公开(公告)号：US06542830B1

公开(公告)日：2003-04-01

申请号：US09142546

申请日：1998-09-10

申请人： Fumio Mizuno ,  Seiji Isogai ,  Kenji Watanabe ,  Yasuhiro Yoshitake ,  Terushige Asakawa ,  Yuichi Ohyama ,  Hidekuni Sugimoto ,  Seiji Ishikawa ,  Masataka Shiba ,  Jun Nakazato ,  Makoto Ariga ,  Tetsuji Yokouchi ,  Toshimitsu Hamada ,  Ikuo Suzuki ,  Masami Ikota ,  Mari Nozoe ,  Isao Miyazaki ,  Yoshiharu Shigyo

发明人： Fumio Mizuno ,  Seiji Isogai ,  Kenji Watanabe ,  Yasuhiro Yoshitake ,  Terushige Asakawa ,  Yuichi Ohyama ,  Hidekuni Sugimoto ,  Seiji Ishikawa ,  Masataka Shiba ,  Jun Nakazato ,  Makoto Ariga ,  Tetsuji Yokouchi ,  Toshimitsu Hamada ,  Ikuo Suzuki ,  Masami Ikota ,  Mari Nozoe ,  Isao Miyazaki ,  Yoshiharu Shigyo

IPC分类号： H01L2166

CPC分类号： H01L22/20 ,  G01N21/9501 ,  G01R31/2894 ,  G01R33/06 ,  H01L2223/54466 ,  H01L2924/0002 ,  H01L2924/00

摘要： A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.

摘要翻译： 根据本发明的处理管理系统包括用于检查晶片上的缺陷的检查装置，通过通信网络连接的检查装置，从这些检查装置获得的检查信息和图像信息被收集以构建数据库和图像 文件，其中缺陷的定义通过基于检查信息和从检查装置获得的图像信息来表征缺陷的元件的组合来给出。 通过给出缺陷的定义，可以细分和知道缺陷的特征。 因此，可以研究缺陷的原因。

公开(公告)号：US06757621B2

公开(公告)日：2004-06-29

申请号：US10342871

申请日：2003-01-16

申请人： Fumio Mizuno ,  Seiji Isogai ,  Kenji Watanabe ,  Yasuhiro Yoshitake ,  Terushige Asakawa ,  Yuichi Ohyama ,  Hidekuni Sugimoto ,  Seiji Ishikawa ,  Masataka Shiba ,  Jun Nakazato ,  Makoto Ariga ,  Tetsuji Yokouchi ,  Toshimitsu Hamada ,  Ikuo Suzuki ,  Masami Ikota ,  Mari Nozoe ,  Isao Miyazaki ,  Yoshiharu Shigyo

发明人： Fumio Mizuno ,  Seiji Isogai ,  Kenji Watanabe ,  Yasuhiro Yoshitake ,  Terushige Asakawa ,  Yuichi Ohyama ,  Hidekuni Sugimoto ,  Seiji Ishikawa ,  Masataka Shiba ,  Jun Nakazato ,  Makoto Ariga ,  Tetsuji Yokouchi ,  Toshimitsu Hamada ,  Ikuo Suzuki ,  Masami Ikota ,  Mari Nozoe ,  Isao Miyazaki ,  Yoshiharu Shigyo

IPC分类号： H01L2166

CPC分类号： H01L22/20 ,  G01N21/9501 ,  G01R31/2894 ,  G01R33/06 ,  H01L2223/54466 ,  H01L2924/0002 ,  H01L2924/00

摘要： A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.

摘要翻译： 根据本发明的处理管理系统包括用于检查晶片上的缺陷的检查装置，通过通信网络连接的检查装置，从这些检查装置获得的检查信息和图像信息被收集以构建数据库和图像 文件，其中缺陷的定义通过基于检查信息和从检查装置获得的图像信息来表征缺陷的元件的组合来给出。 通过给出缺陷的定义，可以细分和知道缺陷的特征。 因此，可以研究缺陷的原因。

公开(公告)号：US06583634B1

公开(公告)日：2003-06-24

申请号：US09559563

申请日：2000-04-27

申请人： Mari Nozoe ,  Hiroyuki Shinada ,  Kenji Watanabe ,  Keiichi Saiki ,  Aritoshi Sugimoto ,  Hiroshi Morioka ,  Maki Tanaka ,  Hiroshi Miyai

发明人： Mari Nozoe ,  Hiroyuki Shinada ,  Kenji Watanabe ,  Keiichi Saiki ,  Aritoshi Sugimoto ,  Hiroshi Morioka ,  Maki Tanaka ,  Hiroshi Miyai

