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公开(公告)号：US11548287B2
公开(公告)日：2023-01-10
申请号：US17251263
申请日：2018-11-14
发明人： Chien-Hua Chen , Michael W. Cumbie
摘要： In one example in accordance with the present disclosure, a fluidic die assembly is described. The fluidic die assembly includes a rigid substrate having a bend therein. A fluidic die is disposed on the rigid substrate. The fluidic die is to eject fluid from a reservoir fluidly coupled to the fluidic die. The fluidic die includes an array of ejection subassemblies. Each ejection subassembly includes an ejection chamber to hold a volume of fluid, an opening, and a fluid actuator to eject a portion of the volume of fluid through the opening. The fluidic die assembly also includes an electrical interface disposed on the rigid substrate to establish an electrical connection between the fluidic die and a controller. The fluidic die and the electrical interface are disposed on a same surface on opposite sides of the bend.
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公开(公告)号：US20220410163A1
公开(公告)日：2022-12-29
申请号：US17778517
申请日：2019-12-09
IPC分类号： B01L3/00
摘要： In one example an apparatus can include a controller communicatively coupled to a droplet dispenser to deposit fluid on a digital microfluidic (DMF) array including a plurality of droplet manipulation electrodes, the controller to: select a first droplet manipulation electrode from the plurality of droplet manipulation electrodes to on which to dispense a first volume of fluid via the droplet dispenser; position the droplet dispenser over the selected first droplet manipulation electrode; and deposit the first volume of fluid onto the selected first droplet manipulation electrode.
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公开(公告)号：US11364493B2
公开(公告)日：2022-06-21
申请号：US16645042
申请日：2017-10-12
发明人： Michael W. Cumbie , Chien-Hua Chen
摘要： A microfluidic apparatus may include, in an example, a substrate, at least one silicon die embedded into the substrate, and a planarization layer layered over, at least, a portion of the substrate that interfaces with the silicon die to prevent a fluid from contacting an edge of the silicon die.
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公开(公告)号：US11358390B2
公开(公告)日：2022-06-14
申请号：US17251856
申请日：2018-09-27
发明人： Michael Cumbie , Chien-Hua Chen
摘要： Examples include a fluid ejection device comprising a carrier, at least one fluid ejection die, and conductive traces at least partially embedded in the carrier. The carrier has a first portion and a second portion, where an angle of orientation between the first portion and the second portion is nonparallel. The first portion includes an array of openings formed through a top surface of the carrier. The second portion includes at least one die opening through a bottom surface of the carrier. The fluid ejection die is coupled to the second portion of the carrier. Fluid passages formed in a back surface of the fluid ejection die are exposed through the at least one die opening formed through the bottom surface of the carrier. The conductive traces have an array of contact points at first ends of the conductive traces. The array of contact points align with the array of openings of the first portion of the carrier such that the array of contact points are exposed through the array of openings. The conductive traces connect the fluid ejection die and the array of contact points.
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公开(公告)号：US11351787B2
公开(公告)日：2022-06-07
申请号：US17276971
申请日：2018-11-21
摘要： A curved fluid ejection device may include a plurality of fluid ejection dies overmolded with at least one layer of epoxy mold compound (EMC). Each of the fluid ejection dies and the EMC include a coefficient of thermal expansion (CTE). The combination of the CTE of the fluid ejection dies and the CTE of the at least one layer of EMC defines a curve within the curved fluid ejection device.
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公开(公告)号：US11325378B2
公开(公告)日：2022-05-10
申请号：US17083156
申请日：2020-10-28
摘要： In example implementations, a method is provided, which may include providing a carrier, applying a thermal release tape over the carrier, attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape, wherein the print head die comprises ink feed holes formed in a back surface of the print head die, encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC), removing the carrier and the thermal release tape, and forming a slot over an area of the EMC that covers the ink feed holes, wherein the ink feed holes are to be fluidically coupled to the slot.
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公开(公告)号：US11318469B2
公开(公告)日：2022-05-03
申请号：US16606287
申请日：2018-04-25
发明人： Viktor Shkolnikov , Chien-Hua Chen
摘要： An example system includes a microfluidic cavity; a retaining feature within the microfluidic cavity, and a releasing feature. The retaining feature is to position capsules at a predetermined location in the microfluidic cavity. The capsules have a thermally degradable shell enclosing a material therein. The releasing feature is to selectively cause degradation of the shell to release the material into the microfluidic opening. The releasing feature is to generate heat to facilitate degradation of the shell. In some examples, the retaining feature is a physical barrier sized to prevent flow of the capsule and to allow flow of the released materials through the microfluidic cavity.
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公开(公告)号：US11278887B2
公开(公告)日：2022-03-22
申请号：US16493241
申请日：2017-04-21
IPC分类号： B01L3/00
摘要： A microfluidic device is provided that includes a substrate and microfluidic sub-chips embedded in the substrate. An electric field is applied between an adjacent pair microfluidic sub-chips to move a fluid droplet from one of the adjacent pair of microfluidic sub-chips to another of the adjacent pair microfluidic sub-chips.
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公开(公告)号：US20210362156A1
公开(公告)日：2021-11-25
申请号：US16606241
申请日：2018-07-16
发明人： Viktor Shkolnikov , Chien-Hua Chen
IPC分类号： B01L3/00
摘要： An example of an apparatus includes a focusing region to focus a sheath fluid and a particle flow. The apparatus also includes a particle inlet to inject the particle flow into the focusing region. In addition, the apparatus includes a sheath inlet to inject the sheath fluid into the focusing region. Also, the apparatus includes a cut-out disposed on a wall of the sheath inlet to distribute the sheath fluid about the particle flow to focus the particle flow into a linear stream. The apparatus further includes a separation region to apply a force to the particle flow. The force is dependent on a characteristic of a particle in the particle flow.
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公开(公告)号：US11183437B2
公开(公告)日：2021-11-23
申请号：US16737361
申请日：2020-01-08
摘要： In some examples, a circuit package includes a packaging, and a circuit device in the packaging, where the packaging comprises a first EMC having a first coefficient of thermal expansion (CTE), and a second EMC having a second CTE higher than the first CTE. The second EMC is on the first EMC that has gelled over time.
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