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公开(公告)号：US5464570A
公开(公告)日：1995-11-07
申请号：US140958
申请日：1993-10-25
摘要： The invention includes the discovery that the addition of a thermosetting polymer to a thick-film conductor formulation including a thermoplastic polymer will substantially retard the spreading of the thick-film conductor ink upon firing of the printed conductor. The thermosetting polymer may be from the family of allylic esters, for example poly(diallyl phthalate). The invention also includes the discovery that the thermosetting resin can be dissolved with an organic solvent to form an additive so as to uniformly distribute the thermosetting polymer within the thick-film conductor formulation including the thermoplastic polymers. Preferred organic solvents include alcohols with a weight ratio of thermoset-to-organic solvent ranging from about 1:1.5 to about 1:3.
摘要翻译： 本发明包括以下发现：在包含热塑性聚合物的厚膜导体制剂中添加热固性聚合物将基本上延迟在印刷导体烧制时厚膜导体油墨的铺展。 热固性聚合物可以来自烯丙基酯类，例如聚（邻苯二甲酸二烯丙酯）。 本发明还包括以下发现：热固性树脂可以用有机溶剂溶解以形成添加剂，以便将热固性聚合物均匀分布在包括热塑性聚合物的厚膜导体制剂中。 优选的有机溶剂包括重量比为约1:1.5至约1:3的热固性有机溶剂的醇。
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公开(公告)号：US06811892B2
公开(公告)日：2004-11-02
申请号：US10226370
申请日：2002-08-22
IPC分类号： B23K3526
CPC分类号： B23K35/262 , B23K2101/36 , H01L24/81 , H01L2224/81801 , H01L2924/01087 , H01L2924/01322 , H01L2924/01327 , H01L2924/14 , H05K3/3436 , H05K3/3463 , Y10T428/12528 , Y10T428/12715 , Y10T428/12903 , Y10T428/24917 , H01L2924/00
摘要： A tin-lead solder alloy containing copper and optionally silver as its alloying constituents. The solder alloy consists essentially of, by weight, about 55% to about 75% tin, about 11% to about 44% lead, up to about 4% silver, nickel, palladium, platinum and/or gold, greater than 1% to about 10% copper, and incidental impurities. The solder alloys contain a small portion of CuSn intermetallic compounds, and exhibit a melting mechanism in which all but the intermetallic compounds melt within a narrow temperature range, though the actual liquidus temperature of the alloys may be considerably higher, such that the alloys can be treated as requiring peak reflow temperatures of about 250° C. or less. The intermetallic compounds precipitate out to form a diffusion barrier that increases the reliability of solder connections formed therewith.
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公开(公告)号：US06630251B1
公开(公告)日：2003-10-07
申请号：US10252502
申请日：2002-09-23
申请人： Bradley H. Carter , Shing Yeh
发明人： Bradley H. Carter , Shing Yeh
IPC分类号： B32B1501
CPC分类号： C22C13/00 , B23K35/007 , B23K35/262 , B23K35/268 , B23K2101/36 , C22C11/00 , H05K1/092 , H05K3/3463 , Y10T428/12701 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , Y10T428/12896
摘要： A tin-lead solder alloy containing copper and/or nickel and optionally silver, palladium, platinum and/or gold as its alloying constituents. The solder alloy consists essentially of, by weight, about 5% to about 70% tin, up to about 4% silver palladium, platinum and/or gold, about 0.5% to about 10% copper and/or nickel, the balance lead and incidental impurities. The presence of copper and/or nickel in the alloy has the beneficial effect of inhibiting the dissolution and leaching of silver from a silver-containing thick-film, such as a conductor or solder pad, into the molten solder alloy during reflow. In addition, solder joints formed of the solder alloy form a diffusion barrier layer of intermetallic compounds that inhibit solid-state interdiffusion between silver from a silver-containing thick-film and tin from the solder joint.
