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公开(公告)号：US11975468B2
公开(公告)日：2024-05-07
申请号：US17312349
申请日：2019-07-26
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Chien-Hua Chen , Si-lam J. Choy , Michael W. Cumbie
CPC classification number: B29C45/14508 , B29C45/14065 , B29C45/322 , B41J2/1601 , B41J2/1637 , B29K2063/00 , B29K2995/0012 , B29L2031/767
Abstract: In various examples, a printbar is formed from multiple modular fluid ejection subassemblies joined together through a molding process that provides for a continuous planar substrate surface. A mold may secure the modular fluid ejection subassemblies during a molding process in which a runner conveys a molding material to seams between the joined modular fluid ejection subassemblies.
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公开(公告)号：US20240116055A1
公开(公告)日：2024-04-11
申请号：US17960942
申请日：2022-10-06
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Michael W. Cumbie , Chien-Hua Chen , Viktor Shkolnikov
CPC classification number: B01L3/502792 , B01L3/502715 , B01L3/50273 , C12M23/16 , B01L2200/027 , B01L2300/0645 , B01L2300/0816 , B01L2300/161 , B01L2300/165 , B01L2400/0427
Abstract: An example digital microfluidic device can include a hydrophobic electrowetting surface including an array of electrodes. The individual electrodes can have a shape with three or more sides. The array of electrodes can include a parking electrode and an adjacent electrode that is adjacent to the parking electrode. A cover can be positioned over the electrowetting surface at a gap distance sufficient to accommodate a liquid droplet between the cover and the electrowetting surface. A plurality of droplet barriers can be positioned on three or more sides of the parking electrode. The droplet barriers can constrain movement of a liquid droplet from the parking electrode to the adjacent electrode.
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公开(公告)号：US11904312B2
公开(公告)日：2024-02-20
申请号：US16643264
申请日：2017-11-22
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Hilary Ely , Adam Higgins , Rachel M. White , Erik D. Torniainen , Tod Woodford , Michael W. Cumbie , Chien-Hua Chen
CPC classification number: B01L3/502715 , B01L3/50273 , B01L3/502723 , B01L2300/041 , B01L2300/048 , B01L2300/06 , B01L2300/0627 , B01L2300/0654 , B01L2300/0681 , B01L2300/0819 , B01L2300/12 , B01L2300/18 , B01L2400/0406 , B81B1/00
Abstract: The present disclosure is drawn to microfluidic devices. A microfluidic device can include a substrate, a lid mounted to the substrate, and a microchip mounted to the substrate. The lid mounted to the substrate can form a discrete microfluidic chamber between structures including an interior surface of the lid and a portion of the substrate. The lid can include an inlet and a vent positioned relative to one another to facilitate loading of fluid to the discrete microfluidic chamber via capillary action. A portion of the microchip can be positioned within the discrete microfluidic chamber.
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公开(公告)号：US11642885B2
公开(公告)日：2023-05-09
申请号：US16916520
申请日：2020-06-30
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Michael W Cumbie , Chien-Hua Chen
CPC classification number: B41J2/14145 , B41J2/1404 , B41J2/14032 , B41J2/1601 , B41J2202/12
Abstract: A fluid ejection die includes an ejection nozzle and an ejection chamber fluidly connected to the ejection nozzle. The die includes a fluid input hole fluidly connected to the ejection chamber, a fluid output hole, and a fluid output channel fluidly connected to the ejection chamber and the fluid output hole. The die includes a fluid circulation rib positioned between the fluid input hole and the fluid output hole.
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公开(公告)号：US11548287B2
公开(公告)日：2023-01-10
申请号：US17251263
申请日：2018-11-14
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Chien-Hua Chen , Michael W. Cumbie
Abstract: In one example in accordance with the present disclosure, a fluidic die assembly is described. The fluidic die assembly includes a rigid substrate having a bend therein. A fluidic die is disposed on the rigid substrate. The fluidic die is to eject fluid from a reservoir fluidly coupled to the fluidic die. The fluidic die includes an array of ejection subassemblies. Each ejection subassembly includes an ejection chamber to hold a volume of fluid, an opening, and a fluid actuator to eject a portion of the volume of fluid through the opening. The fluidic die assembly also includes an electrical interface disposed on the rigid substrate to establish an electrical connection between the fluidic die and a controller. The fluidic die and the electrical interface are disposed on a same surface on opposite sides of the bend.
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Patent Agency Ranking
公开(公告)号：US20220410163A1
公开(公告)日：2022-12-29
申请号：US17778517
申请日：2019-12-09
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Michael W. Cumbie , Viktor Shkolnikov , Chien-Hua Chen
IPC: B01L3/00
Abstract: In one example an apparatus can include a controller communicatively coupled to a droplet dispenser to deposit fluid on a digital microfluidic (DMF) array including a plurality of droplet manipulation electrodes, the controller to: select a first droplet manipulation electrode from the plurality of droplet manipulation electrodes to on which to dispense a first volume of fluid via the droplet dispenser; position the droplet dispenser over the selected first droplet manipulation electrode; and deposit the first volume of fluid onto the selected first droplet manipulation electrode.
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公开(公告)号：US11364493B2
公开(公告)日：2022-06-21
申请号：US16645042
申请日：2017-10-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Michael W. Cumbie , Chien-Hua Chen
Abstract: A microfluidic apparatus may include, in an example, a substrate, at least one silicon die embedded into the substrate, and a planarization layer layered over, at least, a portion of the substrate that interfaces with the silicon die to prevent a fluid from contacting an edge of the silicon die.
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公开(公告)号：US11358390B2
公开(公告)日：2022-06-14
申请号：US17251856
申请日：2018-09-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Michael Cumbie , Chien-Hua Chen
Abstract: Examples include a fluid ejection device comprising a carrier, at least one fluid ejection die, and conductive traces at least partially embedded in the carrier. The carrier has a first portion and a second portion, where an angle of orientation between the first portion and the second portion is nonparallel. The first portion includes an array of openings formed through a top surface of the carrier. The second portion includes at least one die opening through a bottom surface of the carrier. The fluid ejection die is coupled to the second portion of the carrier. Fluid passages formed in a back surface of the fluid ejection die are exposed through the at least one die opening formed through the bottom surface of the carrier. The conductive traces have an array of contact points at first ends of the conductive traces. The array of contact points align with the array of openings of the first portion of the carrier such that the array of contact points are exposed through the array of openings. The conductive traces connect the fluid ejection die and the array of contact points.
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公开(公告)号：US11351787B2
公开(公告)日：2022-06-07
申请号：US17276971
申请日：2018-11-21
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Chien-Hua Chen , Michael W. Cumbie , Si-Iam J. Choy
Abstract: A curved fluid ejection device may include a plurality of fluid ejection dies overmolded with at least one layer of epoxy mold compound (EMC). Each of the fluid ejection dies and the EMC include a coefficient of thermal expansion (CTE). The combination of the CTE of the fluid ejection dies and the CTE of the at least one layer of EMC defines a curve within the curved fluid ejection device.
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公开(公告)号：US11325378B2
公开(公告)日：2022-05-10
申请号：US17083156
申请日：2020-10-28
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Michael W. Cumbie , Devin Alexander Mourey , Chien-Hua Chen
Abstract: In example implementations, a method is provided, which may include providing a carrier, applying a thermal release tape over the carrier, attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape, wherein the print head die comprises ink feed holes formed in a back surface of the print head die, encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC), removing the carrier and the thermal release tape, and forming a slot over an area of the EMC that covers the ink feed holes, wherein the ink feed holes are to be fluidically coupled to the slot.
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