利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

29 条记录 (耗时 0.025 秒)

    METHOD OF CREATING ASYMMETRIC FIELD-EFFECT-TRANSISTORS
    2.
    发明申请
    METHOD OF CREATING ASYMMETRIC FIELD-EFFECT-TRANSISTORS 有权
    创建不对称场效应晶体管的方法

    公开(公告)号：US20100330763A1

    公开(公告)日：2010-12-30

    申请号：US12493549

    申请日：2009-06-29

    申请人： Gregory G. Freeman ,  Shreesh Narasimha ,  Ning Su ,  Hasan M. Nayfeh ,  Nivo Rovedo ,  Werner A. Rausch ,  Jian Yu

    发明人： Gregory G. Freeman ,  Shreesh Narasimha ,  Ning Su ,  Hasan M. Nayfeh ,  Nivo Rovedo ,  Werner A. Rausch ,  Jian Yu

    IPC分类号： H01L21/336

    CPC分类号： H01L21/823425 ,  H01L21/26586 ,  H01L21/823412 ,  H01L29/66492 ,  H01L29/66659

    摘要： The present invention provides a method of forming asymmetric field-effect-transistors. The method includes forming at least a first and a second gate-mask stack on top of a semiconductor substrate, wherein the first and second gate-mask stacks include at least, respectively, a first and a second gate conductor of a first and a second transistor and have, respectively, a top surface, a first side, and a second side with the second side being opposite to the first side; performing a first halo implantation from the first side of the first and second gate-mask stacks at a first angle while applying the first gate-mask stack in preventing the first halo implantation from reaching a first source/drain region of the second transistor, wherein the first angle is equal to or larger than a predetermined value; and performing a second halo implantation from the second side of the first and second gate-mask stacks at a second angle, thereby creating halo implant in a second source/drain region of the second transistor, wherein the first and second angles are measured against a normal to the substrate.

    摘要翻译： 本发明提供了形成非对称场效应晶体管的方法。 该方法包括在半导体衬底的顶部上形成至少第一和第二栅极掩模叠层，其中第一和第二栅极掩模叠层至少分别包括第一和第二栅极掩模叠层的第一和第二栅极导体 分别具有顶表面，第一侧和第二侧，第二侧与第一侧相对; 以第一角度从第一和第二栅极掩模叠层的第一侧进行第一光晕注入，同时施加第一栅极掩模叠层以防止第一光晕注入到达第二晶体管的第一源极/漏极区域，其中 第一角度等于或大于预定值; 以及以第二角度从所述第一和第二栅极掩模叠层的第二侧执行第二光晕注入，从而在所述第二晶体管的第二源极/漏极区域中产生晕轮注入，其中所述第一和第二角度是针对 与基底垂直。

    ULTRA SHALLOW JUNCTION FORMATION BY EPITAXIAL INTERFACE LIMITED DIFFUSION
    3.
    发明申请
    ULTRA SHALLOW JUNCTION FORMATION BY EPITAXIAL INTERFACE LIMITED DIFFUSION 有权
    通过外延界面有限扩散形成的超声结构

    公开(公告)号：US20080233687A1

    公开(公告)日：2008-09-25

    申请号：US12132698

    申请日：2008-06-04

    申请人： Huajie Chen ,  Omer H. Dokumaci ,  Oleg G. Gluschenkov ,  Werner A. Rausch

    发明人： Huajie Chen ,  Omer H. Dokumaci ,  Oleg G. Gluschenkov ,  Werner A. Rausch

    IPC分类号： H01L21/336

    CPC分类号： H01L21/26533 ,  H01L21/02238 ,  H01L21/26513 ,  H01L21/31654 ,  H01L21/31675 ,  H01L21/324 ,  H01L29/0847 ,  H01L29/66636

    摘要： A method of forming a field effect transistor creates shallower and sharper junctions, while maximizing dopant activation in processes that are consistent with current manufacturing techniques. More specifically, the invention increases the oxygen content of the top surface of a silicon substrate. The top surface of the silicon substrate is preferably cleaned before increasing the oxygen content of the top surface of the silicon substrate. The oxygen content of the top surface of the silicon substrate is higher than other portions of the silicon substrate, but below an amount that would prevent epitaxial growth. This allows the invention to epitaxially grow a silicon layer on the top surface of the silicon substrate. Further, the increased oxygen content substantially limits dopants within the epitaxial silicon layer from moving into the silicon substrate.

