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    Bonding apparatus and bonding method
    1.
    发明授权
    Bonding apparatus and bonding method 有权
    接合装置和接合方法

    公开(公告)号：US09266312B2

    公开(公告)日：2016-02-23

    申请号：US14153786

    申请日：2014-01-13

    申请人： FUJITSU LIMITED

    发明人： Takatoyo Yamakami ,  Takashi Kubota ,  Hidehiko Kira

    IPC分类号： B29C65/48 ,  B32B37/12 ,  G02B6/42

    CPC分类号： B32B37/12 ,  G02B6/4204 ,  G02B6/4214 ,  G02B6/4221 ,  G02B6/4239

    摘要： A bonding apparatus has a light source, a stage, a component holder formed of a light transparent material, a controller, and a driver configured to drive the stage and the component holder under the control of the controller. The component holder includes an incident surface on which light outputted from the light source is made incident, a first reflection surface which is a surface opposite to the incident surface and reflects the incident light from the incident surface, a second reflection surface which reflects the light reflected by the first reflection surface, and an exit surface from which the light reflected by the second reflection surface exits. The bonding apparatus bonds the first component and the second component together with the photo-curing adhesive while holding the second component on the side of the exit surface of the component holder.

    摘要翻译： 接合装置具有光源，台，由透光材料形成的部件保持器，控制器和被配置为在控制器的控制下驱动平台和部件保持器的驱动器。 所述部件保持器包括从所述光源输出的光入射的入射面，与所述入射面相反的面并与入射面反射的入射光的第一反射面，反射所述光的第二反射面 由第一反射表面反射的出射表面和由第二反射表面反射的光离开的出射表面。 接合装置将第一部件和第二部件与光固化粘合剂粘合，同时将第二部件保持在部件保持器的出口表面侧。

    Electronic device, electronic device fabrication method, and electronic apparatus
    3.
    发明授权
    Electronic device, electronic device fabrication method, and electronic apparatus 有权

    公开(公告)号：US10115694B2

    公开(公告)日：2018-10-30

    申请号：US15368732

    申请日：2016-12-05

    申请人： FUJITSU LIMITED

    发明人： Hidehiko Kira ,  Naoaki Nakamura ,  Sanae Iijima

    IPC分类号： H01L23/12 ,  H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L23/31 ,  H01L23/29 ,  H01L25/00 ,  H01L21/78 ,  H01L21/683

    摘要： An electronic device includes an electronic part including a first substrate having a group of first terminals over a first front surface and having a concavity in a back surface, a filler placed in the concavity, and a flat plate placed over the back surface with the filler therebetween, and further includes a second substrate disposed on the first front surface side of the first substrate and having a group of second terminals bonded to the group of first terminals over a second front surface opposite the first front surface. The filler and flat plate minimize deformation of the first substrate and variation in the distance between the group of first terminals and the group of second terminals caused by the deformation of the first substrate, which thereby reduces the occurrence of a failure in bonding together the group of first terminals and the group of second terminals.

    Heating header of semiconductor mounting apparatus and bonding method for semiconductor
    6.
    发明授权
    Heating header of semiconductor mounting apparatus and bonding method for semiconductor 有权
    半导体安装装置的加热头和半导体的接合方法

    公开(公告)号：US09536857B1

    公开(公告)日：2017-01-03

    申请号：US15209846

    申请日：2016-07-14

    申请人： FUJITSU LIMITED

    发明人： Hidehiko Kira ,  Takumi Masuyama ,  Norio Kainuma

    IPC分类号： H01L23/00 ,  H01L21/56

    CPC分类号： H01L24/75 ,  H01L24/81 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/75304 ,  H01L2224/75312 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/83191 ,  H01L2924/3511 ,  H01L2924/014

    摘要： A heating header of a semiconductor mounting apparatus includes: a first material; and a second material, the second material being bonded to the first material and coming into contact with a first semiconductor chip when the first semiconductor chip is compressed, wherein a contact surface of the second material with the first semiconductor chip is a curved surface that is convex toward the first semiconductor chip side, and the contact surface of the second material with the first semiconductor chip becomes a planar surface when each temperature of the first material and the second material reaches a melting temperature of a solder that is formed between a first terminal of the first semiconductor chip and a second terminal of a second semiconductor chip.

