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公开(公告)号：US07123015B2
公开(公告)日：2006-10-17
申请号：US10953924
申请日：2004-09-29
申请人： Glen Peter Koste , Ronald Dean Watkins , Richard Louis Frey , Matthew Christian Nielsen , Joseph Alfred Iannotti , Todd Ryan Tolliver
发明人： Glen Peter Koste , Ronald Dean Watkins , Richard Louis Frey , Matthew Christian Nielsen , Joseph Alfred Iannotti , Todd Ryan Tolliver
IPC分类号： G01V3/00
CPC分类号： G01R33/283
摘要： A magnetic resonance (MR) system and method for generating information about an object is provided. The MR system comprises at least one MR detector configured to sense a plurality of electromagnetic signals and a modulator coupled to the MR detector and configured to modulate optical signals with the electromagnetic signals to generate corresponding modulated optical signals. The MR system further comprises a resonant matching circuit configured for matching an impedance of the MR detector to an impedance of the modulator to achieve at least one of a voltage gain or a noise performance. An optical conduit coupled to the modulator is configured to transmit the modulated optical signals from within a shielded environment to outside the shielded environment. A signal detector coupled to the optical conduit is configured to convert the modulated optical signals to electrical signals.
摘要翻译： 提供了一种用于产生关于物体的信息的磁共振（MR）系统和方法。 MR系统包括被配置为感测多个电磁信号的至少一个MR检测器和耦合到MR检测器的调制器，并配置成用电磁信号调制光信号以产生相应的调制光信号。 MR系统还包括谐振匹配电路，其被配置为将MR检测器的阻抗与调制器的阻抗相匹配，以实现电压增益或噪声性能中的至少一个。 耦合到调制器的光导管被配置为将调制的光信号从屏蔽环境内传输到屏蔽环境外部。 耦合到光导管的信号检测器被配置为将经调制的光信号转换成电信号。
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公开(公告)号：US07852082B2
公开(公告)日：2010-12-14
申请号：US12177484
申请日：2008-07-22
申请人： Todd Ryan Tolliver , Joseph Alfred Iannotti , Glen Peter Koste , Selaka Bandara Bulumulla , Richard Louis Frey
发明人： Todd Ryan Tolliver , Joseph Alfred Iannotti , Glen Peter Koste , Selaka Bandara Bulumulla , Richard Louis Frey
IPC分类号： G01V3/00
CPC分类号： H04B10/0799
摘要： A remote control system for a modulatable device is provided. The remote control system comprises a receiver system coupled to the modulatable device and configured to obtain an output characteristic of the modulatable device, the receiver system being located remotely with respect to the modulatable device. The system further comprises a command signal setting system coupled to the receiver system and configured to use the output characteristic to generate a drive command signal and a bias system coupled to the command signal setting system and configured to receive the drive command signal and set a bias point of the modulatable device based on the drive command signal. The bias system is located locally with respect to the modulatable device. The command signal setting system and the bias system are coupled via a first optical conduit.
摘要翻译： 提供了一种用于可调整设备的遥控系统。 遥控系统包括耦合到可调制设备并被配置为获得可调制设备的输出特性的接收机系统，接收器系统相对于可调制设备远程定位。 该系统还包括命令信号设置系统，其耦合到接收机系统并且被配置为使用输出特性来产生驱动命令信号和耦合到命令信号设置系统的偏置系统，并且被配置为接收驱动命令信号并设置偏置 基于驱动命令信号的可调制装置的点。 偏置系统相对于可调节装置位于本地。 命令信号设定系统和偏置系统通过第一光导管耦合。
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公开(公告)号：US08379217B2
公开(公告)日：2013-02-19
申请号：US11277294
申请日：2006-03-23
IPC分类号： G01B9/02
CPC分类号： G01B11/18 , G01D5/35312 , G01D5/35316
摘要： An optical sensor interrogation system comprises: a multi-frequency optical source configured to generate an optical interrogation signal, at least one optical sensor configured to filter light at a wavelength corresponding to a value of a sensed parameter and generate an optical sensor data signal, a photodetector configured to detect a reference signal and the optical sensor data signal and generate an electrical difference frequency signal corresponding to a wavelength difference between the reference signal and the optical sensor data signal, and an electrical frequency measurement module configured to measure the electrical difference frequency.