    摘要翻译： 形成场效应晶体管的方法产生更浅和更尖的结，同时在与当前制造技术一致的工艺中最大化掺杂剂活化。 更具体地，本发明增加了硅衬底的顶表面的氧含量。 优选在增加硅衬底的顶表面的氧含量之前清洁硅衬底的顶表面。 硅衬底的顶表面的氧含量高于硅衬底的其它部分，但低于防止外延生长的量。 这允许本发明在硅​​衬底的顶表面上外延生长硅层。 此外，增加的氧含量基本上限制外延硅层内的掺杂剂移动到硅衬底中。

    Silicon on insulator field effect transistor having shared body contact
    5.
    发明授权
    Silicon on insulator field effect transistor having shared body contact 有权
    具有共享体接触的绝缘体上的场效应晶体管

    公开(公告)号：US06815282B2

    公开(公告)日：2004-11-09

    申请号：US10460717

    申请日：2003-06-12

    申请人： William R. Dachtera ,  Rajiv V. Joshi ,  Werner A. Rausch

    发明人： William R. Dachtera ,  Rajiv V. Joshi ,  Werner A. Rausch

    IPC分类号： H01L2972

    CPC分类号： G11C11/412 ,  H01L27/1104 ,  H01L27/1203

    摘要： Silicon on insulator (SOI) field effect transistors (FET) with a shared body contact, a SRAM cell and array including the SOI FETs and the method of forming the SOI FETs. The SRAM cell has a hybrid SOI/bulk structure wherein the source/drain diffusions do not penetrate to the underlying insulator layer, resulting in a FET in the surface of an SOI layer with a body or substrate contact formed at a shared contact. FETs are formed on SOI silicon islands located on a BOX layer and isolated by shallow trench isolation (STI). NFET islands in the SRAM cells include a body contact to a P-type diffusion in the NFET island. Each NFET in the SRAM cells include at least one shallow source/drain diffusion that is shallower than the island thickness. A path remains under the shallow diffusions between NFET channels and the body contact. The P-type body contact diffusion is a deep diffusion, the full thickness of the island. Bit line diffusions shared by SRAM cells on adjacent wordlines may be deep diffusions.

    Method of creating asymmetric field-effect-transistors
    6.
    发明授权
    Method of creating asymmetric field-effect-transistors 有权
    制造不对称场效应晶体管的方法

    公开(公告)号：US08017483B2

    公开(公告)日：2011-09-13

    申请号：US12493549

    申请日：2009-06-29

    申请人： Gregory G. Freeman ,  Shreesh Narasimha ,  Ning Su ,  Hasan M. Nayfeh ,  Nivo Rovedo ,  Werner A. Rausch ,  Jian Yu

    发明人： Gregory G. Freeman ,  Shreesh Narasimha ,  Ning Su ,  Hasan M. Nayfeh ,  Nivo Rovedo ,  Werner A. Rausch ,  Jian Yu

    IPC分类号： H01L21/336

    CPC分类号： H01L21/823425 ,  H01L21/26586 ,  H01L21/823412 ,  H01L29/66492 ,  H01L29/66659

    摘要： The present invention provides a method of forming asymmetric field-effect-transistors. The method includes forming at least a first and a second gate-mask stack on top of a semiconductor substrate, wherein the first and second gate-mask stacks include at least, respectively, a first and a second gate conductor of a first and a second transistor and have, respectively, a top surface, a first side, and a second side with the second side being opposite to the first side; performing a first halo implantation from the first side of the first and second gate-mask stacks at a first angle while applying the first gate-mask stack in preventing the first halo implantation from reaching a first source/drain region of the second transistor, wherein the first angle is equal to or larger than a predetermined value; and performing a second halo implantation from the second side of the first and second gate-mask stacks at a second angle, thereby creating halo implant in a second source/drain region of the second transistor, wherein the first and second angles are measured against a normal to the substrate.

    摘要翻译： 本发明提供了形成非对称场效应晶体管的方法。 该方法包括在半导体衬底的顶部上形成至少第一和第二栅极掩模叠层，其中第一和第二栅极掩模叠层至少分别包括第一和第二栅极掩模叠层的第一和第二栅极导体 分别具有顶表面，第一侧和第二侧，第二侧与第一侧相对; 以第一角度从第一和第二栅极掩模叠层的第一侧进行第一光晕注入，同时施加第一栅极掩模叠层以防止第一光晕注入到达第二晶体管的第一源极/漏极区域，其中 第一角度等于或大于预定值; 以及以第二角度从所述第一和第二栅极掩模叠层的第二侧执行第二光晕注入，从而在所述第二晶体管的第二源极/漏极区域中产生晕轮注入，其中所述第一和第二角度是针对 与基底垂直。