    摘要翻译： 半导体安装装置的加热集管包括：第一材料; 以及第二材料，当所述第一半导体芯片被压缩时，所述第二材料被接合到所述第一材料并与第一半导体芯片接触，其中所述第二材料与所述第一半导体芯片的接触表面是曲面， 朝向第一半导体芯片侧凸起，并且当第一材料和第二材料的每个温度达到形成在第一半导体芯片侧的第一端子之间的焊料的熔化温度时，第二材料与第一半导体芯片的接触表面变为平坦表面 的第一半导体芯片和第二半导体芯片的第二端子。

    OPTICAL WAVEGUIDE SHEET, OPTICAL UNIT, AND METHOD FOR MANUFACTURING THE SAME
    7.
    发明申请
    OPTICAL WAVEGUIDE SHEET, OPTICAL UNIT, AND METHOD FOR MANUFACTURING THE SAME 有权
    光学波片，光学单元及其制造方法

    公开(公告)号：US20150362675A1

    公开(公告)日：2015-12-17

    申请号：US14674007

    申请日：2015-03-31

    申请人： FUJITSU LIMITED

    发明人： Sanae IIJIMA ,  Takashi Kubota ,  Norio Kainuma ,  Hidehiko Kira

    IPC分类号： G02B6/122 ,  G02B6/13 ,  G02B6/12

    CPC分类号： G02B6/1221 ,  G02B6/138 ,  G02B6/43 ,  G02B2006/12104 ,  Y10T156/1064

    摘要： An optical waveguide sheet, includes: an optical path; and a clad member that covers the optical path, wherein the clad member has a portion formed by removing a part of the clad member which is on a first surface of an optical waveguide sheet on which the optical component is to be mounted and is provided within an area which is unused for propagation of light input to and output from the optical component.

    摘要翻译： 一种光波导片，包括：光路; 以及覆盖所述光路的包层部件，其中，所述包层部件具有通过去除所述包覆部件的一部分而形成的部分，所述部分位于要安装所述光学部件的光波导片的第一表面上，并且设置在 用于将光输入传输到光学部件并从光学部件输出的区域。

    FABRICATION METHOD FOR OPTICAL CONNECTOR AND OPTICAL CONNECTOR
    8.
    发明申请
    FABRICATION METHOD FOR OPTICAL CONNECTOR AND OPTICAL CONNECTOR 有权
    光连接器和光连接器的制造方法

    公开(公告)号：US20150346434A1

    公开(公告)日：2015-12-03

    申请号：US14675822

    申请日：2015-04-01

    申请人： FUJITSU LIMITED

    发明人： Takashi Kubota ,  Norio Kainuma ,  Sanae Iijima ,  Hidehiko Kira

    IPC分类号： G02B6/38

    CPC分类号： G02B6/3855 ,  G02B6/3838 ,  G02B6/3853 ,  G02B6/3885 ,  Y10T29/49828

    摘要： A fabrication method for an optical connector, includes: inserting an optical waveguide sheet, in a direction of an optical path of the optical waveguide sheet, into an insertion hole of an optical connector including lenses disposed in a juxtaposed relationship on a first end face of the optical connector, the insertion hole extending from a second end face of the optical connector at an opposite side to the first end face toward the lenses; and performing first adjustment of adjusting a position of a tip end of the optical path with respect to the lenses by pressing a side end portion of the optical waveguide sheet inserted in the insertion hole from at least one of sides of a first direction along a disposition direction of the lenses, through a first hole portion that is provided in the optical connector and extends to the insertion hole.

    摘要翻译： 一种光连接器的制造方法，包括：将光波导片沿光导纤维片的光路的方向插入光连接器的插入孔中，所述光连接器包括以并列关系设置的透镜， 所述光连接器，所述插入孔从所述光连接器的与所述第一端面的相对侧朝向所述透镜的第二端面延伸; 并且通过沿着配置来从第一方向的至少一侧按压插入在插入孔中的光波导片的侧端部分来执行调整相对于透镜的光路的末端的位置的第一调整 通过设置在光学连接器中并延伸到插入孔的第一孔部分，透镜的方向。