Thermal management techniques, apparatus and methods for use in microfluidic devices
    5.
    发明申请
    Thermal management techniques, apparatus and methods for use in microfluidic devices 有权
    用于微流体装置的热管理技术,装置和方法

    公开(公告)号:US20060288708A1

    公开(公告)日:2006-12-28

    申请号:US11297106

    申请日:2005-12-07

    IPC分类号: F25B21/02

    摘要: A heating/cooling device for a microfluidic apparatus having a thermal insulating substrate. The device includes heating/cooling chamber for heating and/or cooling a sample disposed in the chamber; a waste heat channel for carrying away waste heat and/or waste cooling; and at least one Peltier junction having first and second opposing faces, the first face thereof facing towards said heating/cooling chamber and being in thermal communication therewith for providing either heat or cooling to the chamber in response to a flow of electrical current through the at least one Peltier junction, the second face thereof facing towards said waste heat channel and being in thermal communication therewith for either receiving heat from or dumping heat to the channel in response to a flow of electrical current through the Peltier junction.

    摘要翻译: 一种用于具有绝热基底的微流体装置的加热/冷却装置。 该装置包括用于加热和/或冷却设置在腔室中的样品的加热/冷却室; 用于浪费废热和/或废物冷却的废热通道; 以及至少一个珀尔帖接头,其具有第一和第二相对面,其第一面朝向所述加热/冷却室并与其热连通,用于响应于电流通过所述的电流而向所述室提供加热或冷却 至少一个珀耳帖接头,其第二面朝向所述废热通道并与其热连通,以响应于通过珀尔帖接头的电流流动来接收热量或将热量倾倒至通道。

    Thermal management techniques, apparatus and methods for use in microfluidic devices
    6.
    发明授权
    Thermal management techniques, apparatus and methods for use in microfluidic devices 有权
    用于微流体装置的热管理技术,装置和方法

    公开(公告)号:US08695355B2

    公开(公告)日:2014-04-15

    申请号:US11297106

    申请日:2005-12-07

    IPC分类号: B01L3/00 F25B21/02 F25B21/04

    摘要: A heating/cooling device for a microfluidic apparatus having a thermal insulating substrate. The device includes heating/cooling chamber for heating and/or cooling a sample disposed in the chamber; a waste heat channel for carrying away waste heat and/or waste cooling; and at least one Peltier junction having first and second opposing faces, the first face thereof facing towards said heating/cooling chamber and being in thermal communication therewith for providing either heat or cooling to the chamber in response to a flow of electrical current through the at least one Peltier junction, the second face thereof facing towards said waste heat channel and being in thermal communication therewith for either receiving heat from or dumping heat to the channel in response to a flow of electrical current through the Peltier junction.

    摘要翻译: 一种用于具有绝热基底的微流体装置的加热/冷却装置。 该装置包括用于加热和/或冷却设置在腔室中的样品的加热/冷却室; 用于浪费废热和/或废物冷却的废热通道; 以及至少一个珀尔帖接头,其具有第一和第二相对面,其第一面朝向所述加热/冷却室并与其热连通,用于响应于电流通过所述的电流而向所述室提供加热或冷却 至少一个珀耳帖接头,其第二面朝向所述废热通道并与其热连通,以响应于通过珀尔帖接头的电流流动来接收热量或将热量倾倒至通道。