摘要:
The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.
摘要:
Improved interconnects are produced by injection molded solder which fills mold arrays with molten solder so that columns that have much greater height to width aspect ratios greater than one are formed, rather than conventional flip chip bumps. The columns may have filler particles or reinforcing conductors therein. In the interconnect structures produced, the cost and time of a subsequent underfill step is reduced or avoided. The problem of incompatibility with optical interconnects between chips because underfills require high loading of silica fillers which scatter light, is solved, thus allowing flip chips to incorporate optical interconnects.
摘要:
A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When high thermal conductivity materials are used, the body acts to transfer the heat away from the substrate to a heat sink.
摘要:
A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When high thermal conductivity materials are used, the body acts to transfer the heat away from the substrate to a heat sink.
摘要:
A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When high thermal conductivity materials are used, the body acts to transfer the heat away from the substrate to a heat sink.
摘要:
A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When high thermal conductivity materials are used, the body acts to transfer the heat away from the substrate to a heat sink.
摘要:
A liquid crystal display device includes a first substrate having a plurality of first electrodes, a second substrate facing the first substrate and having a plurality of second electrodes perpendicular to the first electrodes to define sub-pixels at intersection regions between the first and second electrodes, a liquid crystal layer between the first and second substrates, a plurality of color filters between the first and second substrates adapted to correspond to respective sub-pixels, the color filters including first color filters and second color filters having a different shape than the first color filters, a black matrix between the color filters, the black matrix including vertical portions, horizontal portions, and step portions, each of the step portions corresponding to a respective second color filter, and a plurality of patterned spacers between the first and second substrates, each of the patterned spacers overlaps with a respective step-portion of the black matrix.
摘要:
A refrigerator includes a valve assembly located at a refrigerant path from a condenser to at least one expansion valve for controlling flow of a refrigerant from the condenser to the at least one expansion valve. The valve assembly includes a valve chamber, wherein the refrigerant drawn from the condenser is held in the valve chamber; at least one outlet hole through which the refrigerant held in the valve chamber is discharged to a corresponding outlet path connected to the at least one expansion valve; and a valve body for selectively opening and closing the at least one outlet hole as the valve body rotates, such that the refrigerant held in the valve chamber is selectively discharged to the corresponding outlet path.
摘要:
The present invention relates to an image signal transmission method in a network camera system, and more particularly, to a network camera system and an image signal transmission method in which a low resolution image formed by down-scaling a high resolution image photographed by a high resolution camera is displayed via a display means of a DVR system, and the high resolution image is compressed to be stored in a memory means of the DVR system, thereby preventing overload on the system that may occur due to compressing, transmitting, or decompressing a plurality of high resolution image signals. The network camera system including: a high resolution image photographing unit photographing an object to generate a high resolution image signal; an A/D converter converting the high resolution image signal into a digital image signal; an image signal compression unit receiving the digital image signals from the A/D conversion unit and generating a first image signal by compressing the digital image signal in high resolution; a network interface unit connected to a predetermined network cable, for transmitting the first image signal to a predetermined DVR system connected by the network cable; a down-scaling unit receiving the digital image signal from the A/D conversion unit and generating a second image signal by down-scaling the digital image signal; an image signal encoding unit converting the second image signal into an analog signal to be encoded to a second analog image signal; and an interface unit transmitting the first image signal and the second analog image signal to the DVR system.
摘要:
Provided is a micro-mechanical structure and method for manufacturing the same, including a hydrophilic surface on at least a part of a surface of the micro-mechanical structure, so as to prevent generation of an adhesion phenomenon in the process of removing a sacrificial layer to release the micro-mechanical, wherein the sacrificial layer comes into contact with the surface of the micro-mechanical structure.