IPC分类号： G01R31305

CPC分类号： H01J37/28 ,  G01R31/307 ,  G09G3/006 ,  H01J37/265 ,  H01J2237/221 ,  H01J2237/2817 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： In order to obtain optimum irradiation conditions of an electron beam according to the material and structure of a circuit pattern to be inspected and the kind of a failure to be detected and inspect under the optimum conditions without delay of the inspection time, an inspection device for irradiating the electron beam 19 to the sample board 9 which is a sample, detecting generated secondary electrons by the detector 7, storing obtained signals sequentially in the storage, comparing the same pattern stored in the storage by the comparison calculation unit, and extracting a failure by comparing the predetermined threshold value with the comparison signal by the failure decision unit is provided, wherein the optimum value of the irradiation energy is stored in the data base inside the device beforehand according to the structure of a sample and a recommended value of the irradiation energy suited to inspection can be searched for by inputting or selecting the irradiation energy by a user or inputting information regarding the structure of an article to be inspected.

摘要翻译： 为了根据要检查的电路图案的材料和结构获得电子束的最佳照射条件以及在最佳条件下无故障检测的种类和检查时间的延迟，检查装置 将电子束19照射到作为样本的样品板9，由检测器7检测产生的二次电子，将获得的信号顺序地存储在存储器中，比较由比较计算单元存储在存储器中的相同模式，并提取故障 提供了通过故障判定单元将预定阈值与比较信号进行比较，其中根据样本的结构和照射的推荐值，将照射能量的最佳值预先存储在设备内部的数据库中 可以通过使用照射能量的输入或选择来搜索适合于检查的能量 或输入关于被检查物品的结构的信息。

公开(公告)号：US20070023658A1

公开(公告)日：2007-02-01

申请号：US11518893

申请日：2006-09-12

申请人： Mari Nozoe ,  Hidetoshi Nishiyama ,  Shigeaki Hijikata ,  Kenji Watanabe ,  Koji Abe

发明人： Mari Nozoe ,  Hidetoshi Nishiyama ,  Shigeaki Hijikata ,  Kenji Watanabe ,  Koji Abe

IPC分类号： G21K7/00

CPC分类号： G06T7/0004 ,  G01N23/20 ,  G06T2207/30148 ,  H01J2237/2487 ,  H01J2237/2817

摘要： An electron beam apparatus equipped with a review function of a semiconductor wafer includes a scanning electron microscope to obtain image information of a semiconductor wafer, and an information processing apparatus to process the image information. The information processing apparatus includes a data input unit to receive positional information of a defect on the wafer, a storage for storing a plurality of image information of a position on the wafer corresponding to the positional information, and an image processing unit that retrieves any of the plurality of image information, and classifies the retrieved image information corresponding to the positional information depending on the type of defect.

摘要翻译： 配备有半导体晶片的检查功能的电子束装置包括扫描电子显微镜以获得半导体晶片的图像信息，以及处理图像信息的信息处理装置。 信息处理装置包括：数据输入单元，用于接收晶片上的缺陷的位置信息，存储用于存储与位置信息对应的晶片上的位置的多个图像信息;以及图像处理单元， 多个图像信息，并且根据缺陷的类型对与位置信息相对应的检索到的图像信息进行分类。

公开(公告)号：US20060018532A1

公开(公告)日：2006-01-26

申请号：US11235136

申请日：2005-09-27

申请人： Maki Tanaka ,  Masahiro Watanabe ,  Kenji Watanabe ,  Mari Nozoe ,  Hiroshi Miyai

发明人： Maki Tanaka ,  Masahiro Watanabe ,  Kenji Watanabe ,  Mari Nozoe ,  Hiroshi Miyai

IPC分类号： G06K9/00

CPC分类号： G01N23/2251

摘要： A method and apparatus for inspecting a wafer in which a focused charged particle beam is irradiated onto a surface of a wafer on which patterns are formed through a semiconductor device fabrication process, a secondary charged particle image of a desired area of the wafer is obtained by detecting secondary charged particles emitted from the surface of the wafer, and information about image feature amount of each pattern within the desired area from the obtained secondary charged particle beam image. The information about image feature amount is compared with a preset value, and on the basis of a result of the comparison, a quality of patterns which have been formed around the desired area is estimated, and information of a result of the estimation is outputted.

