OPTICAL MODULE
    1.
    发明申请

    公开(公告)号:US20250007608A1

    公开(公告)日:2025-01-02

    申请号:US18882203

    申请日:2024-09-11

    Abstract: An optical module includes a base, a first cover, a circuit board, a light emitting assembly and a light receiving assembly. Part of the circuit board is arranged on a surface of the base, and part thereof arranged outside the base. The light emitting assembly includes a plurality of light-emitting chips disposed on the base and an optical multiplexer disposed on the first cover and located in a laser exit direction of the plurality of light-emitting chips. The light receiving assembly includes an optical demultiplexer disposed on the first cover, a plurality of light-receiving chips disposed on the circuit board and are located in a laser exit direction of the optical demultiplexer, a reflection prism disposed at a side of the plurality of light-receiving chips away from the circuit board, and an optical receiving case covering the plurality of light-receiving chips and the reflection prism.

    OPTICAL MODULE
    3.
    发明申请

    公开(公告)号:US20220006253A1

    公开(公告)日:2022-01-06

    申请号:US17475775

    申请日:2021-09-15

    Abstract: An optical module includes a shell, a circuit board and an optical transmitter device. The circuit board is disposed in the shell. The optical transmitter device is disposed in the shell, and includes a plate-shaped substrate and a laser assembly. The laser assembly is disposed on a surface of the substrate, is electrically connected to the circuit board, and is configured to emit an optical signal. The substrate is fixedly connected to an end of the circuit board.

    OPTICAL MODULE
    4.
    发明申请

    公开(公告)号:US20230127729A1

    公开(公告)日:2023-04-27

    申请号:US18087003

    申请日:2022-12-22

    Abstract: An optical module includes a base, a first cover, a circuit board, a light emitting assembly and a light receiving assembly. The light emitting assembly includes a plurality of light-emitting chips and an optical multiplexer. The plurality of light-emitting chips are disposed on the first bottom plate. The optical multiplexer is disposed on the first cover and is located in a laser exit direction of the plurality of light-emitting chips. The light receiving assembly includes an optical demultiplexer and a plurality of light-receiving chips. The optical demultiplexer is disposed on the first cover. The plurality of light-receiving chips are disposed on the circuit board and are located in a laser exit direction of the optical demultiplexer.

    OPTICAL SUB-MODULE AND OPTICAL MODULE

    公开(公告)号:US20210157073A1

    公开(公告)日:2021-05-27

    申请号:US17162173

    申请日:2021-01-29

    Abstract: An optical sub-module includes a first casing, a second casing, an adhesive layer and an optical device. The first casing has a top wall and a first sidewall. The second casing has a bottom wall and a second sidewall. A height of the second sidewall in a thickness direction of the bottom wall is greater than a height of the first sidewall in a thickness direction of the top wall, and the second casing and the first casing is connected to form a chamber. The adhesive layer is disposed between a surface of the first sidewall and a surface of the second sidewall, and a coefficient of thermal expansion of the adhesive layer is greater than a coefficient of thermal expansion of the first casing and a coefficient of thermal expansion of the second casing. The optical device is disposed in the chamber and fixedly connected to the second casing.

    Optical Module
    6.
    发明公开
    Optical Module 审中-公开

    公开(公告)号:US20240275115A1

    公开(公告)日:2024-08-15

    申请号:US18642723

    申请日:2024-04-22

    Abstract: An optical module includes a circuit board and an optical transmitter device. The optical transmitter device includes a substrate, a spacer disposed on and electrically connected to the circuit board, a laser chip disposed on and electrically connected to the spacer, an optical fiber adapter disposed on the substrate in a light exit direction of the laser chip, a focusing lens disposed between the laser chip and the optical fiber adapter, light incident surface of the optical fiber adapter has a first inclination angle with respect to an axis of the optical fiber adapter, the axis of the optical fiber adapter being located in a plane parallel to the substrate, the optical fiber adapter is obliquely disposed on the substrate such that an axis of the internal optical fiber has a second inclination angle with respect to optical axis of the focusing lens.

    Optical Module
    7.
    发明申请

    公开(公告)号:US20220326456A1

    公开(公告)日:2022-10-13

    申请号:US17853792

    申请日:2022-06-29

    Abstract: The present disclosure discloses an optical module including: a circuit board; a housing assembly divided by a separation board into a first portion and a second portion that are stacked one above the other, wherein a light-emitting cavity is formed in the second portion, and a partition wall is provided in the first portion to separate the first portion into a light-receiving cavity and a slot, and is provided with a plurality of light-passing holes via which the light-receiving cavity is in communication with the slot; an optical fiber adapter disposed in the housing assembly and in communication with the light-receiving cavity; a light-emitting assembly arranged in the light emitting cavity and electrically connected to the circuit board, wherein heat generated by the light-emitting assembly is conducted to a surface of the housing assembly via the partition wall; and a light-receiving assembly.

    OPTICAL MODULE
    8.
    发明申请

    公开(公告)号:US20220019035A1

    公开(公告)日:2022-01-20

    申请号:US17490035

    申请日:2021-09-30

    Abstract: An optical module includes a shell, a circuit board, a light-receiving device and an optical fiber ribbon. The circuit board is located in the shell. The light-receiving device is disposed on the circuit board and is electrically connected to the circuit board. An end of the optical fiber ribbon is connected to the light-receiving device. The light-receiving device includes a light-receiving chip and a focusing lens. The light-receiving chip is disposed on a surface of the circuit board and has a photosensitive surface. The focusing lens is disposed opposite to the photosensitive surface of the light-receiving chip, and is configured to converge light transmitted by the optical fiber ribbon to the photosensitive surface of the light-receiving chip.

    OPTICAL TRANSMISSION MODULE, OPTICAL TRANSMISSION-RECEPTION MODULE AND OPTICAL MODULE

    公开(公告)号:US20210218217A1

    公开(公告)日:2021-07-15

    申请号:US17219200

    申请日:2021-03-31

    Abstract: An optical transmission module includes a housing having a cavity therein and an optical transmission device encapsulated in the cavity. The optical transmission device includes an optical waveguide substrate, laser assemblies, an optical multiplexing assembly and main waveguides. The optical waveguide substrate includes a surface and a first reflection inclined surface having an acute angle therebetween. The laser assemblies are disposed on the surface of the optical waveguide substrate, and are configured to emit laser beams towards the surface of the optical waveguide substrate. The optical multiplexing assembly is disposed in the optical waveguide substrate, and is configured to combine the laser beams into a laser beam. The main waveguides are disposed inside the optical waveguide substrate, light inlet ends of the main waveguides face the first inclined surface, and light outlet ends of the main waveguides are communicated with the optical multiplexing assembly.

    OPTICAL MODULE
    10.
    发明申请
    OPTICAL MODULE 审中-公开

    公开(公告)号:US20200328815A1

    公开(公告)日:2020-10-15

    申请号:US16911897

    申请日:2020-06-25

    Abstract: An optical module includes: a casing; a printed circuit board (PCB) connected to a first side wall of the casing and configured to provide first electrical signals to an optical transmitter assembly; the optical transmitter assembly arranged in the casing and configured to convert the first electrical signals into first optical signals; an optical receiver adapter and an optical transmitter adapter arranged outside the casing and connected to a second side wall of the casing, wherein the optical transmitter adapter is configured to receive second optical signals; a first displacement prism arranged in the casing and configured to direct the second optical signals toward an optical receiver assembly; and the optical receiver assembly configured to convert the second optical signals into second electrical signals. At least one component of the optical receiver assembly is arranged in the casing.

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