High-voltage semiconductor component
    2.
    发明授权
    High-voltage semiconductor component 有权
    高压半导体元件

    公开(公告)号:US06894329B2

    公开(公告)日:2005-05-17

    申请号:US10455839

    申请日:2003-06-06

    摘要: A semiconductor component has a semiconductor body comprising blocking pn junction, a source zone of a first conductivity type connected to a first electrode and bordering on a zone forming the blocking pn junction of a second conductivity type complementary to the first conductivity type, and a drain zone of the first conductivity type connected to a second electrode. The side of the zone of the second conductivity type facing the drain zone forms a first surface, and in the region between the first surface and a second surface located between the first surface and the drain zone, comprises areas of the first and second conductivity type nested in one another. The second surface coincides with the surface of the drain zone facing the source zone, such that the regions of the first and second conductivity type nested inside each other reach the drain zone.

    摘要翻译: 半导体部件具有包含阻挡pn结的半导体主体,与第一电极连接并与形成与第一导电类型互补的第二导电类型的阻挡pn结的区域接壤的第一导电类型的源极区和漏极 连接到第二电极的第一导电类型的区域。 面向排水区的第二导电类型的区域的一侧形成第一表面,并且在位于第一表面和漏区之间的第一表面和第二表面之间的区域中,包括第一和第二导电类型的区域 彼此嵌套在一起 第二表面与面向源区的排水区的表面重合,使得彼此嵌套的第一和第二导电类型的区域到达排水区。

    High-voltage semiconductor component
    3.
    发明授权
    High-voltage semiconductor component 有权
    高压半导体元件

    公开(公告)号:US06825514B2

    公开(公告)日:2004-11-30

    申请号:US10455858

    申请日:2003-06-06

    IPC分类号: H01L2980

    摘要: A process for manufacturing of a semiconductor device comprising a blocking pn junction, a source zone of a first conductivity type connected to a first electrode and bordering on a zone forming the blocking pn junction of a second conductivity type complementary to the first conductivity type, and a drain zone of the first conductivity type connected to a second electrode, the side of the zone of the second conductivity type facing the drain zone forming a first surface, and in the region between the first surface and a second surface located between the first surface and the drain zone, areas of the first and second conductivity type nested in one another, comprises the step of: varying in individual semiconductor layers, by doping, the degree of compensation in the regions of the second conductivity type.

    摘要翻译: 一种用于制造半导体器件的方法,该半导体器件包括阻挡pn结,与第一电极连接并与形成与第一导电类型互补的第二导电类型的阻挡pn结的区域接壤的第一导电类型的源区,以及 连接到第二电极的第一导电类型的漏极区,形成第一表面的第二导电类型的区域的侧面,并且在第一表面和位于第一表面之间的第二表面之间的区域中 并且漏区,第一和第二导电类型的区域彼此嵌套,包括以下步骤:通过掺杂在各个半导体层中改变第二导电类型的区域中的补偿程度。

    High-voltage semiconductor component
    6.
    发明授权
    High-voltage semiconductor component 有权
    高压半导体元件

    公开(公告)号:US06828609B2

    公开(公告)日:2004-12-07

    申请号:US10455834

    申请日:2003-06-06

    IPC分类号: H01L2980

    摘要: A semiconductor component having a semiconductor body comprises a blocking pn junction, a source zone of a first conductivity type and bordering on a zone forming the blocking pn junction of a second conductivity type complementary to the first conductivity type, and a drain zone of the first conductivity type. The side of the zone of the second conductivity type faces the drain zone forming a first surface, and in the region between the first surface and a second surface areas of the first and second conductivity type are nested in one another. The areas of the first and second conductivity type are variably so doped that near the first surface doping atoms of the second conductivity type predominate, and near the second surface doping atoms of the first conductivity type predominate. Furthermore a plurality of floating zones of the first and second conductivity type is provided.

