公开(公告)号：US5957764A

公开(公告)日：1999-09-28

申请号：US964930

申请日：1997-11-05

申请人： H. Alexander Anderson ,  Linh X. Can ,  Tsungnan Cheng ,  Garry K. Kwong ,  Albert Hu ,  David Chen ,  Shu-Wong S. Lee

发明人： H. Alexander Anderson ,  Linh X. Can ,  Tsungnan Cheng ,  Garry K. Kwong ,  Albert Hu ,  David Chen ,  Shu-Wong S. Lee

IPC分类号： B24B21/04 ,  B24B37/04 ,  B24B5/00 ,  B24B29/00

CPC分类号： B24B21/04 ,  B24B37/04

摘要： A wafer polishing apparatus includes a module frame; a continuous belt rotatable with respect to the frame, the belt having at least one vertically-oriented belt transverse portion including a polishing pad assembly; and at least one pivotable wafer-holding head drive within the frame and having a distal end portion movable to a vertical first position parallel and juxtaposed to the belt transverse portion. The head drive includes a wafer carrier for holding a wafer on the distal end portion of the head drive, while a drive moves the distal end portion and a held wafer into a vertical polishing position abutting the belt transverse portion and pressure is applied to the held-wafer against the polishing pad assembly while the wafer-holding distal end portion is rotated and swept side-by-side. After polishing the drive is reversed and the head drive is pivoted away from the belt transverse portion to a horizontal or other orientation and the then polished wafer removed. Multiple modules may be placed end-to-end or side-by-side with a robot pathway therebetween to load unpolished wafers and to unload polished wafers to a buffing station, to a cassette or other processing station.

摘要翻译： 晶片抛光装置包括模块框架; 相对于框架可旋转的连续带，所述带具有包括抛光垫组件的至少一个垂直定向的带横向部分; 以及在所述框架内的至少一个可枢转的晶片保持头驱动器，并且具有可移动到平行并并列到所述带横向部分的垂直第一位置的远端部分。 头驱动器包括用于将晶片保持在头驱动器的远端部分的晶片载体，同时驱动器将远端部分和保持的晶片移动到邻近带横向部分的垂直抛光位置，并且压力施加到保持的 - 在晶片保持前端部分旋转并且并排扫掠的同时，抵靠抛光垫组件。 在抛光之后，驱动器被反转并且头驱动器从带横向部分转动到水平或其它方向，并且然后抛光晶片。 多个模块可以端对端或并排地放置在其间的机器人通路以加载未抛光的晶片并将抛光的晶片卸载到抛光台，到盒或其它处理站。

公开(公告)号：US06315857B1

公开(公告)日：2001-11-13

申请号：US09113714

申请日：1998-07-10

申请人： Tsungnan Cheng ,  Ethan C. Wilson ,  Shou-sung Chang ,  Gregory C. Lee ,  Huey M. Tzeng ,  David E. Weldon ,  Linh X. Can ,  Luis Lau ,  Siyuan Yang

发明人： Tsungnan Cheng ,  Ethan C. Wilson ,  Shou-sung Chang ,  Gregory C. Lee ,  Huey M. Tzeng ,  David E. Weldon ,  Linh X. Can ,  Luis Lau ,  Siyuan Yang

IPC分类号： B24B2100

CPC分类号： B24B37/26 ,  B24D11/00

摘要： Polishing pads are provided for a linear chemical mechanical polishing apparatus used in manufacturing integrated circuits. The polishing pads, which are attached to a polishing belt, are grooved in patterns to advantageously transport slurry from the point of introduction to the point at which semiconductor wafers are polished. The patterns include at least one set of multiple parallel grooves extending across the polishing pads. The grooves form an angle with the direction of travel of the belt that is unequal to zero.

