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公开(公告)号：US08123089B2
公开(公告)日：2012-02-28
申请号：US12244145
申请日：2008-10-02
申请人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , G. Gerard Gormley , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
发明人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , G. Gerard Gormley , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
IPC分类号： B22D37/00
CPC分类号： B23K3/0638
摘要： An apparatus for dispensing fusible material onto a surface, wherein the fusible material is in molten form, is provided. The apparatus comprises a dispensing assembly comprising a seal structure. The seal structure controls dispensing of the fusible material. One or more gas injectors are coupled to the dispensing assembly. Each of the one or more gas injectors is adapted to inject at least one gas to the dispensing assembly for controlling a gas environment surrounding at least a portion of the seal structure. An oxidation rate of the fusible material is controlled as a function of at least one characteristic of the at least one gas.
摘要翻译： 提供了一种用于将易熔材料分配到表面上的装置，其中可熔材料处于熔融形式。 该装置包括一个包括密封结构的分配组件。 密封结构控制可熔材料的分配。 一个或多个气体喷射器联接到分配组件。 一个或多个气体喷射器中的每一个适于将至少一种气体喷射到分配组件，用于控制围绕密封结构的至少一部分的气体环境。 作为至少一种气体的至少一种特性的函数控制可熔材料的氧化速率。
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公开(公告)号：US20100084437A1
公开(公告)日：2010-04-08
申请号：US12244118
申请日：2008-10-02
申请人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
发明人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
CPC分类号： B22D37/005 , B23K3/0638
摘要： Techniques for dispensing fusible material onto a surface, wherein the fusible material is in molten form, are provided. In accordance with aspects of the invention, a dispensing assembly dispenses the fusible material and a gas environment surrounding a portion of a seal structure of the dispensing assembly is controlled to regulate an oxidation rate of the fusible material.
摘要翻译： 提供了将易熔材料分配到表面上的技术，其中可熔材料是熔融形式。 根据本发明的方面，分配组件分配可熔材料，并且控制围绕分配组件的密封结构的一部分的气体环境以调节可熔材料的氧化速率。
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公开(公告)号：US20100084438A1
公开(公告)日：2010-04-08
申请号：US12244145
申请日：2008-10-02
申请人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , G. Gerard Gormley , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
发明人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , G. Gerard Gormley , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
CPC分类号： B23K3/0638
摘要： An apparatus for dispensing fusible material onto a surface, wherein the fusible material is in molten form, is provided. The apparatus comprises a dispensing assembly comprising a seal structure. The seal structure controls dispensing of the fusible material. One or more gas injectors are coupled to the dispensing assembly. Each of the one or more gas injectors is adapted to inject at least one gas to the dispensing assembly for controlling a gas environment surrounding at least a portion of the seal structure. An oxidation rate of the fusible material is controlled as a function of at least one characteristic of the at least one gas.
摘要翻译： 提供了一种用于将易熔材料分配到表面上的装置，其中可熔材料处于熔融形式。 该装置包括一个包括密封结构的分配组件。 密封结构控制可熔材料的分配。 一个或多个气体喷射器联接到分配组件。 一个或多个气体喷射器中的每一个适于将至少一种气体喷射到分配组件，用于控制围绕密封结构的至少一部分的气体环境。 作为至少一种气体的至少一种特性的函数控制可熔材料的氧化速率。
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公开(公告)号：US08123088B2
公开(公告)日：2012-02-28
申请号：US12244118
申请日：2008-10-02
申请人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
发明人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
IPC分类号： B22D37/00
CPC分类号： B22D37/005 , B23K3/0638
摘要： Techniques for dispensing fusible material onto a surface, wherein the fusible material is in molten form, are provided. In accordance with aspects of the invention, a dispensing assembly dispenses the fusible material and a gas environment surrounding a portion of a seal structure of the dispensing assembly is controlled to regulate an oxidation rate of the fusible material.
摘要翻译： 提供了将易熔材料分配到表面上的技术，其中可熔材料是熔融形式。 根据本发明的方面，分配组件分配可熔材料，并且控制围绕分配组件的密封结构的一部分的气体环境以调节可熔材料的氧化速率。
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公开(公告)号：US08755644B2
公开(公告)日：2014-06-17
申请号：US12080266
申请日：2008-04-01
CPC分类号： G02B6/4206 , G02B6/4214 , H01L33/58 , H01S5/005 , H01S5/02248 , H01S5/02288 , H01S5/183
摘要： Method of fabricating a semiconductor die with a microlens associated therewith. More particularly, a method for fabricating a vertical channel guide optical via through a silicon substrate wherein the optical via can contain lens elements, a discrete index gradient guiding pillar and other embodiments. Also disclosed are means for transferring, coupling and or focusing light from an electronic-optical device on the top of a semiconductor substrate through the substrate to a waveguiding medium below the substrate. The high alignment accuracies afforded by standard semiconductor fabrication processes are exploited so as to obviate the need for active alignment of the optical coupling or light guiding elements.
