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    Method for bonding heatsink to multiple-height chip
    1.
    发明授权
    Method for bonding heatsink to multiple-height chip 失效
    将散热片连接到多芯片芯片的方法

    公开(公告)号：US06214647B1

    公开(公告)日：2001-04-10

    申请号：US09159239

    申请日：1998-09-23

    申请人： Giulio Di Giacomo ,  Stephen S. Drofitz, Jr. ,  David L. Edwards ,  Sushumna Iruvanti ,  David J. Womac

    发明人： Giulio Di Giacomo ,  Stephen S. Drofitz, Jr. ,  David L. Edwards ,  Sushumna Iruvanti ,  David J. Womac

    IPC分类号： H01L2144

    CPC分类号： H01L23/4338 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/09701

    摘要： A method and structure for thermally connecting a thermal conductor to at least one chip, the thermal conductor including a lower surface and at least one piston extending from the lower surface corresponding to each of the chips, each of the chips having an upper surface opposing each of the pistons, the chips being mounted on a substrate, the method comprising steps of metalizing the lower surface of the thermal conductor and the pistons, applying a solder to the lower surface of the thermal conductor, applying a thermal paste between the upper surface of the chips and the pistons, positioning the substrate and the thermal conductor such that the substrate is aligned with the thermal conductor, biasing the thermal conductor toward the substrate, biasing the pistons toward the chips such that the thermal paste has a consistent thickness between each of the chips and the pistons, reflowing the solder, such that the solder bonds the substrate to the thermal conductor and the pistons form a metallurgical bond with the thermal conductor, wherein after the reflowing step, the pistons and the thermal conductor form a unitary structure for maintaining the consistent thickness of the thermal paste between each of the chips and the pistons which achieves a considerably thinner thermal paste layer and greater thermal conduction.

    摘要翻译： 一种用于将热导体热连接到至少一个芯片的方法和结构，所述热导体包括下表面和从与每个芯片对应的下表面延伸的至少一个活塞，每个芯片具有与每个芯片相对的上表面 的活塞，所述芯片安装在基板上，所述方法包括以下步骤：使所述导热体和所述活塞的下表面金属化，向所述导热体的下表面施加焊料，在所述导热体的上表面 芯片和活塞，定位衬底和热导体，使得衬底与热导体对准，将热导体偏压朝向衬底，将活塞偏压到芯片，使得热膏在每个之间具有一致的厚度 芯片和活塞，回流焊料，使得焊料将基板粘合到热导体和活塞上 与热导体进行冶金结合，其中在回流步骤之后，活塞和热导体形成整体结构，用于保持每个芯片和活塞之间的热粘合剂的厚度一致，其实现相当薄的热糊层，并且 更大的热传导。

    Direct chip-cooling through liquid vaporization heat exchange
    7.
    发明授权
    Direct chip-cooling through liquid vaporization heat exchange 失效
    通过液体蒸发热交换直接芯片冷却

    公开(公告)号：US6085831A

    公开(公告)日：2000-07-11

    申请号：US261345

    申请日：1999-03-03

    申请人： Giulio DiGiacomo ,  Sushumna Iruvanti ,  David J. Womac

    发明人： Giulio DiGiacomo ,  Sushumna Iruvanti ,  David J. Womac

    IPC分类号： F28D15/02 ,  F28D15/04 ,  H01L23/427 ,  F28D15/00

    CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/046 ,  H01L2924/0002

    摘要： An apparatus for and method of cooling an electronic module comprising a heat sink enclosure placed directly over a chip or substrate in a flip chip package. The heat sink enclosure has a plurality of cooling fins extending from within the cavity of the enclosure. A liquid sealed inside the enclosure is trapped within a thermal transfer means, preferably a metal wick, which sits directly on a chip or substrate. As the chip or substrate heats up, heat is transferred to the thermal transfer means which in turn heats the liquid to its heat of vaporization. The vapors of the liquid rise and condense on the cooling fins and the heat is absorbed by the enclosure and conducted to an outside surface of the enclosure and dissipated. Cooling fins on an exterior surface of the enclosure further reduces the thermal resistance to enhance cooling.

    摘要翻译： 一种用于冷却电子模块的装置和方法，包括在倒装芯片封装中直接放置在芯片或衬底上的散热器外壳。 散热器外壳具有从外壳的空腔内延伸的多个散热片。 密封在外壳内部的液体被捕获在热传递装置内，优选地直接位于芯片或基底上的金属芯。 当芯片或基板加热时，热量传递到热传递装置，热传递装置又将液体加热至其蒸发热。 液体上升和冷凝在冷却片和热上的蒸汽被外壳吸收并传导到外壳的外表面并消散。 外壳外表面上的散热片进一步降低了热阻，增强了冷却。

    Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof
    9.
    发明授权
    Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof 失效
    作为芯片和散热器之间的传热介质的热糊状预成型件及其方法

    公开(公告)号：US06444496B1

    公开(公告)日：2002-09-03

    申请号：US09619886

    申请日：2000-07-20

    申请人： David L. Edwards ,  Glenn G. Daves ,  Shaji Farooq ,  Sushumna Iruvanti ,  Frank L. Pompeo

    发明人： David L. Edwards ,  Glenn G. Daves ,  Shaji Farooq ,  Sushumna Iruvanti ,  Frank L. Pompeo

    IPC分类号： H01L2144

    CPC分类号： H05K7/20454 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16152

    摘要： The present invention relates generally to a new apparatus and method for introducing thermal paste into semiconductor packages. More particularly, the invention encompasses an apparatus and a method that uses at least one preform of thermal paste for the cooling of at least one chip in a sealed semiconductor package. The thermal paste preform is subcooled, and is transferred onto a module component from a separable transfer sheet, or is placed onto the module component using an attached and/or imbedded mesh. The preform of thermal paste may be of simple or complex shape, and enables cooling of one or more chips in a module.

    摘要翻译： 本发明一般涉及将热膏引入半导体封装的新设备和方法。 更具体地说，本发明包括使用至少一个热糊状物预制件来冷却密封半导体封装中的至少一个芯片的装置和方法。 将热糊预制件过冷，并从可分离转印片材转移到模块组件上，或者使用附接和/或嵌入的网格放置在模块部件上。 热糊状物的预制件可以是简单或复杂的形状，并且能够冷却模块中的一个或多个芯片。