公开(公告)号：US09661748B2

公开(公告)日：2017-05-23

申请号：US14699078

申请日：2015-04-29

申请人： FANUC CORPORATION

发明人： Norihiro Saidou ,  Takeshi Sawada

IPC分类号： H05K1/02 ,  H05K3/00 ,  H05K1/09 ,  H05K3/34 ,  H05K3/06 ,  H05K3/24

CPC分类号： H05K1/0284 ,  H05K1/09 ,  H05K3/0091 ,  H05K3/06 ,  H05K3/243 ,  H05K3/244 ,  H05K3/3468 ,  H05K2201/0355 ,  H05K2203/0353 ,  H05K2203/0445 ,  H05K2203/0554 ,  H05K2203/073

摘要： A printed circuit board includes, an insulating substrate, a metal conductor which is formed on the insulating substrate, a solder resist coating a part of the metal conductor, a scooped-out portion of the metal conductor formed in the vicinity of an end of the solder resist, and a metal layer coating the scooped-out portion.

公开(公告)号：US09872388B2

公开(公告)日：2018-01-16

申请号：US14630048

申请日：2015-02-24

申请人： FANUC Corporation

发明人： Nobuhisa Sugimoto ,  Takeshi Sawada

IPC分类号： H05K7/10 ,  H05K7/12 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34

CPC分类号： H05K1/111 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/3442 ,  H05K2201/09381 ,  Y02P70/611

摘要： In a printed wiring board on which an electronic component comprising electrode terminal rows on four peripheral sides or two opposite sides thereof is mounted, each of pads at the both ends of pad rows corresponding to the electrode terminal rows extend outwardly relative to the other pads in the direction of arrangement of the pads and has a shape obtained by diagonally cutting a corner located farthest from the center of the electronic component.

公开(公告)号：US09730334B2

公开(公告)日：2017-08-08

申请号：US15138354

申请日：2016-04-26

申请人： FANUC Corporation

发明人： Makoto Bekke ,  Takeshi Sawada

IPC分类号： H05K3/34

CPC分类号： H05K3/3415 ,  H05K3/3468 ,  H05K2201/10022 ,  H05K2201/10515 ,  H05K2203/1178 ,  Y02P70/613

摘要： In a leaded electronic component mounting structure in which the effect of reducing the occurrence of a blow hole is not impaired even if resin of a lead-inserted component is softened by heat during soldering and which can reduce a load placed on a lead when an external force acts, the lead of the lead-inserted component is inserted into a through hole provided in a base material of a printed wiring board, soldering is performed by immersing into molten solder, and a surface mount component and a surface mount component pad form an air vent tunnel. The air vent tunnel does not come into direct contact with the lead-inserted component, and therefore is not blocked even if the resin of the lead-inserted component softens due to soldering. Thus, the effect of reducing the occurrence of a blow hole is not impaired.

公开(公告)号：US10180667B2

公开(公告)日：2019-01-15

申请号：US15223008

申请日：2016-07-29

申请人： FANUC Corporation

发明人： Takeshi Sawada ,  Weibo Li ,  Kunitaka Komaki ,  Yuuki Kurokawa ,  Shinji Akimoto

IPC分类号： G06F19/00 ,  G05B13/02 ,  G05B19/401 ,  G05B19/4063 ,  G05B19/404

摘要： A machining apparatus is provided with a machine learning device that performs machine learning. The machine learning device performs the machine learning by receiving the input of machining accuracy between a machining shape of a workpiece measured on-machine and design data on the workpiece and machining time of the workpiece measured by a measurement device. Based on a result of the machine learning, the machining apparatus changes machining conditions such that the machining accuracy increases and the machining time becomes as short as possible.

公开(公告)号：US10327328B2

公开(公告)日：2019-06-18

申请号：US15693523

申请日：2017-09-01

申请人： FANUC CORPORATION

发明人： Takeshi Sawada ,  Yuichi Okochi ,  Norihiro Saido

IPC分类号： H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  G01R31/02 ,  H05K3/32 ,  H05K3/34

摘要： To provide a printed circuit board that allows for easy exchange of only a deterioration detection conductor, and can reduce costs. A printed circuit board includes: a main printed circuit board in which a wiring pattern is formed on an insulated substrate; and a deterioration detection wiring board in which deterioration detection wiring (deterioration detection wiring pattern) which is wiring having a form whereby deterioration is promoted compared to the wiring pattern on the insulated substrate is formed on a separate insulated substrate from the main printed circuit board, and is exchangeably connected to the main printed circuit board in a vicinity thereof by way of a replacement-enabling connection part. One mode of the replacement-enabling connection part of the printed circuit board is a connection part (solder joint) constituted by solder, another mode thereof is a connection part (electrically conductive adhesive connection part) constituted by electrically conductive adhesive, and yet another mode thereof is a connection part (cable) constituted by a cable.