摘要翻译： 含有铜和/或镍的锡铅焊料合金和任选的银，钯，铂和/或金作为其合金成分。 焊料合金基本上由重量计约5％至约70％的锡，至多约4％的银钯，铂和/或金，约0.5％至约10％的铜和/或镍，余量铅和 附带杂质。 合金中铜和/或镍的存在有利于在回流期间将银从含银厚膜（例如导体或焊盘）中溶解并浸出到熔融焊料合金中。 此外，由焊料合金形成的焊点形成金属间化合物的扩散阻挡层，其阻止来自含银厚膜的银与来自焊料接头的锡之间的固态相互扩散。
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4.发明申请Fuel Injector with a Trimmable Heater and an Increased Heater Contact Area 审中-公开燃油喷射器与微调加热器和增加加热器接触面积公开(公告)号：US20120048962A1
公开(公告)日：2012-03-01
申请号：US12870390
申请日：2010-08-27
申请人： Jason C. Short , John K. Isenberg , Bradley H. Carter , Cynthia J. Baron , Scott Allen Williams , Otto Muller-Girard, JR.
发明人： Jason C. Short , John K. Isenberg , Bradley H. Carter , Cynthia J. Baron , Scott Allen Williams , Otto Muller-Girard, JR.
CPC分类号： F02M53/06
摘要： A fuel injector wherein a cylindrical surface supports an electrical heating structure covering 360° or almost 360° of the surface for heating fuel. The structure comprises a first dielectric layer adhered to the surface; a thick film resistance heating element; a second dielectric layer; spaced-apart first and second conductor pads, wherein the first conductor pad is disposed in contact with a dielectric layer and a first end of the heating element, and wherein the second conductor pad is disposed in contact with a dielectric layer and a second end of the heating element. Another dielectric layer may be disposed over the preceding layers and the first and second conductor pads and having first and second windows formed therein for access to the first and second conductor pads. The resistance heating element may selectively be trimmed by overprinting in a pattern one or more times to improve the uniformity of heating.
摘要翻译： 一种燃料喷射器，其中圆柱形表面支撑覆盖表面360°或几乎360°以加热燃料的电加热结构。 该结构包括附着在该表面上的第一介电层; 厚膜电阻加热元件; 第二电介质层; 间隔开的第一和第二导体焊盘，其中第一导体焊盘设置成与电介质层和加热元件的第一端接触，并且其中第二导体焊盘设置成与电介质层接触，第二导体焊盘的第二端 加热元件。 另外的电介质层可以设置在先前的层和第一和第二导体焊盘之上，并且具有形成在其中的第一和第二窗口用于接近第一和第二导体焊盘。 电阻加热元件可以通过以图案重叠一次或多次来选择性地修整，以提高加热的均匀性。
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5.发明授权Method for improving the thermal cycled adhesion of thick-film conductors on dielectric 失效改善电介质厚膜导体热循环粘附性的方法公开(公告)号：US07294390B2
公开(公告)日：2007-11-13
申请号：US11111317
申请日：2005-04-21
CPC分类号： H05K1/092 , C04B37/025 , C04B2237/062 , H05K3/248 , H05K2201/0338 , H05K2201/035 , Y10T428/24917 , Y10T428/24926
摘要： An improved electrical printed circuit exhibiting a combination of enhanced solderability and outstanding adhesion with a dielectric substrate includes a stack of two different types of conductive films. The stack includes a first conductive film that is printed onto the substrate with an ink that has been specially formulated to achieve enhanced adhesion with the substrate, and a second film that is applied over the first film using an ink that has been specifically formulated to achieve enhanced solderability.
摘要翻译： 表现出增强的可焊性和与介电基片的突出粘附性的组合的改进的电印刷电路包括两种不同类型的导电膜的叠层。 该堆叠包括第一导电膜，其被印刷在具有专门配制以实现与基板的增强的粘附性的油墨的基底上;以及第二膜，其使用特别配制成实现的油墨施加在第一膜上 增强的可焊性。
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公开(公告)号：US20090001546A1
公开(公告)日：2009-01-01
申请号：US11823690
申请日：2007-06-28
申请人： Lynda G. Flederbach , Rick A. Weed , Bradley H. Carter , Erich W. Gerbsch , John K. Isenberg , Carl W. Berlin
发明人： Lynda G. Flederbach , Rick A. Weed , Bradley H. Carter , Erich W. Gerbsch , John K. Isenberg , Carl W. Berlin
IPC分类号： H01L23/373
CPC分类号： H01L23/49861 , H01L23/49833 , H01L2924/0002 , H01L2924/00
摘要： An electrically isolated and thermally conductive double-sided pre-packaged integrated circuit component exhibiting excellent heat dissipative properties, durability and strength, and which can be manufactured at a low cost includes electrically insulated and thermally conductive substrate members having outer surfaces, ultra-thick thick film materials secured to the outer surfaces of the substrate members and a lead member and a transistor member positioned between the substrate members.