摘要翻译： 为制造集成电路中使用的线性化学机械抛光装置提供抛光垫。 附着在抛光带上的抛光垫以图案开槽，以有利地将浆料从导入点输送到半导体晶片被抛光的点。 这些图案包括延伸穿过抛光垫的至少一组多个平行凹槽。 槽与带的行进方向形成不等于零的角度。

公开(公告)号：US6042457A

公开(公告)日：2000-03-28

申请号：US113614

申请日：1998-07-10

申请人： Ethan C. Wilson ,  James A. Allen ,  David E. Weldon ,  Gregory C. Lee ,  Linh X. Can ,  Jeffrey M. L. Fontana ,  Shou-sung Chang ,  Jade Jaboneta

发明人： Ethan C. Wilson ,  James A. Allen ,  David E. Weldon ,  Gregory C. Lee ,  Linh X. Can ,  Jeffrey M. L. Fontana ,  Shou-sung Chang ,  Jade Jaboneta

IPC分类号： B24B53/007 ,  B24B53/017 ,  B24B1/00

CPC分类号： B24B53/017

摘要： A conditioner assembly and a conditioner back support for conditioning a polishing pad of a chemical mechanical polishing device. The conditioner assembly comprises a conditioning head having a gimbal assembly, a shaft engaged to the conditioning head, and a linear torque bearing assembly slidably receiving the shaft. The linear torque bearing assembly is configured to operatively rotate the shaft assembly contemporaneously with allowing the shaft to extend and retract from a first open end of the linear torque bearing assembly. The conditioner assembly additionally comprises a bellows secured over the first open end and engaged to the conditioning head and a bearing housing disposed over a second open end of the linear torque bearing assembly. The bearing housing rotatably supports the linear torque bearing assembly such that a motor assembly can operatively drive the linear torque bearing assembly, the shaft, and the conditioning head.The conditioner back support respectively opposes the conditioner assembly such that the polishing belt supporting the polishing pad is disposed intermediate to the conditioner back support and the conditioner assembly. The conditioner back support comprises a frame assembly which adjustably support a backing plate. The frame assembly comprises a positioning assembly which allows a user to adjust the position of the backing plate. The position of the backing plate can be adjusted such that a front surface of the backing plate is parallel to and disposed on or proximal to a plane defined by a backside of the polishing belt. As a result, when the conditioner assembly compresses against the polishing pad, the polishing pad does not significantly deflect. The conditioner back support further includes a polymeric compound disposed on the front surface of the backing plate for reducing the frictional force between the backing plate and the polishing belt.

摘要翻译： 调节器组件和用于调节化学机械抛光装置的抛光垫的调节器背部支撑件。 调节器组件包括具有万向节组件，接合到调节头的轴和可滑动地接收轴的线性扭矩轴承组件的调节头。 线性扭矩轴承组件构造成可同时使轴组件可操作地旋转，允许轴从线性扭矩轴承组件的第一开口端延伸和缩回。 调节器组件另外包括固定在第一开口端上并接合到调节头的波纹管和设置在线性扭矩轴承组件的第二开口端上的轴承壳体。 轴承座可旋转地支撑线性扭矩轴承组件，使得马达组件可操作地驱动线性扭矩轴承组件，轴和调节头。 调理器背部支撑分别与调节器组件相对，使得支撑抛光垫的抛光带设置在调节器背部支撑件和调节器组件的中间。 护发背部支撑件包括可调节地支撑背板的框架组件。 框架组件包括允许使用者调整背板的位置的定位组件。 可以调节背板的位置，使得背板的前表面平行于并设置在由抛光带的背面限定的平面上或其附近。 结果，当调节器组件压靠抛光垫时，抛光垫不会显着偏转。 调理器背部支撑件还包括设置在背板的前表面上的聚合物，用于减小背板和抛光带之间的摩擦力。

