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27 条记录 (耗时 0.043 秒)

    Method for treating substrates
    8.
    发明授权
    Method for treating substrates 失效
    处理底物的方法

    公开(公告)号：US5427627A

    公开(公告)日：1995-06-27

    申请号：US179653

    申请日：1994-01-05

    申请人： Michael J. Canestaro ,  Donald G. McBride ,  Louis J. Konrad, III ,  Ronald J. Moore

    发明人： Michael J. Canestaro ,  Donald G. McBride ,  Louis J. Konrad, III ,  Ronald J. Moore

    IPC分类号： C23F1/08 ,  B05C3/12 ,  B05C3/18 ,  B05C5/02 ,  C23G3/00 ,  H05K3/00 ,  H05K3/06 ,  H05K3/18 ,  H05K3/26 ,  H05K3/42 ,  B08B3/02

    CPC分类号： B05C3/18 ,  B05C3/125 ,  H05K3/0085

    摘要： A device for applying fluid to a substrate which includes a head member having first and second opposed portions adapted for being fixedly positioned relative to each other. The device is particularly suited for treating a substrate as the substrate moves between the first and second portions. Each portion may in turn include a first channel located at a predetermined distance from the substrate for having a first fluid impinge on the substrate at a first velocity. Additionally, each portion may include a weir adjacent the first channel for having fluid pass thereover at an accelerated rate and thus at a greater velocity than the first fluid, this weir being located at a lesser distance than the first channel. Fluid inlet means is coupled to the respective portions to provide the fluid thereto at desired velocities. Significantly, a fluid blocking means (e.g., an elongated bar) is also included as part of the structure for maintaining the fluids at pre-established levels.

    摘要翻译： 一种用于向衬底施加流体的装置，其包括具有适于相对于彼此固定定位的第一和第二相对部分的头部构件。 当衬底在第一和第二部分之间移动时，该器件特别适用于处理衬底。 每个部分还可以包括位于距衬底预定距离的第一通道，以使第一流体以第一速度冲击在衬底上。 另外，每个部分可以包括邻近第一通道的堰，用于使流体以加速的速度传递到其上，因此以比第一流体更大的速度传递，该堰位于比第一通道更小的距离处。 流体入口装置联接到相应的部分，以期望的速度向其提供流体。 重要的是，还包括流体阻塞装置（例如，细长条）作为用于将流体保持在预先确定的水平的结构的一部分。

    Full panel electronic packaging structure
    9.
    发明授权
    Full panel electronic packaging structure 失效
    全面板电子封装结构

    公开(公告)号：US4855867A

    公开(公告)日：1989-08-08

    申请号：US151382

    申请日：1988-02-02

    申请人： Charles E. Gazdik ,  Donald G. McBride ,  Donald P. Seraphim ,  Patrick A. Toole

    发明人： Charles E. Gazdik ,  Donald G. McBride ,  Donald P. Seraphim ,  Patrick A. Toole

    IPC分类号： H01L21/60 ,  H01L23/538 ,  H01L25/065

    CPC分类号： H01L24/82 ,  H01L23/5387 ,  H01L24/24 ,  H01L25/0655 ,  H01L2224/24226 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351

    摘要： An electronic packaging structure, and a method of making this structure, are disclosed. The electronic packaging structure comprises a full panel, circuitized flexible film semiconductor chip carrier mounted on a circuitized substrate such as a printed circuit board. A plurality of semiconductor chips are mounted on the carrier in a selected pattern, and the carrier, with the chips, is mounted on a matching pattern of bonding sites on the circuitized substrate. Preferably, the circuitized flexible film semiconductor chip carrier is manufactured on a support structure used to facilitate handling of the circuitized flexible film and to facilitate heat transfer from the semiconductor chips mounted on the carrier to a heat sink which is part of the circuitized substrate. Also, the semiconductor chips mounted on the flexible film chip carrier may be tested, and burned in, while on the support structure before the chip carrier, with the chips, is mounted on the circuitized substrate.

    摘要翻译： 公开了一种电子封装结构及其制造方法。 电子封装结构包括安装在诸如印刷电路板的电路化基板上的全面板，电路化的柔性膜半导体芯片载体。 多个半导体芯片以所选择的图案安装在载体上，并且具有芯片的载体安装在电路化基板上的匹配图案上的结合位置。 优选地，电路化柔性膜半导体芯片载体制造在用于便于处理电路化柔性膜的支撑结构上，并且促进从安装在载体上的半导体芯片到作为电路化基板的一部分的散热器的热传递。 此外，安装在柔性膜芯片载体上的半导体芯片可以在芯片载体之前在芯片载体上被安装在电路化基板上的同时被测试和烧毁。