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17 条记录 (耗时 0.022 秒)

    Method of forming a flip-chip package
    7.
    发明授权
    Method of forming a flip-chip package 有权
    形成倒装芯片封装的方法

    公开(公告)号：US08037594B2

    公开(公告)日：2011-10-18

    申请号：US12116655

    申请日：2008-05-07

    申请人： Jeffrey T. Coffin ,  Michael A. Gaynes ,  David L. Questad ,  Kamal K. Sikka ,  Hilton T. Toy ,  Jamil A. Wakil

    发明人： Jeffrey T. Coffin ,  Michael A. Gaynes ,  David L. Questad ,  Kamal K. Sikka ,  Hilton T. Toy ,  Jamil A. Wakil

    IPC分类号： H05B3/00

    CPC分类号： H01L23/34 ,  H01L23/3735 ,  H01L23/42 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/3511 ,  Y10T29/49004 ,  Y10T29/49083 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/4935

    摘要： Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.

    摘要翻译： 披露的是导热板。 每个板被构造成使得当板结合到发热结构并经受使得发热结构的预定温度范围内的温度时，板和发热结构之间可以实现均匀的粘合剂填充的间隙 经。 另外，本公开提供了形成板并将板结合到发热结构的相关方法。 在一个实施例中，板是弯曲的并被建模以使发热结构的弯曲表面在预定温度范围内匹配。 在另一个实施例中，板是多层导电结构，其被配置为在与热产生结构相关的热负荷下经历相同的翘曲。 因此，当板与发热结构接合时，能够在任何温度下实现和保持均匀的粘合剂填充间隙。

    Packaging for multi-processor shared-memory system
    9.
    发明授权
    Packaging for multi-processor shared-memory system 失效

    公开(公告)号：US06541847B1

    公开(公告)日：2003-04-01

    申请号：US10066999

    申请日：2002-02-04

    申请人： Harm P. Hofstee ,  Eric A. Johnson ,  Randall J. Stutzman ,  Jamil A. Wakil

    发明人： Harm P. Hofstee ,  Eric A. Johnson ,  Randall J. Stutzman ,  Jamil A. Wakil

    IPC分类号： H01L2302

    CPC分类号： H01L25/18 ,  H01L23/3735 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/09701

    摘要： An electrical structure or package, and associated method of formation. A plurality of logic chips is coupled electrically to a memory chip either through conductive members (e.g., solder balls) that interface with the memory chip and each logic chip, or through a sequential logic-to-memory electrically conductive path that includes: a first conductive member electrically coupled to a logic chip; an electrically conductive via path through a circuitized substrate; and a second conductive member electrically coupled to the memory chip. The logic chips are electrically coupled to the substrate either directly through an interfacing solder interconnection from the logic chip to the substrate, or indirectly through the memory chip such that the memory chip is electrically coupled to the substrate by an interfacing solder interconnect. The electrical structure may be plugged into a socket of a backplane of a circuit card.

    THERMALLY ENHANCED COLD PLATE HAVING HIGH CONDUCTIVITY THERMAL TRANSFER PATHS
    10.
    发明申请
    THERMALLY ENHANCED COLD PLATE HAVING HIGH CONDUCTIVITY THERMAL TRANSFER PATHS 审中-公开
    具有高电导率热转移温度的热增强冷板

    公开(公告)号：US20130168068A1

    公开(公告)日：2013-07-04

    申请号：US13339514

    申请日：2011-12-29

    申请人： Zhen Huang ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  Chunjian Ni ,  Mark E. Steinke ,  Jamil A. Wakil

    发明人： Zhen Huang ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  Chunjian Ni ,  Mark E. Steinke ,  Jamil A. Wakil

    IPC分类号： F28F3/12

    CPC分类号： F28F7/02 ,  F28D15/0233 ,  F28F3/12 ,  F28F2013/001 ,  H01L23/36 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cold plate comprises a cold plate body having a base for thermally engaging a heat-generating device, a plurality of internal channels extending through the cold plate body for the passage of a liquid coolant, a first region between the base and the plurality of internal channels, and a second region between the plurality of internal channels and a top that is generally opposite the base from the plurality of internal channels. The cold plate body is made from a first thermally conductive material. The cold plate also comprises at least one thermally conductive member extending around the plurality of channels from the first region below the plurality of channels to the second region above the plurality of channels. The at least one thermally conductive member has a greater thermal conductivity than the first thermally conductive material to move heat from the first region to the second region.

    摘要翻译： 冷板包括具有用于热接合发热装置的基座的冷板主体，延伸穿过冷板主体以用于液体冷却剂通过的多个内部通道，在基部和多个内部之间的第一区域 通道，以及多个内部通道之间的第二区域和与多个内部通道大致相对的基座的顶部。 冷板体由第一导热材料制成。 冷板还包括至少一个导热构件，其围绕多个通道从多个通道下方的第一区域延伸到多个通道上方的第二区域。 至少一个导热构件具有比第一导热材料更大的热导率，以将热量从第一区域移动到第二区域。