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公开(公告)号:US06492309B1
公开(公告)日:2002-12-10
申请号:US09698690
申请日:2000-10-27
申请人: Frederick E. Behr , Paul E. Rajtar , Lawrence A. Zazzera , Michael J. Parent , Silva K. Theiss , Billy L. Weaver
发明人: Frederick E. Behr , Paul E. Rajtar , Lawrence A. Zazzera , Michael J. Parent , Silva K. Theiss , Billy L. Weaver
IPC分类号: C09K1300
CPC分类号: C11D11/0047 , C11D7/08 , C11D7/5018 , H01L21/02063
摘要: A homogeneous compositions containing a fluorinated solvent, hydrogen fluoride, and an optional co-solvent, and the use of these compositions for etching of microelectromechanical devices is described.
摘要翻译: 描述了包含氟化溶剂,氟化氢和任选的共溶剂的均匀组合物,以及这些组合物用于蚀刻微机电装置的用途。
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公开(公告)号:US06310018B1
公开(公告)日:2001-10-30
申请号:US09541453
申请日:2000-03-31
IPC分类号: C09K1300
CPC分类号: C11D11/0047 , C11D7/08 , C11D7/5018 , H01L21/02063
摘要: A homogeneous compositions containing a fluorinated solvent, hydrogen fluoride, and a co-solvent, and the use of these compositions for cleaning and etching of substrates is described.
摘要翻译: 描述了含有氟化溶剂,氟化氢和共溶剂的均匀组合物,以及这些组合物用于清洗和蚀刻基材的用途。
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3.Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor 失效
标题翻译: 用于电化学或化学沉积铜互连的电镀溶液及其方法公开(公告)号:US07147767B2
公开(公告)日:2006-12-12
申请号:US10320263
申请日:2002-12-16
申请人: Steven D. Boyd , Susrut Kesari , William M. Lamanna , Michael J. Parent , Lawrence A. Zazzera , Haiyan Zhang
发明人: Steven D. Boyd , Susrut Kesari , William M. Lamanna , Michael J. Parent , Lawrence A. Zazzera , Haiyan Zhang
摘要: The present invention provides plating solutions having either copper bis(perfluoroalkanesulfonyl) imides or copper tris(perfluoroalkanesulfonyl) methides and methods of electrochemically or chemically depositing copper interconnects using these plating solutions.
摘要翻译: 本发明提供具有铜双(全氟烷基磺酰基)酰亚胺或三(全氟烷基磺酰基)磺酸铜的电镀溶液和使用这些电镀溶液电化学或化学沉积铜互连的方法。
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公开(公告)号:US07030067B2
公开(公告)日:2006-04-18
申请号:US10373273
申请日:2003-02-24
IPC分类号: C10M135/08 , C10M105/74
CPC分类号: C09K13/08 , B01F17/0057 , C09G1/02 , C09K3/1463 , C10M135/10 , C10M169/04 , C10M2207/026 , C10M2207/027 , C10M2207/28 , C10M2209/084 , C10M2215/06 , C10M2219/044 , C10M2223/0405 , C10M2229/041 , C10N2210/01 , C10N2230/24 , C10N2240/08 , C25D3/02 , C25D3/38 , H01L21/02052 , H01L21/3212 , Y10T428/3154
摘要: The present invention provides for the use of bis(perfluoroalkanesulfonyl)imide and its salts as surfactants or additives applications having an extreme environment.
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5.Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor 失效
标题翻译: 用于抛光和/或清洁铜互连和/或其膜和组合物的方法公开(公告)号:US06858124B2
公开(公告)日:2005-02-22
申请号:US10320254
申请日:2002-12-16
IPC分类号: C09G1/02 , C11D1/00 , C11D3/34 , C11D11/00 , C23F3/06 , C23G1/10 , H01L21/02 , H01L21/288 , H01L21/321 , H01L21/3213 , H01L21/768 , C25F3/00 , C23G1/00
CPC分类号: H01L21/32134 , C09G1/02 , C11D1/004 , C11D3/349 , C11D11/0047 , C23F3/06 , C23G1/103 , H01L21/02074 , H01L21/3212 , H01L21/32125
摘要: The present invention provides methods of polishing and/or cleaning copper interconnects using sulfonic acid compositions.