    Raised source drain mosfet with amorphous notched gate cap layer with notch sidewalls passivated and filled with dielectric plug
    7.
    发明授权
    Raised source drain mosfet with amorphous notched gate cap layer with notch sidewalls passivated and filled with dielectric plug 失效
    带有非绝缘缺口栅极盖层的引出源极漏极漏极，漏极侧壁钝化并填充有电介质插塞

    公开(公告)号：US07700425B2

    公开(公告)日：2010-04-20

    申请号：US11585361

    申请日：2006-10-23

    申请人： Tina J. Wagner ,  Werner A. Rausch ,  Sadanand V. Deshpande

    发明人： Tina J. Wagner ,  Werner A. Rausch ,  Sadanand V. Deshpande

    IPC分类号： H01L21/8238

    CPC分类号： H01L29/66772 ,  H01L29/78618

    摘要： A method is provided for forming an SOI MOSFET device with a silicon layer formed on a dielectric layer with a gate electrode stack, with sidewall spacers on sidewalls of the gate electrode stack and raised source/drain regions formed on the surface of the silicon layer. The gate electrode stack comprises a gate electrode formed of polysilicon over a gate dielectric layer formed on the surface of the silicon layer. A thin amorphous silicon cap layer is formed in the top surface of the gate electrode by implanting dopant into the surface thereof. A notch is etched into the periphery of the cap layer. A plug of dielectric material is formed in the notch. The sidewalls of the gate electrode are covered by the sidewall spacers which cover a portion of the plug for the purpose of eliminating the exposure of the gate polysilicon so that formation of spurious epitaxial growth during the formation of raised source/drain regions is avoided.

    摘要翻译： 提供了一种用于形成具有形成在具有栅极电极堆叠的电介质层上的硅层的SOI MOSFET器件的方法，在栅电极堆叠的侧壁上具有侧壁间隔物，并且形成在硅层的表面上的升高的源极/漏极区域。 栅极电极堆叠包括在形成于硅层的表面上的栅极电介质层上的多晶硅形成的栅电极。 通过将掺杂剂注入到其表面中，在栅电极的顶表面中形成薄的非晶硅覆盖层。 凹口蚀刻到盖层的周边。 在凹口中形成介电材料塞。 栅电极的侧壁被覆盖一部分插塞的侧壁间隔物覆盖，以消除栅极多晶硅的暴露，从而避免在形成升高的源极/漏极区域期间形成假外延生长。

    STI stress modification by nitrogen plasma treatment for improving performance in small width devices
    10.
    发明授权
    STI stress modification by nitrogen plasma treatment for improving performance in small width devices 失效
    通过氮等离子体处理进行STI应力改进，以改善小宽度器件的性能

    公开(公告)号：US06887798B2

    公开(公告)日：2005-05-03

    申请号：US10250047

    申请日：2003-05-30

    申请人： Sadanand V. Deshpande ,  Bruce B. Doris ,  Werner A. Rausch ,  James A. Slinkman

    发明人： Sadanand V. Deshpande ,  Bruce B. Doris ,  Werner A. Rausch ,  James A. Slinkman

    IPC分类号： H01L21/318 ,  H01L21/762 ,  H01L29/10 ,  H01L21/31 ,  H01L21/469

    CPC分类号： H01L29/7842 ,  H01L21/3185 ,  H01L21/76237 ,  H01L29/1033

    摘要： A method for modulating the stress caused by bird beak formation of small width devices by a nitrogen plasma treatment. The nitrogen plasma process forms a nitride liner about the trench walls that serves to prevent the formation of bird beaks in the isolation region during a subsequent oxidation step. In one embodiment, the plasma nitridation process occurs after trench etching, but prior to trench fill. In yet another embodiment, the plasma nitridation process occurs after trench fill. In yet another embodiment, a block mask is formed over predetermined active areas of the etched substrate prior to the plasma nitridation process. This embodiment is used in protecting the PFET device area from the plasma nitridation process thereby providing a means to form a PFET device area in which stress caused by bird beak formation increases the device performance of the PFET.

    摘要翻译： 一种通过氮等离子体处理调节小宽度装置的鸟嘴形成引起的应力的方法。 氮等离子体工艺形成围绕沟槽壁的氮化物衬垫，其用于在随后的氧化步骤期间防止在隔离区中形成鸟嘴。 在一个实施例中，等离子体氮化处理发生在沟槽蚀刻之后，但在沟槽填充之前。 在另一个实施例中，等离子体氮化处理发生在沟槽填充之后。 在另一个实施例中，在等离子体氮化处理之前，在蚀刻的衬底的预定有效区域上形成块掩模。 该实施例用于保护PFET器件区域免受等离子体氮化处理，从而提供形成PFET器件区域的装置，其中由鸟嘴形成引起的应力增加了PFET的器件性能。