摘要翻译： 制造具有与之相关联的微透镜的半导体管芯的方法。 更具体地，涉及一种通过硅衬底制造垂直沟道引导光通孔的方法，其中光通孔可以包含透镜元件，离散折射率梯度引导柱和其它实施例。 还公开了用于将来自半导体衬底顶部的电子光学器件的光通过衬底转移，耦合和聚焦到衬底下面的波导介质的装置。 利用由标准半导体制造工艺提供的高对准精度，以便消除对光学耦合或导光元件的主动对准的需要。
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公开(公告)号：US08703274B2
公开(公告)日：2014-04-22
申请号：US12244067
申请日：2008-10-02
申请人： Russell A. Budd , Bing Dang , William S. Graham , Peter Alfred Gruber , Richard Levine , Da-Yuan Shih
发明人： Russell A. Budd , Bing Dang , William S. Graham , Peter Alfred Gruber , Richard Levine , Da-Yuan Shih
IPC分类号： B32B3/00
CPC分类号： B23K1/0016 , B23K1/20 , B23K26/364 , B23K2101/40 , H05K1/111 , H05K3/3457 , H05K2201/09381 , H05K2201/0969 , H05K2201/09745 , H05K2203/043 , Y02P70/611 , Y10T428/24479
摘要： A microcavity structure is provided. The structure comprises a cavity layout that enables centering of reflowed solder at each of one or more interconnect locations and protrusion of the reflowed solder sufficiently from the cavity to facilitate wetting. Techniques are also provided for producing a microcavity structure, for using injection molded solder (IMS) for micro bumping, as well as for using injection molded solder (IMS) for three-dimensional (3D) packaging.
摘要翻译： 提供微腔结构。 该结构包括空腔布局，其能够使一个或多个互连位置中的每一个处的回流焊料居中并且使回流焊料从空腔充分突出以促进润湿。 还提供了用于制造微腔结构的技术，用于使用用于微型凸起的注射成型焊料（IMS）以及用于三维（3D）封装的注射成型焊料（IMS）。
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7.发明授权Compliant mold fill head with integrated cavity venting and solder cooling 有权具有集成腔体排气和焊锡冷却的合适的模具填充头公开(公告)号：US08011563B2
公开(公告)日：2011-09-06
申请号：US11696753
申请日：2007-04-05
CPC分类号： B23K3/0607 , B23K2101/40
摘要： A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate.
摘要翻译： 模具填充头包括焊料输送头和具有固定到焊料输送头的顺应部分和与柔顺部分相关联的分配区域的界面部分。 分配区域形成有至少一个孔，其被配置为与模板中的空腔相接触，所述至少一个孔与焊料输送头流体连通。 顺应部分的构造和尺寸被设计成当从其延伸预定距离时将分配区域推靠在模板上，并且基本上容许模板的平坦度变化，预定距离的变化和/或角度取向的变化 界面部分和模板。
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公开(公告)号：US20110044367A1
公开(公告)日：2011-02-24
申请号：US12544710
申请日：2009-08-20
申请人： Russell A. Budd , Paul Fortier , Frank R. Libsch
发明人： Russell A. Budd , Paul Fortier , Frank R. Libsch
IPC分类号： H01S5/026 , H01L31/0232 , H01L21/50
CPC分类号： H01L27/1446 , G02B6/4201 , G02B6/4206 , G02B6/4245 , G02B6/4249 , G02B6/4257 , G02B6/4266 , G02B6/4269 , G02B6/428 , G02B6/4292 , H01L23/367 , H01L25/16 , H01L27/14625 , H01L2224/131 , H01L2924/01046 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15192 , H01L2924/15311 , H01L2924/3011 , H01L2924/014 , H01L2924/00
摘要： An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with a wiring layer. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. One or more first OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the first OE elements positioned in optical alignment with the optical via for receiving the light. A second OE element embedded within the wiring layer. A carrier may be interposed between electrical interconnect elements and positioned between the wiring layer and a circuit board.
摘要翻译： 公开了一种用于制造的光电（OE）封装或系统和方法，其包括具有布线层的硅层。 硅层具有允许光通过的光通孔。 光耦合层结合到硅层，并且光耦合层包括多个微透镜，用于聚焦和/或准直光穿过光通孔。 一个或多个第一OE元件耦合到硅层并与布线电连通。 位于与用于接收光的光通孔光学对准的第一OE元件中的至少一个。 嵌入在布线层内的第二个OE元件。 载体可以介于电互连元件之间并且位于布线层和电路板之间。
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9.发明授权Interconnecting (mapping) a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array 有权将二维光电（OE）器件阵列互连（映射）到一维波导阵列公开(公告)号：US07883277B2
公开(公告)日：2011-02-08
申请号：US12117803
申请日：2008-05-09
申请人： Russell A. Budd , Punit P. Chiniwalla , John A. Guckenberger , Jeffrey A. Kash , Jeremy D. Schaub , Michael Tan , Jeannine M. Trewhella , Garry Trott
发明人： Russell A. Budd , Punit P. Chiniwalla , John A. Guckenberger , Jeffrey A. Kash , Jeremy D. Schaub , Michael Tan , Jeannine M. Trewhella , Garry Trott
CPC分类号： G02B6/43 , G02B6/42 , G02B6/4214 , G02B6/4246
摘要： For integrated circuits including circuit packaging and circuit communication technologies provision is made for a method of interconnecting or mapping a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array. Also provided is an arrangement for the interconnecting or mapping of a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array.
摘要翻译： 对于包括电路封装和电路通信技术的集成电路，提供了将二维光电（OE）器件阵列互连或映射到一维波导阵列的方法。 还提供了用于将二维光电（OE）器件阵列互连或映射到一维波导阵列的布置。
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公开(公告)号：US20090302095A1
公开(公告)日：2009-12-10
申请号：US12542797
申请日：2009-08-18
申请人： Russell A. Budd , Frank R. Libsch , Jae-Woong Nah
发明人： Russell A. Budd , Frank R. Libsch , Jae-Woong Nah
IPC分类号： B23K1/20
CPC分类号： B23K1/0016 , B23K3/0623 , B23K3/087 , B23K2101/40 , B23K2101/42 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/11334 , H01L2224/13099 , H01L2224/13111 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H05K3/3478 , H05K2203/0113 , H05K2203/0292 , H05K2203/0338 , H05K2203/041 , H05K2203/0557 , H05K2203/105 , H01L2924/00 , H01L2224/05599
摘要： A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.
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