摘要翻译: 本发明提供了使用磺酸组合物抛光和/或清洁铜互连的方法。
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6.Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor 失效
标题翻译: 用于抛光和/或清洁铜互连和/或其膜和组合物的方法公开(公告)号:US06884338B2
公开(公告)日:2005-04-26
申请号:US10319954
申请日:2002-12-16
IPC分类号: C09G1/02 , C11D3/34 , C11D11/00 , C23F3/06 , C23G1/10 , H01L21/02 , H01L21/288 , H01L21/321 , H01L21/3213 , H01L21/768 , C25F3/00 , C23G1/00
CPC分类号: C11D3/349 , C09G1/02 , C11D11/0047 , C23F3/06 , C23G1/103 , H01L21/02074 , H01L21/32125
摘要: The present invention provides methods of polishing and/or cleaning copper interconnects using bis(perfluoroalkanesulfonyl) imide acids or copper tris(perfluoroalkanesulfonyl) methide acids compositions.
摘要翻译: 本发明提供了使用双(全氟烷基磺酰基)酰亚胺酸或三(全氟烷基磺酰基)甲磺酸铜组合物抛光和/或清洗铜互连的方法。
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7.Bis(perfluoroalkanesulfonyl)imides and their salts as surfactants/additives for applications having extreme environments and methods therefor 失效
标题翻译: 二(全氟烷基磺酰基)酰亚胺及其盐作为具有极端环境和方法的应用的表面活性剂/添加剂公开(公告)号:US06555510B2
公开(公告)日:2003-04-29
申请号:US09853065
申请日:2001-05-10
IPC分类号: C09K1308
CPC分类号: C09K13/08 , B01F17/0057 , C09G1/02 , C09K3/1463 , C10M135/10 , C10M169/04 , C10M2207/026 , C10M2207/027 , C10M2207/28 , C10M2209/084 , C10M2215/06 , C10M2219/044 , C10M2223/0405 , C10M2229/041 , C10N2210/01 , C10N2230/24 , C10N2240/08 , C25D3/02 , C25D3/38 , H01L21/02052 , H01L21/3212 , Y10T428/3154
摘要: The present invention provides for the use of bis(perfluoroalkanesulfonyl)imide and its salts as surfactants or additives applications having an extreme environment.
摘要翻译: 本发明提供了双(全氟烷基磺酰基)酰亚胺及其盐作为具有极端环境的表面活性剂或添加剂应用的用途。
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公开(公告)号:US06841079B2
公开(公告)日:2005-01-11
申请号:US10160738
申请日:2002-05-31
申请人: Timothy D. Dunbar , Lawrence A. Zazzera , Mark J. Pellerite , Larry D. Boardman , George G. Moore , Miguel A. Guerra , Cheryl L. Elsbernd
发明人: Timothy D. Dunbar , Lawrence A. Zazzera , Mark J. Pellerite , Larry D. Boardman , George G. Moore , Miguel A. Guerra , Cheryl L. Elsbernd
CPC分类号: B81C1/0096 , B81B3/0005 , B82Y30/00
摘要: Silicon substrates having Si—H bonds are chemically modified using a fluorinated olefin having the formula: wherein m is an integer greater than or equal to 1; n is an integer greater than or equal to 0; Z is a divalent linking group; and Rf is a highly fluorinated organic group.
摘要翻译: 具有Si-H键的硅衬底使用具有下式的氟化烯烃进行化学改性:其中m是大于或等于1的整数; n是大于或等于0的整数; Z是二价连接基团; Rf是高度氟化的有机基团。
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