摘要:
The present invention discloses a method for ensuring service classes of packet services, which includes limiting the rate of services with different service classes uploaded to a ringlet from an RPR station in accordance with the RPR physical packet lengths; monitoring, in real time, the rate of non-class A0 services uploaded to the ringlet from the RPR station and forwarded by the RPR station in accordance with the RPR physical packet lengths, and when the rate of the non-class A0 services exceeds the un-reserved rate of the RPR network, reporting a congestion message and adjusting the rate of the non-class A0 services uploaded to the ringlet from the RPR stations in the congestion domain. A method of rate limitation is also disclosed, by which rate limitation is conducted based on a Token Bucket according to the total length of the sent packet after encapsulation. The methods, by means of rate limitation and rate monitoring of the services uploaded to the ringlet from each RPR station according to the RPR physical packet length, can effectively overcome the shortcoming that the reserved bandwidth in the RPR can not be ensured because forwarded services unexpected occupy the bandwidth of the services uploaded to the ringlet at a downstream RPR station due to the physical layer encapsulation overhead.
摘要:
The present invention relates to apparatus, procedures and compositions for avoiding and reducing damage to low dielectric constant materials and other soft materials, such as Cu and Al, used in fabricating semiconductor devices. Damage reduction can be achieved by decreasing the role of mechanical abrasion in the CMP of these materials and increasing the role of chemical polishing, which can also improve material removal rates. Increasing the role of chemical polishing can be accomplished by creating a polishing slurry, which contains components that interact chemically with the surface to be polished. This slurry may or may not also contain soft abrasive particles, which replace the hard abrasive particles of conventional slurries. Use of soft abrasive particles can reduce the role of mechanical abrasion in the CMP process. Use of this slurry in CMP can reduce surface scratches and device damage.
摘要:
The present invention discloses a method for ensuring service classes of packet services, which includes limiting the rate of services with different service classes uploaded to a ringlet from an RPR station in accordance with the RPR physical packet lengths; monitoring, in real time, the rate of non-class A0 services uploaded to the ringlet from the RPR station and forwarded by the RPR station in accordance with the RPR physical packet lengths, and when the rate of the non-class A0 services exceeds the un-reserved rate of the RPR network, reporting a congestion message and adjusting the rate of the non-class A0 services uploaded to the ringlet from the RPR stations in the congestion domain. A method of rate limitation is also disclosed, by which rate limitation is conducted based on a Token Bucket according to the total length of the sent packet after encapsulation. The methods, by means of rate limitation and rate monitoring of the services uploaded to the ringlet from each RPR station according to the RPR physical packet length, can effectively overcome the shortcoming that the reserved bandwidth in the RPR can not be ensured because forwarded services unexpected occupy the bandwidth of the services uploaded to the ringlet at a downstream RPR station due to the physical layer encapsulation overhead.
摘要:
The present invention relates to apparatus, procedures and compositions for avoiding and reducing damage to low dielectric constant materials and other soft materials, such as Cu and Al, used in fabricating semiconductor devices. Damage reduction can be achieved by decreasing the role of mechanical abrasion in the CMP of these materials and increasing the role of chemical polishing, which can also improve material removal rates. Increasing the role of chemical polishing can be accomplished by creating a polishing slurry, which contains components that interact chemically with the surface to be polished. This slurry may or may not also contain soft abrasive particles, which replace the hard abrasive particles of conventional slurries. Use of soft abrasive particles can reduce the role of mechanical abrasion in the CMP process. Use of this slurry in CMP can reduce surface scratches and device damage.
摘要:
A coil for a magnetic resonance imaging device consists of multiple coil elements arranged about an imaging space. Each coil element comprise radiating structures oriented at an angle to a tangent of the imaging space. Angling the radiating structures reduces mutual coupling between coil elements and enhances the penetration of the radio frequency field to the imaging space.
摘要:
Processing instruction grouping information is provided that includes: reading addresses of machine instructions grouped by a processor at runtime from a buffer to form an address file; analyzing the address file to obtain grouping information of the machine instructions; converting the machine instructions in the address file into readable instructions; and obtaining grouping information of the readable instructions based on the grouping information of the machine instructions and the readable instructions resulted from conversion. Status of grouping and processing performed on instructions by a processor at runtime can be acquired dynamically, such that processing capability of the processor can be better utilized.
摘要:
A technique includes receiving a user input in an array-oriented database. The user input indicates a database operation and processing a plurality of chunks of data stored by the database to perform the operation. The processing in dudes selectively distributing the processing of the plurality of chunks between a first group of at least one central processing unit and a second group of at least one co-processor.
摘要:
The disclosure provides a forming machine without pattern casting, including: a multi-axis motion system; a cutting system, connected with the multi-axis motion system; a driving system, driving the multi-axis motion system to move; and a machining base, wherein the machining base includes a fixing seat and a turnover mechanism, wherein the turnover mechanism is revolvably connected with the fixing seat. Since the forming machine without pattern casting of the disclosure adopts a tilting type and needs no working platform, most of the waste sand grains generated from cutting fall freely into the shakeout groove arranged below the fixing seat, and will not fly into the multi-axis motion system, and will not cause stop failure; thus the precision and service life of the forming machine without pattern casting are improved.
摘要:
The disclosure provides a containerless casting forming machine, including: a multi-axis motion system which at least includes an X-axis motion system, a Y-axis motion system and a Z-axis motion system, and a workbench which is below the multi-axis motion system; and further includes: a moving platform system below the workbench, including a moving bracket which can reciprocate along the direction parallel to the X axis, a lifting device provided on the moving bracket, which is used for lifting and supporting the workbench to enable the linkage between the workbench and the moving bracket. The containerless casting forming machine of the disclosure can move the workbench without a lifting tool, and machine a casting mold with a large size and a complex cavity, and causes little pollution to the environment.