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公开(公告)号：US20200249079A1
公开(公告)日：2020-08-06
申请号：US16837800
申请日：2020-04-01
申请人： eXo Imaging, Inc.
发明人： Sandeep AKKARAJU , Haesung KWON , Brian BIRCUMSHAW
IPC分类号： G01H11/08 , H01L41/113 , G01S15/02 , G01N29/07 , H01L41/18
摘要： An array of micromachined ultrasonic transducers (MUTs). The array has first and second rows, the MUTs in the first row being equally spaced by a horizontal pitch in a horizontal direction, the MUTs in the second row being equally spaced by the horizontal pitch in the horizontal direction. The MUTs in the second row are shifted along the horizontal direction by a first horizontal distance relative to the MUTs in the first row and shifted along a vertical direction by a first vertical distance relative to the MUTs in the first row. The first horizontal distance is greater than zero and less than the horizontal pitch. The first vertical distance ranges from one tenth of a horizontal width of a MUT to a half of a vertical height of a MUT.
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公开(公告)号：US20220233168A1
公开(公告)日：2022-07-28
申请号：US17156058
申请日：2021-01-22
申请人： eXo Imaging, Inc.
摘要： Disclosed herein are ultrasonic transducer systems comprising: an ultrasonic imager comprising a plurality of pMUT transducer elements; and one or more circuitries connected electronically to the plurality of transducer element, the one or more circuitries configured to enable: pulse transmission and reception of reflected signal for the ultrasonic transducer, where inductors are used to equalize impedance to obtain greater pressure output. Also disclosed are methods of altering a pressure of an ultrasonic wave emitted by an ultrasonic transducer.
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公开(公告)号：US20210086231A1
公开(公告)日：2021-03-25
申请号：US17095333
申请日：2020-11-11
申请人： eXo Imaging, Inc.
发明人： Brian BIRCUMSHAW , Sandeep AKKARAJU
IPC分类号： B06B1/06 , H01L41/04 , H01L41/047 , H01L41/187 , H01L41/313 , H01L41/338 , G01S15/89 , G01S7/52
摘要： The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable.
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公开(公告)号：US20210293952A1
公开(公告)日：2021-09-23
申请号：US17341931
申请日：2021-06-08
申请人： Exo Imaging, Inc.
摘要： Disclosed herein are ultrasonic transducer systems comprising: an ultrasonic imager comprising a plurality of pMUT transducer elements; and one or more circuitries connected electronically to the plurality of transducer element, the one or more circuitries configured to enable: pulse transmission and reception of reflected signal for the ultrasonic transducer; and control of the ultrasonic transducer, the control of the ultrasonic transducer comprising focusing ultrasonic beam in an elevation direction.
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公开(公告)号：US20200225082A1
公开(公告)日：2020-07-16
申请号：US16833333
申请日：2020-03-27
申请人： eXo Imaging, Inc.
发明人： Sandeep AKKARAJU , Haesung KWON , Brian BIRCUMSHAW
摘要： A micromachined ultrasonic transducer (MUT). The MUT includes: a substrate; a membrane suspending from the substrate; a bottom electrode disposed on the membrane; a piezoelectric layer disposed on the bottom electrode and an asymmetric top electrode is disposed on the piezoelectric layer. The areal density distribution of the asymmetric electrode along an axis has a plurality of local maxima, wherein locations of the plurality of local maxima coincide with locations where a plurality of anti-nodal points at a vibrational resonance frequency is located.
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公开(公告)号：US20220304659A1
公开(公告)日：2022-09-29
申请号：US17215776
申请日：2021-03-29
申请人： eXo Imaging, Inc.
摘要： Described are micromachined ultrasonic transducer (MUT) arrays with trenches, reducing cross-talk between MUTs to mitigate undesirable artifacts in ultrasound images, as well as methods of making the same.
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公开(公告)号：US20210364348A1
公开(公告)日：2021-11-25
申请号：US17395171
申请日：2021-08-05
申请人： Exo Imaging, Inc.
发明人： Sandeep AKKARAJU , Haesung KWON , Brian BIRCUMSHAW
IPC分类号： G01H11/08 , H01L41/18 , G01N29/07 , G01S15/02 , H01L41/113
摘要： An array of micromachined ultrasonic transducers (MUTs). The array has first and second rows, the MUTs in the first row being equally spaced by a horizontal pitch in a horizontal direction, the MUTs in the second row being equally spaced by the horizontal pitch in the horizontal direction. The MUTs in the second row are shifted along the horizontal direction by a first horizontal distance relative to the MUTs in the first row and shifted along a vertical direction by a first vertical distance relative to the MUTs in the first row. The first horizontal distance is greater than zero and less than the horizontal pitch. The first vertical distance ranges from one tenth of a horizontal width of a MUT to a half of a vertical height of a MUT.
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公开(公告)号：US20210359192A1
公开(公告)日：2021-11-18
申请号：US17390374
申请日：2021-07-30
申请人： Exo Imaging, Inc.
发明人： Brian BIRCUMSHAW , Sandeep AKKARAJU
IPC分类号： H01L41/047 , H01L41/314 , H01L41/332
摘要： Disclosed are multi-poled piezoelectric devices with improved packing density and methods for making such multi-poled piezoelectric devices with improved packing density. The multi-poled piezoelectric devices comprise: a) a top electrode, a piezoelectric layer, and a bottom electrode fabricated on a substrate; b) vias generated by etching the piezoelectric layer, the top electrode, or both; and c) a re-distribution layer (RDL) deposited over one or more of: the top electrode, the piezoelectric layer, the bottom electrode, or the one or more vias.
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公开(公告)号：US20210094070A1
公开(公告)日：2021-04-01
申请号：US17119737
申请日：2020-12-11
申请人： eXo Imaging, Inc.
发明人： Brian BIRCUMSHAW , Sandeep AKKARAJU
IPC分类号： B06B1/06 , H01L41/04 , H01L41/338 , G01S7/52 , H01L41/187 , G01S15/89 , H01L41/047 , H01L41/313
摘要： The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable.
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公开(公告)号：US20210088655A1
公开(公告)日：2021-03-25
申请号：US17095328
申请日：2020-11-11
申请人： eXo Imaging, Inc.
发明人： Brian BIRCUMSHAW , Sandeep AKKARAJU
IPC分类号： G01S15/89 , B06B1/06 , H01L41/04 , H01L41/047 , H01L41/187 , H01L41/313 , H01L41/338 , G01S7/52
摘要： The present disclosure provides methods to integrate pMUT arrays with an ASIC using solid liquid interdiffusion (SLID). In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT device and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using a conductive bonding pillar, which conductive bonding pillar comprises one or more intermetallic compounds. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT device and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using a conductive bonding pillar, wherein the bonding is performed at a temperature less than the melting point of the conductive bonding pillar after the bonding.
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