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    Land grid array fabrication using elastomer core and conducting metal shell or mesh
    3.
    发明授权
    Land grid array fabrication using elastomer core and conducting metal shell or mesh 失效
    使用弹性体芯和导电金属壳或网的土地格栅阵列制造

    公开(公告)号：US07736152B2

    公开(公告)日：2010-06-15

    申请号：US12249035

    申请日：2008-10-10

    申请人： Gareth G. Hougham ,  Keith E. Fogel ,  Paul A. Lauro ,  Joseph Zinter, Jr.

    发明人： Gareth G. Hougham ,  Keith E. Fogel ,  Paul A. Lauro ,  Joseph Zinter, Jr.

    IPC分类号： H01R12/00

    CPC分类号： H01R13/2414 ,  H01R12/7082 ,  H01R12/714 ,  H01R43/007 ,  H05K3/4007 ,  H05K3/42 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/0959 ,  H05K2201/10378 ,  Y10S439/931 ,  Y10T442/109 ,  Y10T442/172

    摘要： Methods for fabricating Land Grid Array (LGA) interposer contacts that are both conducting and elastic. Also provided are LGA interposer contacts as produced by the inventive methods. Provided is LGA type which utilizes a pure unfilled elastomer button core that is covered with an electrically-conductive material that is continuous from the top surface to the bottom surface of the button structure. In order to obviate the disadvantages and drawbacks which are presently encountered in the technology pertaining to the fabrication and structure of land grid arrays using electrically-conductive interposer contacts, there is provided both methods and structure for molding elastomer buttons into premetallized LGA carrier sheets, and wherein the non-conductive elastomer buttons are surface-metallized in order to convert them into conductive electrical contacts.

    摘要翻译： 制造导电和弹性的Land Grid Array（LGA）插入器触点的方法。 还提供了通过本发明的方法制造的LGA插入器触点。 提供了LGA型，其利用由从按钮结构的顶表面到底表面连续的导电材料覆盖的纯未填充弹性体按钮芯。 为了消除在使用导电插入器触点的地面栅格阵列的制造和结构的技术中目前遇到的缺点和缺点，提供了用于将弹性体按钮模制成预金属化的LGA载体片的方法和结构，以及 其中非导电弹性体按钮被表面金属化以便将它们转换为导电电触点。

    Land grid array fabrication using elastomer core and conducting metal shell or mesh
    4.
    发明授权
    Land grid array fabrication using elastomer core and conducting metal shell or mesh 失效
    使用弹性体芯和导电金属壳或网的土地格栅阵列制造

    公开(公告)号：US07479014B2

    公开(公告)日：2009-01-20

    申请号：US10531494

    申请日：2003-05-13

    申请人： Gareth G. Hougham ,  Keith E. Fogel ,  Paul A. Lauro ,  Joseph Zinter, Jr.

    发明人： Gareth G. Hougham ,  Keith E. Fogel ,  Paul A. Lauro ,  Joseph Zinter, Jr.

    IPC分类号： H01R12/00

    CPC分类号： H01R13/2414 ,  H01R12/7082 ,  H01R12/714 ,  H01R43/007 ,  H05K3/4007 ,  H05K3/42 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/0959 ,  H05K2201/10378 ,  Y10S439/931 ,  Y10T442/109 ,  Y10T442/172

    摘要： Methods for fabricating Land Grid Array (LGA) interposer contacts that are both conducting and elastic. Also provided are LGA interposer contacts as produced by the inventive methods. Provided is LGA type which utilizes a pure unfilled elastomer button core that is covered with an electrically-conductive material that is continuous from the top surface to the bottom surface of the button structure. In order to obviate the disadvantages and drawbacks which are presently encountered in the technology pertaining to the fabrication and structure of land grid arrays using electrically-conductive interposer contacts, there is provided both methods and structure for molding elastomer buttons into premetallized LGA carrier sheets, and wherein the non-conductive elastomer buttons are surface-metallized in order to convert them into conductive electrical contacts.

    摘要翻译： 制造导电和弹性的Land Grid Array（LGA）插入器触点的方法。 还提供了通过本发明的方法制造的LGA插入器触点。 提供了LGA型，其利用由从按钮结构的顶表面到底表面连续的导电材料覆盖的纯未填充弹性体按钮芯。 为了消除在使用导电插入器触点的地面栅格阵列的制造和结构的技术中目前遇到的缺点和缺点，提供了用于将弹性体按钮模制成预金属化的LGA载体片的方法和结构，以及 其中非导电弹性体按钮被表面金属化以便将它们转换为导电电触点。

    LAND GRID ARRAY FABRICATION USING ELASTOMER CORE AND CONDUCTING METAL SHELL OR MESH
    5.
    发明申请
    LAND GRID ARRAY FABRICATION USING ELASTOMER CORE AND CONDUCTING METAL SHELL OR MESH 失效
    使用弹性体芯和导电金属壳或网的土地网阵列制造

    公开(公告)号：US20090042414A1

    公开(公告)日：2009-02-12

    申请号：US12249035

    申请日：2008-10-10

    申请人： Gareth G. Hougham ,  Keith E. Fogel ,  Paul A. Lauro ,  Joseph Zinter, JR.