公开(公告)号：US06777677B2

公开(公告)日：2004-08-17

申请号：US10463576

申请日：2003-06-18

申请人： Mari Nozoe ,  Hidetoshi Nishiyama ,  Shigeaki Hijikata ,  Kenji Watanabe ,  Koji Abe

发明人： Mari Nozoe ,  Hidetoshi Nishiyama ,  Shigeaki Hijikata ,  Kenji Watanabe ,  Koji Abe

IPC分类号： H01J3728

CPC分类号： G06T7/0004 ,  G01N23/20 ,  G06T2207/30148 ,  H01J2237/2487 ,  H01J2237/2817

摘要： A pattern inspection system for inspecting a substrate surface on which a predetermined pattern is formed with radiation of an electron beam and an optical beam. the pattern inspection system includes a radiation and which radiates an electron beam to the substrate, a detection unit which detects a secondarily generated signal attributable to the radiation of the electron beam, a retrieval unit which retrieves an image from the signal detected by the detection unit, and an image processing unit which classifies the retrieved image depending on a type of the image.

摘要翻译： 一种图案检查系统，用于检查其上形成有电子束和光束的辐射的预定图案的基板表面。 图案检查系统包括辐射并且向基板辐射电子束，检测单元，其检测归因于电子束的辐射的次要生成的信号;检索单元，其从由检测单元检测到的信号中检索图像 以及图像处理单元，其根据图像的类型对检索到的图像进行分类。

公开(公告)号：US06703850B2

公开(公告)日：2004-03-09

申请号：US10430188

申请日：2003-05-07

申请人： Mari Nozoe ,  Hiroyuki Shinada ,  Kenji Watanabe ,  Keiichi Saiki ,  Aritoshi Sugimoto ,  Hiroshi Morioka ,  Maki Tanaka ,  Hiroshi Miyai

发明人： Mari Nozoe ,  Hiroyuki Shinada ,  Kenji Watanabe ,  Keiichi Saiki ,  Aritoshi Sugimoto ,  Hiroshi Morioka ,  Maki Tanaka ,  Hiroshi Miyai

IPC分类号： G01R31305

CPC分类号： H01J37/28 ,  G01R31/307 ,  G09G3/006 ,  H01J37/265 ,  H01J2237/221 ,  H01J2237/2817 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： In order to obtain optimum irradiation conditions of an electron beam according to the material and structure of a circuit pattern to be inspected and the kind of a failure to be detected and inspect under the optimum conditions without delay of the inspection time, an inspection device for irradiating the electron beam 19 to the sample board 9 which is a sample, detecting generated secondary electrons by the detector 7, storing obtained signals sequentially in the storage, comparing the same pattern stored in the storage by the comparison calculation unit, and extracting a failure by comparing the predetermined threshold value with the comparison signal by the failure decision unit is provided, wherein the optimum value of the irradiation energy is stored in the data base inside the device beforehand according to the structure of a sample and a recommended value of the irradiation energy suited to inspection can be searched for by inputting or selecting the irradiation energy by a user or inputting information regarding the structure of an article to be inspected.

摘要翻译： 为了根据要检查的电路图案的材料和结构获得电子束的最佳照射条件以及在最佳条件下无故障检测的种类和检查时间的延迟，检查装置 将电子束19照射到作为样本的样品板9，由检测器7检测产生的二次电子，将获得的信号顺序地存储在存储器中，比较由比较计算单元存储在存储器中的相同模式，并提取故障 提供了通过故障判定单元将预定阈值与比较信号进行比较，其中根据样本的结构和照射的推荐值，将照射能量的最佳值预先存储在设备内部的数据库中 可以通过使用照射能量的输入或选择来搜索适合于检查的能量 或输入关于被检查物品的结构的信息。

公开(公告)号：US06583414B2

公开(公告)日：2003-06-24

申请号：US09725900

申请日：2000-11-30

申请人： Mari Nozoe ,  Hidetoshi Nishiyama ,  Shigeaki Hijikata ,  Kenji Watanabe ,  Koji Abe

发明人： Mari Nozoe ,  Hidetoshi Nishiyama ,  Shigeaki Hijikata ,  Kenji Watanabe ,  Koji Abe

IPC分类号： H01J37147

CPC分类号： G06T7/0004 ,  G01N23/20 ,  G06T2207/30148 ,  H01J2237/2487 ,  H01J2237/2817

摘要： There are provided an inline inspection system and inspection method for inspecting the substrate surface on which semiconductors and circuit patterns are formed by radiating thereto white beam, laser beam or electron beam, and reviewing, inspecting and discriminating the detected roughness and figure defect, particle and moreover electrical defect on the surface with higher accuracy within a short period of time with the same instrument. Thereby, automatic movement to the position to be reviewed, acquisition of image and classification can be realized. On the occasion of identifying the position to be reviewed on a sample and forming an image through irradiation of electron beam on the basis of the positional information of defect detected with the other inspection instrument, an electrical defect can be reviewed with the voltage contrast mode by designating the electron beam irradiation condition, detectors and detecting condition depending on a kind of defect to be reviewed. The image obtained is automatically classified in the image processing unit and the result is then additionally output to the defect file.

