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公开(公告)号：US10574039B2
公开(公告)日：2020-02-25
申请号：US15706802
申请日：2017-09-18
Inventor： Hideki Shigematsu , Masafumi Saito , Keita Miyashita , Ryuzo Sakamoto , Hiroyuki Miyajima , Akio Komamura
Abstract: A peeling apparatus 1 includes a first peeling die and a second peeling die respectively including a pair of cutting blades 251 that peels the insulating film by being moved in a direction perpendicular to an axial direction of the conductive wire material 2 to cut the insulating film, and a support die 253 that supports a side surface of the conductive wire material 2 from a downstream side in a moving direction of the cutting blades 251 at the time of cutting by the cutting blades 251, the support die 253 of the first peeling die including a convex portion 2533 protruding toward the conductive wire material 2.
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公开(公告)号：US20180083428A1
公开(公告)日：2018-03-22
申请号：US15706802
申请日：2017-09-18
Inventor： Hideki Shigematsu , Masafumi Saito , Keita Miyashita , Ryuzo Sakamoto , Hiroyuki Miyajima , Akio Komamura
CPC classification number: H02G1/126 , H01B15/006 , H02G1/127 , H02G1/1285 , Y02W30/821
Abstract: A peeling apparatus 1 includes a first peeling die and a second peeling die respectively including a pair of cutting blades 251 that peels the insulating film by being moved in a direction perpendicular to an axial direction of the conductive wire material 2 to cut the insulating film, and a support die 253 that supports a side surface of the conductive wire material 2 from a downstream side in a moving direction of the cutting blades 251 at the time of cutting by the cutting blades 251, the support die 253 of the first peeling die including a convex portion 2533 protruding toward the conductive wire material 2.