公开(公告)号：US6062961A

公开(公告)日：2000-05-16

申请号：US964817

申请日：1997-11-05

申请人： Linh X. Can ,  Kelvin Lum ,  Gregory A. Appel

发明人： Linh X. Can ,  Kelvin Lum ,  Gregory A. Appel

IPC分类号： B24B21/04 ,  B24B37/04 ,  B24B41/06

CPC分类号： B24B37/04 ,  B24B21/04

摘要： A wafer polisher head drive includes a head drive housing; a head portion extending from the housing for mounting an unpolished wafer when the head drive housing and head portion are in a horizontal orientation; a pivot mechanism extending from the head drive housing for pivoting the head drive housing and the head portion from the horizontal orientation to a vertical orientation juxtaposed to a transverse vertical portion of a continuous rotating polishing belt; a drive in the housing for moving the head portion and a mounted wafer outwardly from the housing against the transverse vertical portion of the rotating polishing belt; and a drive in the housing for rotating the head portion and the mounted wafer. The head drive housing may be pivoted from the vertical orientation in a sweeping arc extending perpendicularly from the belt transverse vertical portion or in a swinging arc extending parallel from the belt transverse vertical portion. The pivot mechanism includes a hollow shaft connected to said head drive housing; and a motor, gearbox and a ball screw and nut assembly in driving connection between the gearbox and the hollow shaft for transversing in a direction parallel to the belt.

摘要翻译： 晶片抛光头驱动器包括头驱动器壳体; 当所述头驱动器壳体和头部部分处于水平方向时，从所述壳体延伸的用于安装未抛光晶片的头部; 从所述头驱动壳体延伸的枢转机构，用于将所述头驱动器壳体和所述头部部分从所述水平定向枢转到与所述连续旋转抛光带的横向垂直部分并置的垂直取向; 壳体中的驱动器，用于将头部部分和安装的晶片从壳体向外移动旋转抛光带的横向垂直部分; 以及用于旋转头部和安装的晶片的壳体中的驱动。 头驱动器壳体可以从垂直于带横向垂直部分或从带横向垂直部分平行延伸的摆动弧中扫掠的弧线从竖直方向枢转。 枢转机构包括连接到所述头驱动器壳体的空心轴; 以及在齿轮箱和中空轴之间的驱动连接中的马达，齿轮箱和滚珠丝杠和螺母组件，用于在平行于带的方向上横切。

公开(公告)号：US06860710B1

公开(公告)日：2005-03-01

申请号：US10404241

申请日：2003-04-01

申请人： Masato Toshima ,  Linh X. Can ,  Jay C. Cho

发明人： Masato Toshima ,  Linh X. Can ,  Jay C. Cho

IPC分类号： B65G49/07 ,  H01L21/687

CPC分类号： H01L21/68742 ,  H01L21/68764 ,  H01L21/68771 ,  Y10S414/139

摘要： In one embodiment, a lifting apparatus in an integrated circuit fabrication system includes a sliding mechanism supporting a rotatable assembly and an actuator configured to vertically move the sliding mechanism. Among other advantages, the apparatus allows the rotatable assembly to be lifted and then rotated to allow access to interior components, for example. In one embodiment, the rotatable assembly comprises a lid of a process chamber.

摘要翻译： 在一个实施例中，集成电路制造系统中的提升装置包括支撑可旋转组件的滑动机构和构造成垂直移动滑动机构的致动器。 除了其它优点之外，该装置允许可旋转组件被提升，然后旋转以允许例如进入内部部件。 在一个实施例中，可旋转组件包括处理室的盖。

公开(公告)号：US06322429B1

公开(公告)日：2001-11-27

申请号：US09491405

申请日：2000-01-26

申请人： Ethan C. Wilson ,  James A. Allen ,  David E. Weldon ,  Gregory C. Lee ,  Linh X. Can ,  Jeffrey M. L. Fontana ,  Shou-sung Chang ,  Jade Jaboneta

发明人： Ethan C. Wilson ,  James A. Allen ,  David E. Weldon ,  Gregory C. Lee ,  Linh X. Can ,  Jeffrey M. L. Fontana ,  Shou-sung Chang ,  Jade Jaboneta