摘要翻译： 提供了一种在线检查系统和检查方法，用于通过向其发射白光束，激光束或电子束来检查其上形成有半导体和电路图案的衬底表面，并且检查和检查检测到的粗糙度和图形缺陷，颗粒和 此外，在相同仪器的短时间内，表面具有较高精度的电气缺陷。 因此，可以实现自动移动到要检查的位置，获取图像和分类。 在通过基于用其他检查仪检测到的缺陷的位置信息的基础上，通过照射电子束来识别要检查的位置并形成图像的情况下，可以通过电压对比度模式来检查电缺陷 指定电子束照射条件，检测器和检测条件取决于要检查的缺陷的种类。 所获得的图像被自动分类到图像处理单元中，然后将结果另外输出到缺陷文件。

公开(公告)号：US07116816B2

公开(公告)日：2006-10-03

申请号：US09793922

申请日：2001-02-28

申请人： Maki Tanaka ,  Takashi Hiroi ,  Masahiro Watanabe ,  Chie Shishido ,  Hiroshi Morioka ,  Kenji Watanabe ,  Hiroshi Miyai ,  Mari Nozoe

发明人： Maki Tanaka ,  Takashi Hiroi ,  Masahiro Watanabe ,  Chie Shishido ,  Hiroshi Morioka ,  Kenji Watanabe ,  Hiroshi Miyai ,  Mari Nozoe

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G06T2207/10056 ,  G06T2207/30121 ,  G06T2207/30148 ,  H01J37/28 ,  H01J2237/221 ,  H01J2237/24592 ,  H01J2237/2811 ,  H01J2237/2817

摘要： In order to enable the most suitable image processing condition to be set as one in which a dispersion in brightness between comparing images caused by object to be inspected and an image detecting system is not applied as a false information, in the present invention, there is obtained a noise characteristic of a secondary electron image caused by the image detecting system is calculated, the most suitable image processing parameters are determined depending on the object to be inspected on the basis of the characteristic, and its comparing processing is performed by using the noise characteristic and the image of the object to be inspected, thereby a dispersion in process for the object to be inspected is evaluated.

摘要翻译： 为了使最合适的图像处理条件被设置为将未被应用的被检查对象所引起的比较图像与图像检测系统之间的亮度的色散作为虚假信息，在本发明中，存在 计算出由图像检测系统引起的二次电子图像的噪声特性，根据特性根据被检查对象确定最合适的图像处理参数，并且通过使用噪声来执行其比较处理 特性和待检查对象的图像，从而评估待检查对象的分散处理。

公开(公告)号：US07112791B2

公开(公告)日：2006-09-26

申请号：US10916451

申请日：2004-08-12

申请人： Mari Nozoe ,  Hidetoshi Nishiyama ,  Shigeaki Hijikata ,  Kenji Watanabe ,  Koji Abe

发明人： Mari Nozoe ,  Hidetoshi Nishiyama ,  Shigeaki Hijikata ,  Kenji Watanabe ,  Koji Abe

IPC分类号： H01J37/00 ,  H01J37/256

CPC分类号： G06T7/0004 ,  G01N23/20 ,  G06T2207/30148 ,  H01J2237/2487 ,  H01J2237/2817

摘要： A sample inspection system having a sample stage holding a sample to be inspected, electron beam optics so as to radiate an electron beam to the sample, a detector unit that detects a secondly generated signal generated in response to radiation of the sample by the electron beam, a storage for storing a plurality of images obtained from the generated signal and information for classifying the plurality of images by a type of defect in the sample, and an image processing unit. The image processing unit retrieves any of the plurality of images and classifies the retrieved image depending on the type of defect including an electrical defect and a defect in the figure.

摘要翻译： 具有保持要检查的样品的样品台的样品检查系统，电子束光学以便向样品辐射电子束的检测器单元，检测器单元，其检测响应于通过电子束的样品的辐射而产生的第二生成的信号 用于存储从所生成的信号获得的多个图像的存储器和用于通过样本中的缺陷类型对所述多个图像进行分类的信息，以及图像处理单元。 图像处理单元检索多个图像中的任一个，并且根据包括图中的电缺陷和缺陷的缺陷的类型对检索到的图像进行分类。