摘要翻译： 显示出优异的散热特性，耐久性和强度的电绝缘导热双面预先封装的集成电路组件，并且可以以低成本制造，包括具有外表面的超绝缘导热基板部件 固定在基板构件的外表面上的薄膜材料和位于基板构件之间的引线构件和晶体管构件。
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公开(公告)号：US06619536B2
公开(公告)日：2003-09-16
申请号：US10379753
申请日：2003-03-05
IPC分类号： B23K3102
CPC分类号： H01L24/10 , B23K35/26 , B23K35/262 , B23K35/268 , H01L23/488 , H01L24/13 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/00
摘要： A solder alloy containing indium, lead, silver and copper as its alloying constituents, and a soldering process employing the solder alloy. The solder alloy consists essentially of, by weight, about 50% to about 65% indium, about 0.5% to about 3.0% silver, up to about 3.0% copper, the balance lead and incidental impurities. The alloy preferably has a solidus temperature in a range of about 173° C. to about 178° C., and a liquidus temperature in a range of about 187° C. to about 196° C. As such, the alloy can be used in a reflow process with a peak reflow temperature of about 220° C. to about 240° C., and is therefore compatible with most circuit components and can be simultaneously reflowed with 63Sn-37Pb solder.
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公开(公告)号：US06767411B2
公开(公告)日：2004-07-27
申请号：US10099861
申请日：2002-03-15
申请人： Shing Yeh , Bradley H. Carter , Curtis W. Melcher
发明人： Shing Yeh , Bradley H. Carter , Curtis W. Melcher
IPC分类号： B23K35363
CPC分类号： B23K35/262
摘要： A lead-free solder alloy consisting essentially of, by weight, 3.0% to 3.5% silver, greater than 1% to about 15% copper, the balance tin and incidental impurities, and having an effective melting range of about 215° C. to about 222° C. The solder alloy is noneutectic, and therefore characterized by solidus and liquidus temperatures, the former being in a range of about 215° C. to about 218° C., while the latter is about 290° C. or more. However, the melting mechanism exhibited by the alloy is such that the alloy is substantially all melted and does not exhibit a “mushy zone” above the effective melting range, enabling the alloy to behave similarly to the SnAgCu eutectic alloy.
摘要翻译： 一种无铅焊料合金，其基本上由重量比为3.0％至3.5％的银，大于1％至约15％的铜，余量为锡和附带杂质，并且具有约215℃的有效熔融范围， 约222℃。焊料合金是共晶的，因此以固相和液相线温度为特征，前者在约215℃至约218℃的范围内，而后者为约290℃或更高 。 然而，合金显示的熔融机理使得合金基本上全部熔化，并且在有效熔融范围之上不显示“糊状区域”，使合金的性能与SnAgCu共晶合金类似。
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公开(公告)号：US06570260B1
公开(公告)日：2003-05-27
申请号：US10075979
申请日：2002-02-15
IPC分类号： H01L2348
CPC分类号： H01L24/10 , B23K35/26 , B23K35/262 , B23K35/268 , H01L23/488 , H01L24/13 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/00
摘要： A solder alloy containing indium, lead, silver and copper as its alloying constituents, and a soldering process employing the solder alloy. The solder alloy consists essentially of, by weight, about 50% to about 65% indium, about 0.5% to about 3.0% silver, up to about 3.0% copper, the balance lead and incidental impurities. The alloy preferably has a solidus temperature in a range of about 173° C. to about 178° C., and a liquidus temperature in a range of about 187° C. to about 196° C. As such, the alloy can be used in a reflow process with a peak reflow temperature of about 220° C. to about 240° C., and is therefore compatible with most circuit components and can be simultaneously reflowed with 63Sn-37Pb solder.
摘要翻译： 含有铟，铅，银和铜作为其合金成分的焊料合金以及采用焊料合金的焊接工艺。 焊料合金基本上由重量计约50％至约65％的铟，约0.5％至约3.0％的银，至多约3.0％的铜，余量的铅和附带的杂质。 合金优选固相线温度在约173℃至约178℃的范围内，液相线温度在约187℃至约196℃的范围内。因此，可以使用该合金 在高回流温度为约220℃至约240℃的回流工艺中，因此与大多数电路部件兼容，并可与63Sn-37Pb焊料同时回流。
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