008-01-31
申请号:US11865217
申请日:2007-10-01
申请人: Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人: Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号: H01R12/04
CPC分类号: H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
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公开(公告)号:US20080032520A1
公开(公告)日:2008-02-07
申请号:US11865305
申请日:2007-10-01
申请人: Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人: Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号: H01R12/16
CPC分类号: H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
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公开(公告)号:US20080023845A1
公开(公告)日:2008-01-31
申请号:US11865395
申请日:2007-10-01
申请人: Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人: Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号: H01L23/48
CPC分类号: H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
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