摘要翻译： 光学传感器询问系统包括：多频光源，被配置为产生光询问信号;至少一个光传感器被配置为过滤对应于感测参数的值的波长的光，并产生光传感器数据信号， 光电检测器，被配置为检测参考信号和光学传感器数据信号，并产生对应于参考信号和光学传感器数据信号之间的波长差的电差频率信号，以及被配置为测量电差频率的电频率测量模块。
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公开(公告)号：US20080281185A1
公开(公告)日：2008-11-13
申请号：US12177484
申请日：2008-07-22
申请人： Todd Ryan Tolliver , Joseph Alfred Iannotti , Glen Peter Koste , Selaka Bandara Bulumulla , Richard Louis Frey
发明人： Todd Ryan Tolliver , Joseph Alfred Iannotti , Glen Peter Koste , Selaka Bandara Bulumulla , Richard Louis Frey
IPC分类号： A61B5/05
CPC分类号： H04B10/0799
摘要： A remote control system for a modulatable device is provided. The remote control system comprises a receiver system coupled to the modulatable device and configured to obtain an output characteristic of the modulatable device, the receiver system being located remotely with respect to the modulatable device. The system further comprises a command signal setting system coupled to the receiver system and configured to use the output characteristic to generate a drive command signal and a bias system coupled to the command signal setting system and configured to receive the drive command signal and set a bias point of the modulatable device based on the drive command signal. The bias system is located locally with respect to the modulatable device. The command signal setting system and the bias system are coupled via a first optical conduit.
摘要翻译： 提供了一种用于可调整设备的遥控系统。 遥控系统包括耦合到可调制设备并被配置为获得可调制设备的输出特性的接收机系统，接收器系统相对于可调制设备远程定位。 该系统还包括命令信号设置系统，其耦合到接收机系统并且被配置为使用输出特性来产生驱动命令信号和耦合到命令信号设置系统的偏置系统，并且被配置为接收驱动命令信号并设置偏置 基于驱动命令信号的可调制装置的点。 偏置系统相对于可调节装置位于本地。 命令信号设定系统和偏置系统通过第一光导管耦合。
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5.发明申请公开(公告)号：US20090103160A1
公开(公告)日：2009-04-23
申请号：US11876070
申请日：2007-10-22
CPC分类号： G02F1/0123 , G02F1/2255 , H01L24/16 , H01L24/80 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/14 , H01L2924/1423 , H01L2924/15787 , H01L2924/00
摘要： An integrated electro-optical module apparatus includes in one embodiment an optical modulator configured to modulate an input optical signal coupled thereto; and a control circuit assembly configured to provide electrical control signals to the optical modulator to modulate the input optical signal; wherein the control circuit assembly is attached to the optical modulator in a stacked arrangement.
摘要翻译： 集成电光模块装置包括在一个实施例中，配置成调制与其耦合的输入光信号的光调制器; 以及控制电路组件，被配置为向所述光调制器提供电控制信号以调制所述输入光信号; 其中所述控制电路组件以堆叠布置附接到所述光学调制器。
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6.发明授权公开(公告)号：US07633667B2
公开(公告)日：2009-12-15
申请号：US11876070
申请日：2007-10-22
IPC分类号： G02F1/07
CPC分类号： G02F1/0123 , G02F1/2255 , H01L24/16 , H01L24/80 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/14 , H01L2924/1423 , H01L2924/15787 , H01L2924/00
摘要： An integrated electro-optical module apparatus includes in one embodiment an optical modulator configured to modulate an input optical signal coupled thereto; and a control circuit assembly configured to provide electrical control signals to the optical modulator to modulate the input optical signal; wherein the control circuit assembly is attached to the optical modulator in a stacked arrangement.
摘要翻译： 集成电光模块装置包括在一个实施例中，配置成调制与其耦合的输入光信号的光调制器; 以及控制电路组件，被配置为向所述光调制器提供电控制信号以调制所述输入光信号; 其中所述控制电路组件以堆叠布置附接到所述光学调制器。
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公开(公告)号：US20090309241A1
公开(公告)日：2009-12-17
申请号：US12138553
申请日：2008-06-13
CPC分类号： H01L24/24 , H01L21/6835 , H01L23/49827 , H01L23/5389 , H01L24/82 , H01L2224/24226 , H01L2224/2518 , H01L2224/82039 , H01L2924/01006 , H01L2924/01015 , H01L2924/01032 , H01L2924/01033 , H01L2924/19041 , H01L2924/19043
摘要： A method for forming an ultra thin die electronic package is provided. The method includes disposing a first polymer film on a first substrate. The method also includes applying a first adhesive layer to the first polymer film on the first substrate. The method further includes disposing at least one die on the first adhesive layer on the first substrate. The method also includes disposing a second polymer film on at least one additional substrate. The method further includes applying a second adhesive layer to the second polymer film on the at least one additional substrate. The method further includes attaching the first substrate and the at least one additional substrate via the first adhesive layer and the second adhesive layer such that the at least one die is interspersed between. The method also includes forming multiple vias on at least one of a top side, and at least one of a bottom side of the first and the at least one additional substrate, wherein the multiple vias are attached to the die. The method further includes forming an electrical interconnection between the first substrate, the at least one additional substrate and a die pad of the at least one die.