    发明人： Gareth G. Hougham ,  Keith E. Fogel ,  Paul A. Lauro ,  Joseph Zinter, JR.

    IPC分类号： H01R12/00

    CPC分类号： H01R13/2414 ,  H01R12/7082 ,  H01R12/714 ,  H01R43/007 ,  H05K3/4007 ,  H05K3/42 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/0959 ,  H05K2201/10378 ,  Y10S439/931 ,  Y10T442/109 ,  Y10T442/172

    摘要： Methods for fabricating Land Grid Array (LGA) interposer contacts that are both conducting and elastic. Also provided are LGA interposer contacts as produced by the inventive methods. Provided is LGA type which utilizes a pure unfilled elastomer button core that is covered with an electrically-conductive material that is continuous from the top surface to the bottom surface of the button structure. In order to obviate the disadvantages and drawbacks which are presently encountered in the technology pertaining to the fabrication and structure of land grid arrays using electrically-conductive interposer contacts, there is provided both methods and structure for molding elastomer buttons into premetallized LGA carrier sheets, and wherein the non-conductive elastomer buttons are surface-metallized in order to convert them into conductive electrical contacts.

    摘要翻译： 制造导电和弹性的Land Grid Array（LGA）插入器触点的方法。 还提供了通过本发明的方法制造的LGA插入器触点。 提供了LGA型，其利用由从按钮结构的顶表面到底表面连续的导电材料覆盖的纯未填充弹性体按钮芯。 为了消除在使用导电插入器触点的地面栅格阵列的制造和结构的技术中目前遇到的缺点和缺点，提供了用于将弹性体按钮模制成预金属化的LGA载体片的方法和结构，以及 其中非导电弹性体按钮被表面金属化以便将它们转换为导电电触点。

    THIN SUBSTRATE FABRICATION USING STRESS-INDUCED SUBSTRATE SPALLING
    6.
    发明申请
    THIN SUBSTRATE FABRICATION USING STRESS-INDUCED SUBSTRATE SPALLING 有权
    使用应力诱导基板薄化薄基板制造

    公开(公告)号：US20100311250A1

    公开(公告)日：2010-12-09

    申请号：US12784688

    申请日：2010-05-21

    申请人： Stephen W. Bedell ,  Keith E. Fogel ,  Paul A. Lauro ,  Devendra Sadana

    发明人： Stephen W. Bedell ,  Keith E. Fogel ,  Paul A. Lauro ,  Devendra Sadana

    IPC分类号： H01L21/30

    CPC分类号： H01L31/0304 ,  H01L21/20 ,  H01L21/76254 ,  H01L31/03762 ,  H01L31/0725 ,  H01L31/074 ,  H01L31/075 ,  H01L31/076 ,  H01L31/184 ,  H01L31/1892 ,  H01L31/20 ,  Y02E10/548

    摘要： A method for manufacturing a thin film direct bandgap semiconductor active solar cell device comprises providing a source substrate having a surface and disposing on the surface a stress layer having a stress layer surface area in contact with and bonded to the surface of the source substrate. Operatively associating a handle foil with the stress layer and applying force to the handle foil separates the stress layer from the source substrate, and leaves a portion of the source substrate on the stress layer surface substantially corresponding to the area in contact with the surface of the source substrate. The portion is less thick than the source layer. The stress layer thickness is below that which results in spontaneous spalling of the source substrate. The source substrate may comprise an inorganic single crystal or polycrystalline material such as Si, Ge, GaAs, SiC, sapphire, or GaN. In one embodiment the stress layer comprises a flexible material.

    摘要翻译： 一种制造薄膜直接带隙半导体活性太阳能电池器件的方法，包括提供具有表面的源极衬底，并且在表面上设置应力层，该应力层具有与源极衬底的表面接触并且结合到源极衬底的表面。 将手柄箔与应力层操作地相关联并且向手柄箔施加力将应力层与源衬底分离，并将源衬底的一部分留在应力层表面上，基本上对应于与表面相接触的区域 源底物。 该部分的厚度不如源层厚。 应力层厚度低于导致源底材自发剥落的厚度。 源极衬底可以包括无机单晶或多晶材料，例如Si，Ge，GaAs，SiC，蓝宝石或GaN。 在一个实施例中，应力层包括柔性材料。