    摘要翻译: 具有半导体主体的半导体部件包括阻挡pn结,第一导电类型的源极区域,并且与形成与第一导电类型互补的第二导电类型的阻挡pn结的区域接合,并且第一导电类型的漏极区域 导电类型。 第二导电类型的区域侧面对排水区,形成第一表面,并且在第一表面和第一和第二导电类型的第二表面区域之间的区域彼此嵌套。 第一和第二导电类型的区域是可变地掺杂的,在第一表面附近,第二导电类型的掺杂原子占主导地位,并且在第二表面附近,第一导电类型的掺杂原子占主导地位。 此外,提供了第一和第二导电类型的多个浮动区域。

    Field effect controlled semiconductor component
    7.
    发明授权
    Field effect controlled semiconductor component 有权
    场效应控制半导体元件

    公开(公告)号:US06812524B2

    公开(公告)日:2004-11-02

    申请号:US10013999

    申请日:2001-12-11

    IPC分类号: H01L2976

    摘要: A semiconductor component includes first and second connection zones formed in a semiconductor body, a channel zone surrounding the second connection zone in the semiconductor body, and a drift path that is formed between the channel zone and the first connection zone and contains a compensation zone. The compensation zone has a complementary conduction type with respect to the drift zone and includes at least two segments. A distance between the two adjacent segments is chosen such that the punch-through voltage between these segments lies in a voltage range that corresponds to the voltage range assumed by the voltage drop across the drift path at currents situated between the rated current and twice the rated current.

    摘要翻译: 半导体部件包括形成在半导体本体中的第一和第二连接区域,围绕半导体主体中的第二连接区域的沟道区域以及形成在沟道区域和第一连接区域之间并且包含补偿区域的漂移路径。 补偿区相对于漂移区具有互补导电类型并且包括至少两个段。 选择两个相邻段之间的距离,使得这些段之间的穿通电压位于对应于位于额定电流和额定电流两倍之间的电流处的漂移路径上的电压降所假定的电压范围的电压范围 当前。

    Compensation semiconductor component and method of fabricating the semiconductor component

    公开(公告)号:US06614090B2

    公开(公告)日:2003-09-02

    申请号:US09974650

    申请日:2001-10-09

    IPC分类号: H01L2358

    摘要: The semiconductor component is a charge carrier compensation component formed in a semiconductor body. A semiconductor basic body is disposed in the semiconductor body. The basic body has at least one compensation layer which adjoins a boundary layer and first regions of a first conductivity type and second regions of a second conductivity type are provided along a layout grid. A total quantity of charge of the first regions corresponds approximately to a total quantity of charge of the second regions. At least one semiconductor layer in the semiconductor body adjoins the semiconductor basic body at the boundary layer. A multiplicity of doped regions are embedded in the first surface of the semiconductor layer which form a grid for a cell array of the semiconductor component. The grid in the semiconductor layer is aligned independently of the layout grid in the semiconductor basic body.

    High-voltage semiconductor component
    10.
    发明授权
    High-voltage semiconductor component 有权
    高压半导体元件

    公开(公告)号:US06960798B2

    公开(公告)日:2005-11-01

    申请号:US10455842

    申请日:2003-06-06

    摘要: A semiconductor component has a semiconductor body comprising a blocking pn junction, a source zone of a first conductivity type connected to a first electrode and bordering on a zone forming the blocking pn junction of a second conductivity type complementary to the first conductivity type, and a drain zone of the first conductivity type connected to a second electrode. The side of the zone of the second conductivity type facing the drain zone forms a first surface, and in the region between the first surface and a second surface located between the first surface and the drain zone, comprises areas of the first and second conductivity type nested in one another. The second surface is positioned at a distance from the drain zone such that the areas of the first and second conductivity type nested in each other do not reach the drain zone.

    摘要翻译: 半导体部件具有包含阻挡pn结的半导体本体,与第一电极连接的第一导电类型的源区,与形成与第一导电类型互补的第二导电类型的阻挡pn结的区域接壤, 第一导电类型的漏极区连接到第二电极。 面向排水区的第二导电类型的区域的一侧形成第一表面,并且在位于第一表面和漏区之间的第一表面和第二表面之间的区域中,包括第一和第二导电类型的区域 彼此嵌套在一起 第二表面定位在离开排水区一定距离处,使得彼此嵌套的第一和第二导电类型的区域不会到达排水区。