摘要翻译： 提供一种形成超薄模具电子封装的方法。 该方法包括在第一衬底上设置第一聚合物膜。 该方法还包括将第一粘合剂层施加到第一基底上的第一聚合物膜上。 该方法还包括在第一衬底上的第一粘合剂层上设置至少一个管芯。 该方法还包括在至少一个另外的基底上设置第二聚合物膜。 该方法还包括将第二粘合剂层施加到至少一个附加基底上的第二聚合物膜上。 该方法还包括经由第一粘合剂层和第二粘合剂层附接第一基底和至少一个另外的基底，使得至少一个管芯分散在其间。 该方法还包括在第一和至少一个附加基底的顶侧和至少之一中的至少一个上形成多个通孔，其中多个通孔连接到管芯。 该方法还包括在第一基板，至少一个附加基板和至少一个管芯的管芯焊盘之间形成电互连。
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公开(公告)号：US07605466B2
公开(公告)日：2009-10-20
申请号：US11872562
申请日：2007-10-15
申请人： Marco Francesco Aimi , Christopher James Kapusta , Arun Virupaksha Gowda , David Cecil Hays , Oliver Charles Boomhower , Glenn Scott Claydon , Joseph Alfred Iannotti , Christopher Fred Keimel
发明人： Marco Francesco Aimi , Christopher James Kapusta , Arun Virupaksha Gowda , David Cecil Hays , Oliver Charles Boomhower , Glenn Scott Claydon , Joseph Alfred Iannotti , Christopher Fred Keimel
IPC分类号： H01L23/34
CPC分类号： B81C1/00269 , B81C2203/0118 , B81C2203/019 , B81C2203/032 , H01L2224/16225 , H01L2924/1461 , H01L2924/00
摘要： Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a first side with multiple MEMS devices. A cover is formed with through-holes for vias, and with standoff posts for layer registration and separation. An adhesive sheet is patterned with cutouts for the MEMS devices, vias, and standoff posts. The adhesive sheet is tacked to the cover, then placed on the MEMS substrate and heated to bond the layers. The via holes may be metalized with leads for circuit board connection. The MEMS units may be diced from the substrate after sealing, thus protecting them from contaminants.
摘要翻译： 衬底上的多个微电子机械系统（MEMS）用盖子盖住，使用可用作粘合剂，分离层和气密密封的层。 衬底具有具有多个MEMS器件的第一侧。 形成有用于通孔的通孔的盖，并且具有用于层对准和分离的支柱。 图案化粘合片用于MEMS器件，通孔和支柱的切口。 将粘合片粘合到盖上，然后放置在MEMS基板上并加热以粘合层。 通孔可以用电路板连接的引线金属化。 在密封之后，MEMS单元可以从基底切割，从而保护它们免受污染。
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公开(公告)号：US07808343B1
公开(公告)日：2010-10-05
申请号：US12245474
申请日：2008-10-03
CPC分类号： H01P5/187
摘要： A radio frequency (RF) communication device may include an RF 90-degree hybrid combiner having stable phase and loss characteristics over greater than one octave of bandwidth, while providing a high degree of isolation between input and isolated port. The structure may include a first element and a second element. The first element includes a first port, a first section for phasing matching, a second section for conductive-layer inversion, a third section for phase-matching section, and a third port. The second element includes a fourth port, a fourth section for phasing matching, a fifth section for conductive-layer inversion, a sixth section for phase-matching, and a second port. In one example, the second and fifth sections are utilized for signal coupling. In another example, the first, third, fourth, and sixth sections are utilized for signal coupling. Different ports may have matched phase differences.
摘要翻译： 无线电频率（RF）通信设备可以包括具有超过一倍频带宽的稳定的相位和损耗特性的RF 90度混合组合器，同时在输入和隔离端口之间提供高度的隔离。 该结构可以包括第一元件和第二元件。 第一元件包括第一端口，用于定相匹配的第一部分，用于导电层反转的第二部分，用于相位匹配部分的第三部分和第三端口。 第二元件包括第四端口，用于定相匹配的第四部分，用于导电层反转的第五部分，用于相位匹配的第六部分和第二端口。 在一个示例中，第二和第五部分用于信号耦合。 在另一示例中，第一，第三，第四和第六部分被用于信号耦合。 不同的端口可能具有匹配的相位差。
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公开(公告)号：US5808852A
公开(公告)日：1998-09-15
申请号：US656845
申请日：1996-05-30
CPC分类号： G01R31/001 , H05K9/0069
摘要： A chain mail conductive meshing is conductively affixed to the perimeter of a platform to provide a broadband ground thereto. The chain mail is hung from the platform such that it contacts a ground plane therebelow. The platform is rotated during electromagnetic testing of equipment placed thereon, and the conductive meshing maintains the ground connection while the platform is rotated. A technique is disclosed for clamping the meshing to the platform, and alternate, sectional embodiments of the platform and meshing are provided.
摘要翻译： 连锁邮件导电啮合导电地固定到平台的周边以提供宽带接地。 连锁邮件从平台挂起，使其与下面的地面平面接触。 在放置在其上的设备的电磁测试期间平台旋转，并且当平台旋转时，导电啮合保持接地连接。 公开了一种用于夹紧到平台的啮合的技术，并提供了平台和啮合的交替的截面实施例。
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