IPC分类号： B24B700

CPC分类号： B24B53/017

摘要： A conditioner assembly and a conditioner back support for conditioning a polishing pad of a chemical mechanical polishing device. The conditioner assembly comprises a conditioning head having a gimbal assembly, a shaft engaged to the conditioning head, and a linear torque bearing assembly slidably receiving the shaft. The linear torque bearing assembly is configured to operatively rotate the shaft assembly contemporaneously with allowing the shaft to extend and retract from a first open end of the linear torque bearing assembly. The conditioner assembly additionally comprises a bellows secured over the first open end and engaged to the conditioning head and a bearing housing disposed over a second open end of the linear torque bearing assembly. The conditioner back support respectively opposes the conditioner assembly such that the polishing belt supporting the polishing pad is disposed intermediate to the conditioner back support and the conditioner assembly. The conditioner back support comprises a frame assembly which adjustably support a backing plate. The frame assembly comprises a positioning assembly which allows a user to adjust the position of the backing plate. The position of the backing plate can be adjusted such that a front surface of the backing plate is parallel to and disposed on or proximal to a plane defined by a backside of the polishing belt. As a result, when the conditioner assembly compresses against the polishing pad, the polishing pad does not significantly deflect.

摘要翻译： 调节器组件和用于调节化学机械抛光装置的抛光垫的调节器背部支撑件。 调节器组件包括具有万向节组件，接合到调节头的轴和可滑动地接收轴的线性扭矩轴承组件的调节头。 线性扭矩轴承组件构造成可同时使轴组件可操作地旋转，允许轴从线性扭矩轴承组件的第一开口端延伸和缩回。 调节器组件还包括固定在第一开口端上并接合到调节头的波纹管和布置在线性扭矩轴承组件的第二开口端上的轴承壳体。调节器背部支撑件分别与调节器组件相对地使得抛光带 支撑抛光垫设置在调节器背部支撑件和调节器组件的中间。 护发背部支撑件包括可调节地支撑背板的框架组件。 框架组件包括允许使用者调整背板的位置的定位组件。 可以调节背板的位置，使得背板的前表面平行于并设置在由抛光带的背面限定的平面上或其附近。 结果，当调节器组件压靠抛光垫时，抛光垫不会显着偏转。

公开(公告)号：US06267655B1

公开(公告)日：2001-07-31

申请号：US09116311

申请日：1998-07-15

申请人： David E. Weldon ,  Shu-Hsin Kao ,  Michael Leach ,  Charles J. Regan ,  Linh X. Can

发明人： David E. Weldon ,  Shu-Hsin Kao ,  Michael Leach ,  Charles J. Regan ,  Linh X. Can

IPC分类号： B24B722

CPC分类号： B24B37/32

摘要： An improved wafer polishing machine is disclosed. In one embodiment, the wafer polishing machine has a movable polishing surface and a holder that holds an object, such as a semiconductor wafer, against the movable polishing surface. The holder includes a support structure that supports the object in contact with the polishing surface and an annular retaining ring that retains the object in alignment with the support structure. The retaining ring has a plurality of projections projecting inwardly from its inner circumference. The projections are evenly spaced around the inner circumference of the retaining ring. In one embodiment, the projections on the retaining ring define a circle with a diameter no less than the diameter of the object being polished. In an alternative embodiment, the retaining ring has a smooth, circular inner circumference formed from a flexible material which distends to from a continuous arc of contact with the wafer during polishing. Each retaining ring disclosed herein forms multiple points of contact or a continuous arc of contact between the retaining ring and the wafer, thereby reducing wafer buckling during polishing and improving surface uniformity.

摘要翻译： 公开了一种改进的晶片抛光机。 在一个实施例中，晶片抛光机具有可动抛光表面和将诸如半导体晶片的物体保持在可动抛光表面上的保持器。 保持器包括支撑结构，其支撑与抛光表面接触的物体，以及保持对象与支撑结构对准的环形保持环。 保持环具有从其内周向内突出的多个突起。 突起围绕保持环的内圆周均匀间隔开。 在一个实施例中，保持环上的突起限定直径不小于被抛光物体的直径的圆。 在替代实施例中，保持环具有由柔性材料形成的平滑的圆形内圆周，该柔性材料在抛光期间从与晶片的连续弧接触扩展。 本文公开的每个固定环在保持环和晶片之间形成多个接触点或连续的接触弧，从而在抛光期间减少晶片屈曲并改善表面均匀性。