PROFILE BASED LASER CUTTING WITHIN A HIGH-SPEED TRANSPORT DEVICE
    1.
    发明申请
    PROFILE BASED LASER CUTTING WITHIN A HIGH-SPEED TRANSPORT DEVICE 有权
    基于配置文件的高速运输设备中的激光切割

    公开(公告)号:US20100236997A1

    公开(公告)日:2010-09-23

    申请号:US12406553

    申请日:2009-03-18

    IPC分类号: B07C5/344 B07C5/36 B23K26/00

    摘要: The present application relates to a method and system thereof for performing laser cutting on a mail piece during processing on a document processing device such as a sorter. Laser cutting is performed to effectively cut mail pieces during transport on the document processing equipment to ensure cut accuracy and to promote readability. The present teachings allow for selection of a cut profile based on mail piece attributes or markings and adaptive adjustment of the cut profile in accord with the positioning of the mail piece to achieve a desired cut pattern while the document processing device is running at high transport speed.

    摘要翻译: 本申请涉及一种用于在诸如分选机的文件处理装置的处理期间在邮件上执行激光切割的方法和系统。 执行激光切割以在文件处理设备的运输期间有效地切割邮件,以确保切割精度并提高可读性。 本教导允许基于邮件属性或标记来选择切割轮廓,并且根据邮件的定位来适应性地调整切割轮廓,以在文件处理装置以高传送速度运行时实现期望的切割图案 。