公开(公告)号：US09295166B2

公开(公告)日：2016-03-22

申请号：US14663754

申请日：2015-03-20

Applicant: GLOBALFOUNDRIES INC.

Inventor： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

IPC: H01L21/00 ,  H05K3/34 ,  H01L21/48 ,  B23K1/00 ,  B23K3/06 ,  H01L23/498 ,  H01L21/56 ,  H05K13/04 ,  H01L23/00

CPC classification number: H05K3/3436 ,  B23K1/0016 ,  B23K3/0638 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/11011 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16113 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81065 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/14 ,  H01L2924/20104 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/35 ,  H05K3/3494 ,  H05K13/0465 ,  H05K2203/043 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly process, the reflow temperature is above the melting temperature of the outer layers and below the melting temperature of the inner portions of the solder bumps. As the inner portions of the solder bumps do not collapse during reflow, a flip chip assembly can be made at relatively low temperatures and have a high stand-off height. A structure having double solder bumps facilitates flip chip assembly.